Module with multiple power amplifiers and power sensors

• US 20050266617A1
• Filed: 07/02/2005
• Published: 12/01/2005
• Est. Priority Date: 03/18/2004
• Status: Active Grant

• Current Assignee: Micro Mobio Corporation
• Original Assignee: Micro Mobio Corporation
• Inventors: Wang, Weiping, Ichitsubo, Ikuroh, Wang, Guan-Wu
• Granted Patent: US 7,741,710 B2
• Time in Patent Office: Days
• US Class Current: 438/123
• CPC Class Codes: H01L 2224/05554 being square
• CPC Class Codes: H01L 2224/45015 being circular
• CPC Class Codes: H01L 2224/45124 Aluminium (Al) as principal constituent
• CPC Class Codes: H01L 2224/45144 Gold (Au) as principal constituent
• CPC Class Codes: H01L 2224/48137 the bodies being arranged next to each other, e.g. on a common substrate
• CPC Class Codes: H01L 2224/49171 Fan-out arrangements
• CPC Class Codes: H01L 2224/49175 Parallel arrangements
• CPC Class Codes: H01L 23/16 Fillings or auxiliary members in containers or encapsulations, e.g. centering rings H01L23/42, H01L23/552 take precedence
• CPC Class Codes: H01L 24/45 of an individual wire connector
• CPC Class Codes: H01L 24/48 of an individual wire connector
• CPC Class Codes: H01L 24/49 of a plurality of wire connectors
• CPC Class Codes: H01L 25/0655 the devices being arranged next to each other
• CPC Class Codes: H01L 25/18 the devices being of types provided for in two or more different subgroups of the same main group of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N
• CPC Class Codes: H01L 2924/00 Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/00014 the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
• CPC Class Codes: H01L 2924/01079 Gold [Au]
• CPC Class Codes: H01L 2924/09701 Low temperature co-fired ceramic [LTCC]
• CPC Class Codes: H01L 2924/1305 Bipolar Junction Transistor [BJT]
• CPC Class Codes: H01L 2924/14 Integrated circuits
• CPC Class Codes: H01L 2924/19041 being a capacitor
• CPC Class Codes: H01L 2924/207 : Diameter ranges
• CPC Class Codes: H01L 2924/3011 : Impedance

Abstract

Systems and methods are disclosed for a device having one or more power amplifier and/or LNA circuits positioned on the amplifier module.

Claims

1. A power amplifier module for amplifying radio frequency signals, comprising:

one or more power amplifier circuits positioned on the power amplifier module, each power amplifier having an input coupled to one radio frequency input pad and an output coupled to one radio frequency output pad; and

one or more power sensors coupled respectively to the one or more power amplifier circuits.

2. The module of claim 1, comprising one or more matched radio frequency (RF) inputs and one or more matched RF outputs.

3. The module of claim 1, comprising one or more low noise amplifiers (LNAs).

4. The module of claim 1, wherein the impedance of an external circuit that provides the input radio frequency signal is matched by an input impedance matching circuit.

5. The module of claim 1, wherein the impedance of an external circuit that receives the amplified radio frequency signal is matched by an output impedance matching circuit.

6. The module of claim 1, further comprising a die pad to receive the active and passive substrates.

7. The module of claim 2, further comprising one or more pins and wherein one or more of the bonding wires connect one or more bonding pads to the one or more pins.

8. The module of claim 1, wherein the substrates comprise gallium arsenide substrates.

9. The module of claim 1, wherein the active substrate comprises supporting passive components.

10. The module of claim 1, wherein the substrates are interconnected with bonding wires.

11. The module of claim 1, wherein the substrates are mounted on a metal die pad.

12. The module of claim 1, wherein the power amplifier module is encapsulated in a plastic package with dimensions of about 4 millimeters in length, about 4 millimeters in width and about 1 millimeter in height.

13. The module of claim 1, comprising a substrate being one of:

a lead frame, a low-temperature co-fired ceramic (LTCC) material, a printed circuit board.

14. The module of claim 1, wherein the radio frequency is between about 2.4 GHz to about 2.5 GHz.

15. The module of claim 1, wherein the radio frequency is between about 5 GHz to about 6 GHz.

16. A wireless communication device for transmitting and receiving radio frequency signals, comprising:

one or more low noise amplifier (LNA) circuits positioned on the power amplifier module, each power amplifier having an output coupled to one radio frequency output pad; and

one or more bias circuits coupled respectively to the one or more LNA circuits.

17. The device of claim 16, further comprising a die pad to receive active and passive substrates.

18. The device of claim 17, further comprising a substantially passive IC coupled to the active substrate.

19. The device of claim 16, further comprising one or more substantially passive ICs for passive components only.

20. The device of claim 17, wherein the substrates are interconnected with bonding wires.