MOISTURE-RESISTANT ELECTRONIC DEVICE PACKAGE AND METHODS OF ASSEMBLY

• US 20050263312A1
• Filed: 07/13/2005
• Published: 12/01/2005
• Est. Priority Date: 09/16/2003
• Status: Active Grant

• Current Assignee: Cary J. Baerlocher, Chad A. Cobbley, Steven W. Heppler, Todd O. Bolken
• Original Assignee: Cary J. Baerlocher, Chad A. Cobbley, Steven W. Heppler, Todd O. Bolken
• Inventors: Cobbley, Chad A., Bolken, Todd O., Heppler, Steven W., Baerlocher, Cary J.
• Granted Patent: US 7,026,548 B2
• Time in Patent Office: Days
• US Class Current: 174/559
• CPC Class Codes: B33Y 80/00 Products made by additive manufacturing
• CPC Class Codes: H01L 21/4803 Insulating or insulated parts, e.g. mountings, containers, diamond heatsinks H01L21/4846 takes precedence; printed circuit boards H05K1/00
• CPC Class Codes: H01L 21/481 Insulating layers on insulating parts, with or without metallisation
• CPC Class Codes: H01L 21/50 Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
• CPC Class Codes: H01L 2224/0401 Bonding areas specifically adapted for bump connectors, e.g. under bump metallisation [UBM]
• CPC Class Codes: H01L 2224/05599 Material
• CPC Class Codes: H01L 2224/16225 the item being non-metallic, e.g. insulating substrate with or without metallisation
• CPC Class Codes: H01L 2224/16235 the bump connector connecting to a via metallisation of the item
• CPC Class Codes: H01L 2224/32225 the item being non-metallic, e.g. insulating substrate with or without metallisation
• CPC Class Codes: H01L 2224/45099 Material
• CPC Class Codes: H01L 2224/48091 Arched
• CPC Class Codes: H01L 2224/48227 connecting the wire to a bond pad of the item
• CPC Class Codes: H01L 2224/48228 the bond pad being disposed in a recess of the surface of the item
• CPC Class Codes: H01L 2224/484 Connecting portions
• CPC Class Codes: H01L 2224/48997 Reinforcing structures
• CPC Class Codes: H01L 2224/49171 Fan-out arrangements
• CPC Class Codes: H01L 2224/73204 the bump connector being embedded into the layer connector
• CPC Class Codes: H01L 2224/85399 Material
• CPC Class Codes: H01L 2224/8592 Applying permanent coating, e.g. protective coating
• CPC Class Codes: H01L 23/055 the leads having a passage through the base H01L23/057 takes precedence
• CPC Class Codes: H01L 23/10 : characterised by the material or arrangement of seals between parts, e.g. between cap and base of the container or between leads and walls of the container
• CPC Class Codes: H01L 23/28 : Encapsulations, e.g. encapsulating layers, coatings, e.g. for protectionH01L23/552 takes precedence; insulating layers for contacts or interconnections H01L23/5329
• CPC Class Codes: H01L 23/48 : Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
• CPC Class Codes: H01L 23/49861 : Lead-frames fixed on or encapsulated in insulating substrates H01L23/4985, H01L23/49805 take precedence
• CPC Class Codes: H01L 24/48 : of an individual wire connector
• CPC Class Codes: H01L 24/49 : of a plurality of wire connectors
• CPC Class Codes: H01L 27/14618 : Containers
• CPC Class Codes: H01L 27/14683 : Processes or apparatus peculiar to the manufacture or treatment of these devices or parts thereof not peculiar thereto H01L21/00
• CPC Class Codes: H01L 2924/00 : Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/00011 : Not relevant to the scope of the group, the symbol of which is combined with the symbol of this group
• CPC Class Codes: H01L 2924/00014 : the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
• CPC Class Codes: H01L 2924/01005 : Boron [B]
• CPC Class Codes: H01L 2924/01006 : Carbon [C]
• CPC Class Codes: H01L 2924/01013 : Aluminum [Al]
• CPC Class Codes: H01L 2924/01014 : Silicon [Si]
• CPC Class Codes: H01L 2924/01033 : Arsenic [As]
• CPC Class Codes: H01L 2924/01087 : Francium [Fr]
• CPC Class Codes: H01L 2924/014 : Solder alloys
• CPC Class Codes: H01L 2924/09701 : Low temperature co-fired ceramic [LTCC]
• CPC Class Codes: H01L 2924/12042 : LASER
• CPC Class Codes: H01L 2924/15153 : the die mounting substrate comprising a recess for hosting the device
• CPC Class Codes: H01L 2924/15165 : Monolayer substrate
• CPC Class Codes: H01L 2924/16195 : Flat cap [not enclosing an internal cavity]
• CPC Class Codes: H01L 2924/181 : Encapsulation

Abstract

Various embodiments for moisture-resistant image sensor packaging structures and methods of assembly are disclosed. Image sensor packages of the present invention include an interposer, a housing structure formed on the interposer for surrounding an image sensor chip, and a transparent cover. The housing structure may cover substantially all of the interposer chip surface. In another embodiment, the housing structure also covers substantially all of the interposer edge surfaces. The housing structure may also cover substantially all of the interposer attachment surface. An image sensor chip is electrically connected to the interposer with sealed wire bond connections or with sealed flip-chip connections. The housing structure may include runners that enable simultaneous sealing of the interior of the image sensor package and of the transparent cover.

Claims

1. An electronic device package comprising:

a substrate;

a housing structure disposed on the substrate and comprising a plurality of raised sidewalls extending along the perimeter of the substrate defining a cavity in the housing structure;

a ledge on the plurality of raised sidewalls of the housing structure and surrounding the cavity; and

at least one channel disposed within at least one sidewall of the plurality of raised sidewalls and extending from the ledge to a bottom surface of the cavity.

2. The electronic device package of claim 1, wherein the substrate has a first surface, an opposing second surface, and a plurality of edge surfaces extending between the first surface and the second surface around a perimeter of the substrate, and the housing structure covers the plurality of edge surfaces of the substrate.

3. The electronic device package of claim 2, further comprising at least one protrusion extending from at least one edge surface of the plurality of edge surfaces.

4. The electronic device package of claim 3, wherein the at least one protrusion comprises a tie bar extending perpendicularly from the at least one edge surface.

5. The electronic device package of claim 4, wherein the tie bar is connected to another substrate of another electronic device package.

6. The electronic device package of claim 1, further comprising:

at least one contact pad on a first surface of the substrate;

at least one attachment pad on an opposing second surface of the substrate; and

at least one conductive element electrically connecting the at least one contact pad and the at least one attachment pad.

7. The electronic device package of claim 6, wherein the housing structure covers substantially all of the second surface of the substrate and includes at least one aperture exposing the at least one attachment pad through the housing structure.

8. The electronic device package of claim 1, wherein the housing structure comprises one of a mold compound, an epoxy, and a photocurable polymer or resin.

9. The electronic device package of claim 6, wherein the at least one contact pad comprises a plurality of contact pads and the at least one aperture in the bottom surface of the cavity comprises a plurality of apertures, each aperture of the plurality of apertures exposing a single contact pad of the plurality of contact pads.

10. The electronic device package of claim 1, further comprising an electronic device sensitive to light or other radiation mounted within the cavity of the housing structure and having at least one bond pad.

12. The electronic device package of claim 1, further comprising a sealant material substantially filling the at least one channel.

13. The electronic device package of claim 1, further comprising a sealing well comprising a notch in the housing structure adjacent to a junction of the ledge and the at least one channel, the sealing well in fluid communication with the channel.

14. The electronic device package of claim 13, further comprising a transparent cover supported by the ledge and covering the cavity.

15. The electronic device package of claim 14, further comprising a sealant material adhesively bonding the transparent cover to the housing structure and covering the bottom surface of the cavity.

16. A method of forming an electronic device package comprising:

providing a substrate;

forming a housing structure including sidewalls defining a cavity on the substrate;

forming a ledge within the sidewalls, the ledge surrounding the cavity;

forming at least one channel extending from the ledge to a bottom of the cavity

mounting an electronic device sensitive to light or other radiation within the cavity;

covering the cavity with a transparent cover supported by the ledge;

injecting a sealant material into the at least one channel to simultaneously adhesively bond the transparent cover to the housing structure and cover at least a portion of the bottom surface of the cavity;

11. The electronic device package of claim 16, further comprising a sealing material filling a gap between the electronic device and the bottom surface of the cavity.

17. The method of claim 16, further comprising forming the housing structure from a mold compound.

18. The method of claim 16, further comprising mounting an electronic device sensitive to light or other radiation within the cavity.

19. The method of claim 16, wherein injecting a sealant material into the at least one channel comprises injecting the sealant material into a sealant well comprising a notch adjacent to a junction of the ledge and the at least one channel.

20. The method of claim 16, further comprising applying a vacuum to the cavity.