Heat stable photocurable resin composition for dry film resist
First Claim
1. A process for preparing a dry film resist, which process comprises forming a photocurable resin composition onto a support film with a thickness of 1 to 50 μ
- m and optionally laminate a protective film onto the photocurable composition layer to obtain a dry film resist;
whereby the photocurable resin is formed from a homogeneous mixture comprising (a) from 20-90 wt % of an alkaline soluble binder oligomer or polymer;
(b) from 5 to 60 wt % of one or more photopolymerizable monomers which are compatible with the oligomers and polymers of component (a);
(c) from 0.01 to 20% by weight of one or more photoinitiators;
(d) from 0 to 20% by weight of additives and/or assistants; and
(e) from 0.1 to 10% by weight of a leuco triphenylmethane dye of the formula I wherein R1 is a residue selected from R2 is C1-C12 alkyl or phenyl which may be mono-, di- or tri-substituted by C1-C6 alkyl, trifluoromethyl, C1-6 alkoxy, C1-6 alkylthio, halogen and nitro;
R3 is hydrogen or C1-C12 alkyl;
R4 to R9 independently of one another are hydrogen or C1-C12 alkyl; and
X is O, S, NH or N—
C1-C12-alkyl;
(a) to (e) being 100% by weight.
1 Assignment
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Accused Products
Abstract
6 Citations
10 Claims
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1. A process for preparing a dry film resist, which process comprises forming a photocurable resin composition onto a support film with a thickness of 1 to 50 μ
- m and optionally laminate a protective film onto the photocurable composition layer to obtain a dry film resist;
whereby the photocurable resin is formed from a homogeneous mixture comprising(a) from 20-90 wt % of an alkaline soluble binder oligomer or polymer;
(b) from 5 to 60 wt % of one or more photopolymerizable monomers which are compatible with the oligomers and polymers of component (a);
(c) from 0.01 to 20% by weight of one or more photoinitiators;
(d) from 0 to 20% by weight of additives and/or assistants; and
(e) from 0.1 to 10% by weight of a leuco triphenylmethane dye of the formula I wherein R1 is a residue selected from R2 is C1-C12 alkyl or phenyl which may be mono-, di- or tri-substituted by C1-C6 alkyl, trifluoromethyl, C1-6 alkoxy, C1-6 alkylthio, halogen and nitro;
R3 is hydrogen or C1-C12 alkyl;
R4 to R9 independently of one another are hydrogen or C1-C12 alkyl; and
X is O, S, NH or N—
C1-C12-alkyl;
(a) to (e) being 100% by weight. - View Dependent Claims (2, 3, 4, 5, 6, 7, 9, 10)
- m and optionally laminate a protective film onto the photocurable composition layer to obtain a dry film resist;
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8. (canceled)
Specification