Methods for depositing, releasing and packaging micro-electromechanical devices on wafer substrates
First Claim
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1. A method for making a plurality of spatial light modulator, comprising:
- providing a transparent wafer and a semiconductor wafer;
depositing and patterning sacrificial and structural materials on the transparent wafer or semiconductor wafer to form a plurality of micromirrors within a plurality of rectangular micromirror arrays;
removing the sacrificial material to release the plurality of micromirrors in the plurality of micromirror arrays;
wherein the micromirrors within a rectangular micromirror array of the plurality of micromirror arrays have micromirror edges that are neither parallel nor perpendicular to sides of the rectangular micromirror array;
bonding the transparent wafer and semiconductor wafer together with a spacer layer therebetween so as to form gaps in which the micromirror arrays are each disposed;
wherein the bonding is performed by an application of an adhesive, an application of pressure to press the transparent wafer and semiconductor wafer together; and
a step of curing the adhesive so as to form a wafer assembly; and
singulating the wafer assembly into individual spatial light modulators.
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Abstract
A method for forming a MEMS device is disclosed, where a final release step is performed just prior to a wafer bonding step to protect the MEMS device from contamination, physical contact, or other deleterious external events. Without additional changes to the MEMS structure between release and wafer bonding and singulation, except for an optional stiction treatment, the MEMS device is best protected and overall process flow is improved. The method is applicable to the production of any MEMS device and is particularly beneficial in the making of fragile micromirrors.
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Citations
63 Claims
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1. A method for making a plurality of spatial light modulator, comprising:
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providing a transparent wafer and a semiconductor wafer;
depositing and patterning sacrificial and structural materials on the transparent wafer or semiconductor wafer to form a plurality of micromirrors within a plurality of rectangular micromirror arrays;
removing the sacrificial material to release the plurality of micromirrors in the plurality of micromirror arrays;
wherein the micromirrors within a rectangular micromirror array of the plurality of micromirror arrays have micromirror edges that are neither parallel nor perpendicular to sides of the rectangular micromirror array;
bonding the transparent wafer and semiconductor wafer together with a spacer layer therebetween so as to form gaps in which the micromirror arrays are each disposed;
wherein the bonding is performed by an application of an adhesive, an application of pressure to press the transparent wafer and semiconductor wafer together; and
a step of curing the adhesive so as to form a wafer assembly; and
singulating the wafer assembly into individual spatial light modulators. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10, 11, 12, 13, 14, 15, 16, 17, 18, 19, 20, 21, 22, 23, 24, 25, 26, 27, 28, 29, 30, 31, 32, 33, 34, 35, 36, 37, 38, 39, 40, 41, 42, 43, 44, 45, 46, 47, 48, 49, 50, 51, 52, 53, 54, 55, 56, 57, 58, 59, 60, 61, 62, 63)
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Specification