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Surface treatment method and surface treatment device

  • US 20050269577A1
  • Filed: 06/07/2005
  • Published: 12/08/2005
  • Est. Priority Date: 06/08/2004
  • Status: Abandoned Application
First Claim
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1. A surface treatment method for planarizing a surface of a substrate, comprising planarizing of the surface of the substrate by performing etching of the surface using an electrolyte containing fine metal particles in a way that the surface is brought into contact with the electrolyte.

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