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Aperiodic dielectric multilayer stack

  • US 20050266218A1
  • Filed: 06/01/2004
  • Published: 12/01/2005
  • Est. Priority Date: 06/01/2004
  • Status: Active Grant
First Claim
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1. A structure, comprising:

  • a substrate;

    a device disposed over the substrate; and

    a first dielectric stack disposed between the substrate and the device, wherein the first dielectric stack further comprises;

    a plurality of layers comprising a first dielectric material, wherein at least two of the layers comprising a first dielectric material have substantially different thicknesses;

    a plurality of layers comprising a second dielectric material;

    wherein the average outcoupling efficiency into air of the device over a bandwidth of at least 300 nm is at least 40% greater than that of an otherwise identical device disposed in a structure without the first dielectric stack.

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