Process module tuning
First Claim
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1. A method of characterizing a process module having a plurality of process inputs that affect a process condition, using a process condition measuring device having a plurality of sensors that measure the process condition, comprising:
- placing the process condition measuring device in the process module;
providing a first excitation to at least a first process input and providing a second excitation to at least a second process input, while recording the output of the plurality of sensors; and
using the recorded output of the plurality of sensors to develop a model of relationships between the process condition and the plurality of process inputs, including a first relationship between the process condition at a first sensor and the first process input and a second relationship between the process condition at the first sensor and the second process input.
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Abstract
A process module tuning method characterizes a process module by gathering data using a process condition measuring device to measure process outputs while inputs are excited. The data is used to identify a dynamic process model. The dynamic process model is then be used to determine process input settings that will produce desired outputs. For multi-zone process modules, the interactions between zones may be modeled.
90 Citations
20 Claims
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1. A method of characterizing a process module having a plurality of process inputs that affect a process condition, using a process condition measuring device having a plurality of sensors that measure the process condition, comprising:
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placing the process condition measuring device in the process module;
providing a first excitation to at least a first process input and providing a second excitation to at least a second process input, while recording the output of the plurality of sensors; and
using the recorded output of the plurality of sensors to develop a model of relationships between the process condition and the plurality of process inputs, including a first relationship between the process condition at a first sensor and the first process input and a second relationship between the process condition at the first sensor and the second process input. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10, 11, 12)
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13. An apparatus for characterizing a process module that has a plurality of controlled process inputs that affect a process condition of the process module, comprising:
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a process condition measuring device having a plurality of sensors that measure the process condition at a plurality of locations; and
a modeling unit that receives process condition data from the process condition measuring device and generates a model of a set of relationships between the plurality of controlled process inputs and the process condition at the plurality of sensors including a first relationship between a first process input and the process condition at a sensor and a second relationship between a second process input and the process condition at the sensor. - View Dependent Claims (14, 15)
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16. A method of determining an operating parameter value for a controller of a hotplate having a plurality of heating zones, individual heating zones having a heating element that outputs power and a hot-plate-temperature sensor that measures a heating zone temperature, the output power determined by the controller in response to the heating zone temperature according to a plurality of operating parameters, using a process condition measuring device that has a plurality of wafer-temperature sensors, comprising:
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placing the process condition measuring device on the hot-plate such that a first wafer-temperature sensor of the plurality of wafer-temperature sensors is proximate to a first heating zone;
powering the heating elements of the plurality of heating zones while recording the temperatures of the plurality of wafer-temperature sensors;
using the recorded temperatures of the plurality of wafer-temperature sensors to develop a model of the temperatures of the plurality of wafer-temperature sensors and the heating zone temperatures of the plurality of heating zones including the relationship between the temperature of the first wafer-temperature sensor and the heating zone temperature of a second heating zone; and
deriving an operating parameter value for the controller from the model. - View Dependent Claims (17, 18, 19, 20)
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Specification