Heat sink assembly

• US 20050264998A1
• Filed: 05/25/2004
• Published: 12/01/2005
• Est. Priority Date: 05/25/2004
• Status: Abandoned Application

• Current Assignee: 3M Innovative Properties Company (3M Company)
• Original Assignee: 3M Innovative Properties Company (3M Company)
• Inventors: Ruffing, Sharon L., McCutcheon, Jeffrey W.
• Application Number:
  US10/852,780
• Publication Number:
  US 20050264998A1
• Time in Patent Office: Days
• US Class Current: 361/702
• CPC Class Codes: H01L 2023/4031 Packaged discrete devices, e.g. to-3 housings, diodes
• CPC Class Codes: H01L 2023/405 heatsink to package
• CPC Class Codes: H01L 2023/4068 Heatconductors between device and heatsink, e.g. compliant heat-spreaders, heat-conducting bands
• CPC Class Codes: H01L 2023/4081 Compliant clamping elements not primarily serving heat-conduction
• CPC Class Codes: H01L 23/4006 with bolts or screws
• CPC Class Codes: H01L 23/4093 Snap-on arrangements, e.g. clips
• CPC Class Codes: H01L 2924/00 Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/0002 Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Abstract

Heat sink apparatuses comprising a heat sink and a mounting fixture attached to the heat sink are provided. The mounting fixture is selected from the group consisting of dentate mounting fixtures, fenestrated mounting fixtures, and cavitated mounting fixtures. Also provided are heat sink assemblies including devices attached to heat sink apparatuses, methods of mounting devices to heat sink assemblies, and methods of making heat sink apparatuses.

Claims

1. A heat sink apparatus comprising

a heat sink having a mounting surface;

and

a mounting fixture attached to the heat sink, wherein the mounting fixture is selected from the group consisting of a dentate mounting fixture, a fenestrated mounting fixture, and a cavitated mounting fixture.

2. The heat sink apparatus of claim 1, further comprising an adhesive member comprising a first surface and a second surface, wherein the first surface of the adhesive member is adhered to the mounting surface of the heat sink and the mounting fixture is adhered to at least a portion of the second surface of the adhesive member.

3. The heat sink apparatus of claim 2, wherein the adhesive member comprises a thermally conductive adhesive.

4. The heat sink apparatus of claim 1, wherein at least one of the heat sink and the mounting fixture further comprises a structural restraining feature.

5. The heat sink apparatus of claim 4, wherein the structural restraining feature is selected from the group consisting of posts, holes, flanges, lips, openings, tabs, clips, and combinations thereof.

6. The heat sink apparatus of claim 1, further comprising single-sided tape adhered to the heat sink and the mounting fixture.

7. The heat sink apparatus of claim 1, wherein the mounting fixture is a dentate mounting fixture comprising a bridge, a tooth, and a gap.

8. The heat sink apparatus of claim 7, further comprising a thermally conductive material positioned within the gap.

9. The heat sink apparatus of claim 8, wherein at least a portion of the mounting fixture is adhered to the thermally conductive material.

10. The heat sink apparatus of claim 7, further comprising an adhesive member comprising a first surface and a second surface, wherein the first surface of the adhesive member is adhered to the mounting surface of the heat sink and the mounting fixture is adhered to at least a portion of the second surface of the adhesive member.

11. The heat sink apparatus of claim 1, wherein the mounting fixture is a fenestrated mounting fixture comprising a window, a rail, and a stile.

12. The heat sink apparatus of claim 11, further comprising a thermally conductive material positioned within the window.

13. The heat sink apparatus of claim 12, wherein at least a portion of the mounting fixture is adhered to the thermally conductive material.

14. The heat sink apparatus of claim 11, further comprising an adhesive member comprising a first surface and a second surface, wherein the first surface of the adhesive member is adhered to the mounting surface of the heat sink and the mounting fixture is adhered to at least a portion of the second surface of the adhesive member.

15. The heat sink apparatus of claim 1, wherein the mounting fixture is a cavitated mounting fixture comprising a cavity.

16. The heat sink apparatus of claim 15, further comprising a thermally conductive material positioned within the cavity.

17. The heat sink apparatus of claim 16, wherein at least a portion of the mounting fixture is adhered to the thermally conductive material.

18. The heat sink apparatus of claim 15, further comprising an adhesive member comprising a first surface and a second surface, wherein the first surface of the adhesive member is adhered to the mounting surface of the heat sink and the mounting fixture is adhered to at least a portion of the second surface of the adhesive member.

19. The heat sink apparatus of claim 15, wherein the cavitated mounting fixture further comprises a pressure-invertible dimple.

20. A heat sink assembly comprising the heat sink apparatus of claim 1 and a device attached to the heat sink.

21. The heat sink assembly of claim 20 further comprising an adhesive member comprising a first surface and a second surface, wherein the first surface of the adhesive member is adhered to the mounting surface of the heat sink and the mounting fixture is adhered to at least a portion of the second surface of the adhesive member.

22. The heat sink assembly of claim 21, wherein the device is adhered at least a portion of the second surface of the adhesive member.

23. The heat sink assembly of claim 20, wherein the mounting fixture comprises a dentate mounting fixture comprising a gap, a tooth, and a bridge.

24. The heat sink assembly of claim 23, wherein the device is positioned within the gap and aligned with at least one of the tooth and the bridge.

25. The heat sink assembly of claim 23, wherein a thermally conductive member is positioned within the gap.

26. The heat sink assembly of claim 25, wherein the thermally conductive member is adhered to the heat sink and the device is adhered to the thermally conductive member.

27. The heat sink assembly of claim 20, wherein the mounting fixture comprises a fenestrated mounting fixture comprising a window, a rail, and a stile.

28. The heat sink assembly of claim 27, wherein the device is positioned within the window and aligned with at least one of the rail and the stile.

29. The heat sink assembly of claim 27, wherein a thermally conductive member is positioned within the window.

30. The heat sink assembly of claim 29, wherein the thermally conductive member is adhered to the heat sink and the device is adhered to the thermally conductive member.

31. The heat sink assembly of claim 20, wherein the mounting fixture comprises a cavitated mounting fixture comprising a cavity.

32. The heat sink assembly of claim 31, wherein the electrical device is positioned within the cavity.

33. The heat sink assembly of claim 31, wherein a thermally conductive member is positioned within the cavity.

34. The heat sink assembly of claim 33, wherein the thermally conductive member is adhered to the heat sink and the device is adhered to the thermally conductive member.

35. A heat sink assembly of claim 31, wherein the cavitated mounting fixture further comprises a pressure-invertible dimple.

36. The heat sink assembly of claim 20, wherein the device comprises a component selected from the group consisting of an integrated circuit, capacitor, power amplifier, power transistor device, FETS, and MOSFETS.

37. The heat sink assembly of claim 20, further comprising a substrate, wherein the device is attached to the substrate.

38. The heat sink assembly of claim 37, wherein the substrate is a printed circuit board.

39. A method of mounting a device to a heat sink comprising

providing the heat sink apparatus of claim 7;

positioning the device within the gap;

aligning the device with at least one of the tooth or the bridge; and

adhering the device to the heat sink apparatus.

40. A method of mounting a device to a heat sink comprising

providing the heat sink apparatus of claim 11;

positioning the device within the window;

aligning the device with at least one of the rail or the stile; and

adhering the device to the heat sink apparatus.

41. A method of mounting a device to a heat sink comprising

providing the heat sink apparatus of claim 15;

positioning the device within the cavity; and

adhering the device to the heat sink apparatus.

42. A method of mounting a device to a heat sink comprising

providing the heat sink apparatus of claim 19;

positioning the device within the cavity; and

inverting the pressure-invertible dimple.

43. A method of making a heat sink apparatus comprising

providing a heat sink;

attaching at least one mounting fixture selected from the group consisting of a dentate mounting fixture, a fenestrated mounting fixture, and a cavitated mounting fixture to the heat sink.

44. The method of claim 43, wherein attaching the at least one mounting fixture to the heat sink comprises adhering the mounting fixture to a surface of the heat sink.

45. The method of claim 43, wherein attaching the at least one mounting fixture to the heat sink comprises applying at least one piece of single-sided tape to both the mounting fixture and the heat sink.

46. The method of claim 43, wherein attaching the at least one mounting fixture to the heat sink comprises engaging corresponding structural restraining features on the heat sink and the mounting fixture.

47. The method of claim 43, further comprising wrapping a portion of the at least one mounting fixture around an edge of the heat sink.

48. A method of making a heat sink apparatus comprising attaching a mounting fixture and at least one device to an adhesive member and attaching the adhesive member to a heat sink.