Ribbon bonding in an electronic package

• US 20050269694A1
• Filed: 07/29/2005
• Published: 12/08/2005
• Est. Priority Date: 05/02/2003
• Status: Abandoned Application

• Current Assignee: Christoph B. Luechinger
• Original Assignee: Christoph B. Luechinger
• Inventors: Luechinger, Christoph B.
• Application Number:
  US11/192,768
• Publication Number:
  US 20050269694A1
• Time in Patent Office: Days
• US Class Current: 257/724
• CPC Class Codes: B23K 20/008 pressure combined with radiant energy
• CPC Class Codes: B23K 2101/32 Wires
• CPC Class Codes: B23K 2101/38 Conductors
• CPC Class Codes: H01L 2224/05624 Aluminium [Al] as principal constituent
• CPC Class Codes: H01L 2224/291 with a principal constituent of the material being a metal or a metalloid, e.g. boron [B], silicon [Si], germanium [Ge], arsenic [As], antimony [Sb], tellurium [Te] and polonium [Po], and alloys thereof
• CPC Class Codes: H01L 2224/2919 with a principal constituent of the material being a polymer, e.g. polyester, phenolic based polymer, epoxy
• CPC Class Codes: H01L 2224/43848 Thermal treatments, e.g. annealing, controlled cooling
• CPC Class Codes: H01L 2224/45014 Ribbon connectors, e.g. rectangular cross-section
• CPC Class Codes: H01L 2224/45015 being circular
• CPC Class Codes: H01L 2224/45032 Two-layer arrangements
• CPC Class Codes: H01L 2224/45033 Three-layer arrangements
• CPC Class Codes: H01L 2224/45124 Aluminium (Al) as principal constituent
• CPC Class Codes: H01L 2224/45139 Silver (Ag) as principal constituent
• CPC Class Codes: H01L 2224/45144 Gold (Au) as principal constituent
• CPC Class Codes: H01L 2224/45147 Copper (Cu) as principal constituent
• CPC Class Codes: H01L 2224/4554 Coating
• CPC Class Codes: H01L 2224/45565 Single coating layer
• CPC Class Codes: H01L 2224/45624 Aluminium (Al) as principal constituent
• CPC Class Codes: H01L 2224/45639 Silver (Ag) as principal constituent
• CPC Class Codes: H01L 2224/45644 Gold (Au) as principal constituent
• CPC Class Codes: H01L 2224/45647 : Copper (Cu) as principal constituent
• CPC Class Codes: H01L 2224/45655 : Nickel (Ni) as principal constituent
• CPC Class Codes: H01L 2224/48091 : Arched
• CPC Class Codes: H01L 2224/48137 : the bodies being arranged next to each other, e.g. on a common substrate
• CPC Class Codes: H01L 2224/48247 : connecting the wire to a bond pad of the item
• CPC Class Codes: H01L 2224/4846 : with multiple bonds on the same bonding area
• CPC Class Codes: H01L 2224/48472 : the other connecting portion not on the bonding area also being a wedge bond, i.e. wedge-to-wedge
• CPC Class Codes: H01L 2224/48624 : Aluminium (Al) as principal constituent
• CPC Class Codes: H01L 2224/48724 : Aluminium (Al) as principal constituent
• CPC Class Codes: H01L 2224/48824 : Aluminium (Al) as principal constituent
• CPC Class Codes: H01L 2224/49175 : Parallel arrangements
• CPC Class Codes: H01L 2224/78 : Apparatus for connecting with wire connectors
• CPC Class Codes: H01L 2224/78316 : comprising protrusions
• CPC Class Codes: H01L 2224/85181 : connecting first on the semiconductor or solid-state body, i.e. on-chip, regular stitch
• CPC Class Codes: H01L 2224/85203 : Thermocompression bonding
• CPC Class Codes: H01L 2224/85205 : Ultrasonic bonding
• CPC Class Codes: H01L 2224/85207 : Thermosonic bonding
• CPC Class Codes: H01L 23/4952 : the additional leads being a bump or a wire
• CPC Class Codes: H01L 23/498 : Leads, i.e. metallisations or lead-frames on insulating substrates, e.g. chip carriers shape of the substrate H01L23/13
• CPC Class Codes: H01L 24/29 : of an individual layer connector
• CPC Class Codes: H01L 24/45 : of an individual wire connector
• CPC Class Codes: H01L 24/48 : of an individual wire connector
• CPC Class Codes: H01L 24/49 : of a plurality of wire connectors
• CPC Class Codes: H01L 24/78 : Apparatus for connecting with wire connectors
• CPC Class Codes: H01L 24/85 : using a wire connector wire bonding in general B23K20/004
• CPC Class Codes: H01L 2924/00 : Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/00011 : Not relevant to the scope of the group, the symbol of which is combined with the symbol of this group
• CPC Class Codes: H01L 2924/00014 : the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
• CPC Class Codes: H01L 2924/00015 : the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed as prior art
• CPC Class Codes: H01L 2924/01005 : Boron [B]
• CPC Class Codes: H01L 2924/01006 : Carbon [C]
• CPC Class Codes: H01L 2924/01013 : Aluminum [Al]
• CPC Class Codes: H01L 2924/01014 : Silicon [Si]
• CPC Class Codes: H01L 2924/01015 : Phosphorus [P]
• CPC Class Codes: H01L 2924/01019 : Potassium [K]
• CPC Class Codes: H01L 2924/01028 : Nickel [Ni]
• CPC Class Codes: H01L 2924/01029 : Copper [Cu]
• CPC Class Codes: H01L 2924/01042 : Molybdenum [Mo]
• CPC Class Codes: H01L 2924/01047 : Silver [Ag]
• CPC Class Codes: H01L 2924/01049 : Indium [In]
• CPC Class Codes: H01L 2924/01078 : Platinum [Pt]
• CPC Class Codes: H01L 2924/01079 : Gold [Au]
• CPC Class Codes: H01L 2924/014 : Solder alloys
• CPC Class Codes: H01L 2924/0665 : Epoxy resin
• CPC Class Codes: H01L 2924/10253 : Silicon [Si]
• CPC Class Codes: H01L 2924/1305 : Bipolar Junction Transistor [BJT]
• CPC Class Codes: H01L 2924/1306 : Field-effect transistor [FET]
• CPC Class Codes: H01L 2924/13091 : Metal-Oxide-Semiconductor Field-Effect Transistor [MOSFET]
• CPC Class Codes: H01L 2924/181 : Encapsulation
• CPC Class Codes: H01L 2924/19041 : being a capacitor
• CPC Class Codes: H01L 2924/19042 : being an inductor
• CPC Class Codes: H01L 2924/20303 : Ultrasonic frequency [f] 50 Khz=<f< 75 KHz
• CPC Class Codes: H01L 2924/20304 : Ultrasonic frequency [f] 75 Khz=<f< 100 KHz
• CPC Class Codes: H01L 2924/206 : Length ranges
• CPC Class Codes: H01L 2924/20755 : larger or equal to 50 microns less than 60 microns
• CPC Class Codes: H01L 2924/30107 : Inductance
• CPC Class Codes: H01L 2924/3512 : Cracking

Abstract

A flexible conductive ribbon is ultrasonically bonded to the surface of a die and terminals from a lead frame of a package. Multiple ribbons and/or multiple bonded areas provide various benefits, such as high current capability, reduced spreading resistance, reliable bonds due to large contact areas, lower cost and higher throughput due to less areas to bond and test.

Claims

1. An electronic package, comprising:

an electronic device having a conductive upper surface;

a conductive terminal external to the electronic device; and

a conductive ribbon ultrasonically bonded to a first portion of the conductive upper surface and bonded to the conductive terminal, wherein the conductive ribbon comprises a first layer contacting the conductive upper surface and a second layer overlying the first layer.

2. The electronic package of claim 1, wherein the first layer is aluminum and the second layer is copper.

3. The electronic package of claim 2, wherein the first layer is thinner than the second layer.

4. The electronic package of claim 1, wherein the conductive ribbon further comprises a third layer overlying the second layer.

5. The electronic package of claim 1, wherein the first layer and the conductive upper surface comprise the same material.

6. The electronic package of claim 1, wherein the ribbon has a rectangular cross section.

7. An electronic package, comprising:

an electronic device having a conductive upper surface;

a conductive terminal external to the electronic device; and

a conductive ribbon ultrasonically bonded to a first portion of the conductive upper surface and bonded to the conductive terminal, wherein the conductive ribbon comprises a first layer contacting the conductive upper surface and a second layer overlying the first layer, and wherein the first layer is aluminum and the second layer is copper.

8. A conductive ribbon for ultrasonically bonding a first portion of a conductive upper surface to a conductive terminal, the ribbon comprising:

an aluminum layer of rectangular cross section, wherein the aluminum layer contacts the conductive upper surface; and

a copper layer of rectangular cross section formed over the aluminum layer.

9. The conductive ribbon of claim 8, further comprising a coupling layer formed over the copper layer.

10. The conductive ribbon of claim 8, wherein the aluminum layer is thinner than the copper layer.

11. The conductive ribbon of claim 9, wherein the coupling layer is aluminum.