Holder for wafers

• US 20050266781A1
• Filed: 05/16/2005
• Published: 12/01/2005
• Est. Priority Date: 05/14/2004
• Status: Active Grant

• Current Assignee: TTP Labtech Limited
• Original Assignee: TTP Labtech Limited
• Inventors: Jaenen, Jean-Paul, Van Gerwen, Peter
• Granted Patent: US 7,223,162 B2
• Time in Patent Office: Days
• US Class Current: 451/364
• CPC Class Codes: G03F 7/707 Chucks, e.g. chucking or un-chucking operations or structural details
• CPC Class Codes: H01L 21/67051 using mainly spraying means, e.g. nozzles
• CPC Class Codes: H01L 21/68 for positioning, orientation or alignment
• CPC Class Codes: H01L 21/68714 the wafers being placed on a susceptor, stage or support
• CPC Class Codes: Y10S 269/90 Supporting structure having work holder receiving apertures or projections
• CPC Class Codes: Y10S 269/903 Work holder for electrical circuit assemblages or wiring systems

Abstract

The present invention provides a holder (20) for wafers (14) which makes it possible to more easily manipulate the wafer (14) and makes it more suitable than prior art devices for to liquid handling, wafer handling and on-wafer manipulation of substances, while it also makes it possible to align the wafer (14) accurately and furthermore allows to create a well controlled ambient in the neighbourhood of the wafer (14).

Claims

1. A holder for a wafer, the holder comprising at least one of:

At least one holes or guide-way to allow for electrical contacting between read-out and control electronics and the wafer,

A first alignment system to precisely align the wafer in the holder,

At least one release opening for taking the wafer out of the holder,

At least one gas inlet to control ambient gas composition and/or humidity in the neighbourhood of the wafer,

At least one thermally insulating cavity,

At least one insulating layer for thermal insulation, thermal heat sinking, electrical shielding, gas tightness and/or liquid tightness,

At least one hole for dispensing liquids onto the wafer,

At least one opening/closing means to open or close the at least one hole,

A second alignment system to precisely position the holder in a reader, and

A guiding system to position the wafer in the holder.

2. A holder according to claim 1, wherein the holder comprises at least a bottom part, an intermediate part and a top part.

3. A holder according to claim 2, wherein the bottom part comprises a recess for holding a wafer.

4. A holder according to claim 3, wherein the recess is substantially circular in shape.

5. A holder according to claim 3, wherein the recess is provided with release openings.

6. A holder according to claim 5, wherein the release openings are cavities for manually lifting of the wafer.

7. A holder according to claim 5, wherein the release openings are holes for automatic removal of the wafer.

8. A holder according to claim 2, wherein a first thermally insulating cavity is formed in the bottom part of the holder.

9. A holder according to claim 2, wherein a second thermally insulating cavity is formed in the middle part of the holder.

10. A holder according to claim 2, wherein the at least one hole for dispensing liquids onto the wafer is formed in the top part of the holder.

11. A holder according to claim 10, the holder comprising a plurality of holes for dispensing liquids onto a wafer, wherein the holes are provided as an array of holes.

12. A holder according to claim 2, the bottom part having a centre, wherein the first alignment system is positioned away from the centre.

13. A holder according to claim 1, wherein the first alignment system comprises pins or holes.

14. A holder according to claim 1, wherein the holder comprises any or a combination of a first layer for thermal insulation, a second layer for electrical shielding, a third layer for gas tightness and/or a fourth layer for liquid tightness.

15. A holder according to claim 14, wherein the first layer is formed of plastic, the second layer is formed of copper, the third layer is formed of rubber and/or the fourth layer is formed of rubber.

16. A holder according to claim 1, wherein the second alignment system comprises holes, pins or slits.

17. A holder according to claim 1, wherein the at least one opening/closing means can take a first and a second position, the first position corresponding to a closed condition of the at least one hole and the second position corresponding to an open condition of the at least one hole, the opening/closing means furthermore being provided with a resilience means for keeping the opening/closing means in the first position.

18. A holder according to claim 17, a wafer lying in a first plane when present in the holder, wherein the opening/closing means has a shape adapted to move the opening/closing means towards its second position under influence of a force perpendicular to the first plane of the wafer.

19. A holder according to claim 18, wherein the opening/closing means has a slanted shape.