Component built-in module and method for producing the same

• US 20050269681A1
• Filed: 05/10/2005
• Published: 12/08/2005
• Est. Priority Date: 10/18/2001
• Status: Active Grant

• Current Assignee: Adeia Semiconductor Advanced Technologies Inc. (f/k/a Tessera Advanced Technologies, Inc.) (Adeia Inc.)
• Original Assignee: Matsushita Electric Industrial Company Limited (Panasonic Holdings Corporation)
• Inventors: Komatsu, Shingo, Nakatani, Seiichi, Asahi, Toshiyuki, Sugaya, Yasuhiro, Yamamoto, Yoshiyuki
• Granted Patent: US 7,294,587 B2
• Time in Patent Office: Days
• US Class Current: 257/686
• CPC Class Codes: H01L 21/6835 using temporarily an auxiliary support
• CPC Class Codes: H01L 2221/68345 used as a support during the manufacture of self supporting substrates
• CPC Class Codes: H01L 2224/16225 the item being non-metallic, e.g. insulating substrate with or without metallisation
• CPC Class Codes: H01L 2224/2402 Laminated, e.g. MCM-L type
• CPC Class Codes: H01L 2224/24226 the HDI interconnect connecting to the same level of the item at which the semiconductor or solid-state body is mounted, e.g. the item being planar
• CPC Class Codes: H01L 2224/29075 Plural core members
• CPC Class Codes: H01L 2224/2929 with a principal constituent of the material being a polymer, e.g. polyester, phenolic based polymer, epoxy
• CPC Class Codes: H01L 2224/293 with a principal constituent of the material being a metal or a metalloid, e.g. boron [B], silicon [Si], germanium [Ge], arsenic [As], antimony [Sb], tellurium [Te] and polonium [Po], and alloys thereof
• CPC Class Codes: H01L 2224/32225 the item being non-metallic, e.g. insulating substrate with or without metallisation
• CPC Class Codes: H01L 2224/73204 the bump connector being embedded into the layer connector
• CPC Class Codes: H01L 2224/8121 using a reflow oven
• CPC Class Codes: H01L 2224/81815 Reflow soldering
• CPC Class Codes: H01L 2224/82047 by mechanical means, e.g. severing, pressing, stamping
• CPC Class Codes: H01L 2224/83801 Soldering or alloying
• CPC Class Codes: H01L 2224/83851 being an anisotropic conductive adhesive
• CPC Class Codes: H01L 23/5389 the chips being integrally enclosed by the interconnect and support structures
• CPC Class Codes: H01L 23/552 Protection against radiation, e.g. light or electromagnetic waves
• CPC Class Codes: H01L 24/24 of an individual high density interconnect connector
• CPC Class Codes: H01L 24/81 using a bump connector
• CPC Class Codes: H01L 24/82 by forming build-up interconnects at chip-level, e.g. for high density interconnects [HDI] interconnection structure between a plurality of semiconductor chips H01L23/5389
• CPC Class Codes: H01L 24/83 : using a layer connector
• CPC Class Codes: H01L 25/0652 : the devices being arranged next and on each other, i.e. mixed assemblies
• CPC Class Codes: H01L 25/16 : the devices being of types provided for in two or more different main groups of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. forming hybrid circuits
• CPC Class Codes: H01L 25/50 : Multistep manufacturing processes of assemblies consisting of devices, each device being of a type provided for in group H01L27/00 or H01L29/00 H01L21/50 takes precedence
• CPC Class Codes: H01L 2924/00 : Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/00011 : Not relevant to the scope of the group, the symbol of which is combined with the symbol of this group
• CPC Class Codes: H01L 2924/01004 : Beryllium [Be]
• CPC Class Codes: H01L 2924/01005 : Boron [B]
• CPC Class Codes: H01L 2924/01006 : Carbon [C]
• CPC Class Codes: H01L 2924/01009 : Fluorine [F]
• CPC Class Codes: H01L 2924/01012 : Magnesium [Mg]
• CPC Class Codes: H01L 2924/01013 : Aluminum [Al]
• CPC Class Codes: H01L 2924/01029 : Copper [Cu]
• CPC Class Codes: H01L 2924/01033 : Arsenic [As]
• CPC Class Codes: H01L 2924/01039 : Yttrium [Y]
• CPC Class Codes: H01L 2924/01046 : Palladium [Pd]
• CPC Class Codes: H01L 2924/01047 : Silver [Ag]
• CPC Class Codes: H01L 2924/01075 : Rhenium [Re]
• CPC Class Codes: H01L 2924/01078 : Platinum [Pt]
• CPC Class Codes: H01L 2924/01079 : Gold [Au]
• CPC Class Codes: H01L 2924/01082 : Lead [Pb]
• CPC Class Codes: H01L 2924/014 : Solder alloys
• CPC Class Codes: H01L 2924/09701 : Low temperature co-fired ceramic [LTCC]
• CPC Class Codes: H01L 2924/12042 : LASER
• CPC Class Codes: H01L 2924/15787 : Ceramics, e.g. crystalline carbides, nitrides or oxides
• CPC Class Codes: H01L 2924/19041 : being a capacitor
• CPC Class Codes: H01L 2924/19042 : being an inductor
• CPC Class Codes: H01L 2924/19043 : being a resistor
• CPC Class Codes: H01L 2924/19105 : in a side-by-side arrangement on a common die mounting substrate
• CPC Class Codes: H01L 2924/30105 : Capacitance
• CPC Class Codes: H01L 2924/30107 : Inductance
• CPC Class Codes: H01L 2924/3025 : Electromagnetic shielding
• CPC Class Codes: H05K 1/186 : manufactured by mounting on or connecting to patterned circuits before or during embedding
• CPC Class Codes: H05K 2201/10378 : Interposers
• CPC Class Codes: H05K 2201/10636 : Leadless chip, e.g. chip capacitor or resistor
• CPC Class Codes: H05K 2203/061 : of previously made multilayered subassemblies laminating only or mainly similar single-sided circuit boards H05K3/4617; laminating only or mainly similar double-sided circuit boards H05K3/462
• CPC Class Codes: H05K 3/20 : by affixing prefabricated conductor pattern H05K1/187, H05K3/046, H05K3/4658, H05K3/4682 takes precedence
• CPC Class Codes: H05K 3/4069 : for via connections in organic insulating substrates
• CPC Class Codes: H05K 3/4602 : characterized by a special circuit board as base or central core whereon additional circuit layers are built or additional circuit boards are laminated
• CPC Class Codes: H05K 3/4652 : Adding a circuit layer by laminating a metal foil or a preformed metal foil pattern H05K3/4647 takes precedence
• CPC Class Codes: Y02P 70/50 : Manufacturing or production processes characterised by the final manufactured product

Abstract

A component built-in module includes an insulating layer, wirings integrated with both surfaces of the insulating layer, a via connecting the wirings, and one or more components selected from an electronic component and a semiconductor, which is embedded inside of the insulating layer. In this module, at least one of the wirings is formed on a surface of a wiring board, and the components embedded inside of the insulating layer are mounted on and integrated with the wiring board before embedding. This configuration allows the components such as a semiconductor to undergo a mounting inspection and a property inspection before embedding. As a result, the yields of the module can be improved. In addition, since the components are integrated with the wiring board and embedded, the strength thereof can be enhanced.

Claims

1-14. -14. (canceled)

15. A method of producing a component built-in module including an insulating layer, wirings integrated with both surfaces of the insulating layer, a via connecting the wirings, and one or more components selected from an electronic component and a semiconductor, which is embedded inside of the insulating layer, wherein at least one of the wirings is formed on a surface of a wiring board, comprising the steps of:

mounting the one or more components selected from an electronic component and a semiconductor on the wiring board;

forming the via along a thickness direction of the insulating layer, where the insulating layer is made of a thermosetting resin in a semi-cured state;

embedding the components in the insulating layer so that the wiring board is arranged outside; and

curing the insulating layer.

16. The method of producing a component built-in module according to claim 15, wherein the components have undergone at least one inspection selected from a mounting inspection and a property inspection before the step of embedding the components in the insulating layer.

17. The method of producing a component built-in module according to claim 15, wherein the wiring board is integrated on either surface of the insulating layer.

18. The method of producing a component built-in module according to claim 15, wherein the components are mounted on both surfaces of the at least one wiring board.

19. The method of producing a component built-in module according to claim 15, wherein a shielding layer is formed in the insulating layer after the step of forming the via and before the step of embedding the components.

20. The method of producing a component built-in module according to claim 19, wherein the shielding layer is formed by forming a wiring pattern of copper foil.

21. The method of producing a component built-in module according to claim 19, wherein the shielding layer is formed by laminating electromagnetic shielding layers.

22. The method of producing a component built-in module according to claim 15, wherein the semiconductor is ground or polished when the semiconductor is in a semiconductor wafer state before mounting.

23. The method of producing a component built-in module according to claim 15, wherein the semiconductor is ground or polished after mounting the semiconductor.

24. The method of producing a component built-in module according to claim 15, wherein concurrently with the step of embedding one or more components selected from a semiconductor and a electronic component in the insulating layer, the insulating layer is cured.