Semiconductor device and manufacturing method of the same
First Claim
1. A semiconductor device comprising:
- a semiconductor die having a via hole extending from a back surface of the semiconductor die to a top surface of the semiconductor die;
a pad electrode layer covering the via hole at the top surface of the semiconductor die and comprising a first barrier layer and a metal layer, the first barrier layer being disposed closer to the top surface of the semiconductor die than the metal layer;
a supporting member attached to the top surface of the semiconductor die;
a redistribution layer disposed on the back surface of the semiconductor die and extending into the via hole to be in contact with the first barrier layer.
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Abstract
This invention provides a semiconductor device and a manufacturing method thereof which can minimize deterioration of electric characteristics of the semiconductor device without increasing an etching process. In the semiconductor device of the invention, a pad electrode layer formed of a first barrier layer and an aluminum layer laminated thereon is formed on a top surface of a semiconductor substrate. A supporting substrate is further attached on the top surface of the semiconductor substrate. A second barrier layer is formed on a back surface of the semiconductor substrate and in a via hole formed from the back surface of the semiconductor substrate to the first barrier layer. Furthermore, a re-distribution layer is formed in the via hole so as to completely fill the via hole or so as not to completely fill the via hole. A ball-shaped terminal is formed on the re-distribution layer.
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Citations
18 Claims
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1. A semiconductor device comprising:
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a semiconductor die having a via hole extending from a back surface of the semiconductor die to a top surface of the semiconductor die;
a pad electrode layer covering the via hole at the top surface of the semiconductor die and comprising a first barrier layer and a metal layer, the first barrier layer being disposed closer to the top surface of the semiconductor die than the metal layer;
a supporting member attached to the top surface of the semiconductor die;
a redistribution layer disposed on the back surface of the semiconductor die and extending into the via hole to be in contact with the first barrier layer. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9)
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10. A method of manufacturing a semiconductor device, comprising:
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providing a semiconductor substrate comprising a pad electrode layer comprising a first barrier layer formed on a top surface of the semiconductor substrate and a metal layer formed on the first barrier layer;
attaching a supporting member to the top surface of the semiconductor substrate;
forming a via hole in the semiconductor substrate from a back surface of the semiconductor substrate to expose the first barrier layer; and
forming a redistribution layer on the back surface of the semiconductor substrate so that the redistribution layer extends into the via hole to connect with the first barrier layer. - View Dependent Claims (11, 12, 13, 14, 15, 16, 17, 18)
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Specification