Semiconductor device components with structures for stabilizing the semiconductor device components upon flip-chip arrangement with high-level substrates

• US 20050269714A1
• Filed: 07/22/2005
• Published: 12/08/2005
• Est. Priority Date: 06/08/2000
• Status: Abandoned Application

• Current Assignee: Salman Akram, Sayed Sajid Ahmad
• Original Assignee: Salman Akram, Sayed Sajid Ahmad
• Inventors: Ahmad, Sayed Sajid, Akram, Salman
• Application Number:
  US11/187,434
• Publication Number:
  US 20050269714A1
• Time in Patent Office: Days
• US Class Current: 257/778
• CPC Class Codes: B33Y 80/00 Products made by additive manufacturing
• CPC Class Codes: H01L 2224/05568 the whole external layer protruding from the surface
• CPC Class Codes: H01L 2224/05573 Single external layer
• CPC Class Codes: H01L 2224/05599 Material
• CPC Class Codes: H01L 2224/0615 Mirror array, i.e. array having only a reflection symmetry, i.e. bilateral symmetry
• CPC Class Codes: H01L 2224/10135 Alignment aids
• CPC Class Codes: H01L 2224/13 of an individual bump connector
• CPC Class Codes: H01L 2224/13099 Material
• CPC Class Codes: H01L 2224/75 Apparatus for connecting with bump connectors or layer connectors
• CPC Class Codes: H01L 2224/81136 involving guiding structures, e.g. spacers or supporting members
• CPC Class Codes: H01L 2224/81139 Guiding structures on the body
• CPC Class Codes: H01L 2224/81801 Soldering or alloying
• CPC Class Codes: H01L 23/16 Fillings or auxiliary members in containers or encapsulations, e.g. centering rings H01L23/42, H01L23/552 take precedence
• CPC Class Codes: H01L 24/10 Bump connectors bumps on insulating substrates, e.g. chip carriers, H01L23/49816; Manufacturing methods related thereto
• CPC Class Codes: H01L 24/13 of an individual bump connector
• CPC Class Codes: H01L 24/75 Apparatus for connecting with bump connectors or layer connectors
• CPC Class Codes: H01L 24/81 using a bump connector
• CPC Class Codes: H01L 2924/00 Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/00014 the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
• CPC Class Codes: H01L 2924/01005 Boron [B]
• CPC Class Codes: H01L 2924/01006 : Carbon [C]
• CPC Class Codes: H01L 2924/01033 : Arsenic [As]
• CPC Class Codes: H01L 2924/01082 : Lead [Pb]
• CPC Class Codes: H01L 2924/014 : Solder alloys
• CPC Class Codes: H01L 2924/12042 : LASER
• CPC Class Codes: H01L 2924/351 : Thermal stress
• CPC Class Codes: H05K 2201/10568 : Integral adaptations of a component or an auxiliary PCB for mounting, e.g. integral spacer element
• CPC Class Codes: H05K 2201/10674 : Flip chip
• CPC Class Codes: H05K 2201/10734 : Ball grid array [BGA]; Bump grid array
• CPC Class Codes: H05K 2201/2036 : Permanent spacer or stand-off in a printed circuit or printed circuit assembly
• CPC Class Codes: H05K 3/303 : Surface mounted components, e.g. affixing before soldering, aligning means, spacing means H05K3/32 takes precedence
• CPC Class Codes: H05K 3/3436 : having an array of bottom contacts, e.g. pad grid array or ball grid array components
• CPC Class Codes: Y02P 70/50 : Manufacturing or production processes characterised by the final manufactured product

Abstract

Semiconductor device components include a substrate with contact pads and at least one stabilizer protruding from the contact pad-bearing surface of the substrate. The at least one stabilizer may include adjacent, mutually adhered regions. Each region includes dielectric material. The at least one stabilizer is configured to at least partially stabilize the semiconductor device component upon assembly of the semiconductor device component in flip-chip fashion relative to a higher level substrate, preventing tilting or tipping of the semiconductor device component relative to the higher level substrate. The at least one stabilizer may be configured and positioned to define a minimum, substantially uniform distance between the semiconductor device component and the higher level substrate.

Claims

1. A semiconductor device component, comprising:

a substrate having a surface with contact pads exposed thereto; and

at least one stabilizer protruding from the surface and including a plurality of mutually adhered regions, every region of the plurality comprising dielectric material.

2. The semiconductor device component of claim 1, wherein every region of the plurality comprises the same type of dielectric material.

3. The semiconductor device component of claim 1, wherein the at least one stabilizer protrudes from the surface a distance no more than a distance that at least one conductive structure to be disposed in contact with at least one of the contact pads will extend beyond the surface.

4. The semiconductor device component of claim 3, wherein the at least one stabilizer protrudes from the surface a distance that permits conductive structures on the contact pads to contact conductors of another semiconductor device component upon assembly of the substrate with the another semiconductor device component such that the surface of the assembly faces a conductor-bearing surface of the another semiconductor device component.

5. The semiconductor device component of claim 1, wherein the dielectric material comprises a photocurable material.

6. The semiconductor device component of claim 1, further comprising:

protruding conductive structures in contact with selected ones of the contact pads.

7. The semiconductor device component of claim 1, wherein the substrate comprises a fabrication substrate carrying a plurality of devices.

8. The semiconductor device component of claim 1, wherein the contact pads are arranged substantially in-line relative to one another.

9. The semiconductor device component of claim 8, wherein the contact pads are arranged on or proximate to a center line of the substrate.

10. The semiconductor device component of claim 1, wherein the at least one stabilizer is electrically nonconductive.

11. The semiconductor device component of claim 1, wherein the at least one stabilizer is positioned between the contact pads and a periphery of the substrate.

12. A semiconductor device component, comprising:

a substrate having a surface with contact pads exposed thereto, the contact pads being configured to be connected with conductors on a surface of another semiconductor device component; and

at least one stabilizer protruding from the surface of the substrate, the at least one stabilizer comprising a plurality of mutually adhered regions, each region of the plurality comprising dielectric material.

13. The semiconductor device component of claim 12, wherein each of region of the plurality comprises the sane type of dielectric material.

14. The semiconductor device component of claim 12, wherein the at least one stabilizer protrudes from the surface of the substrate a distance no more than a distance that at least one conductive structure to be disposed in contact with at least one of the contact pads will extend beyond the surface.

15. The semiconductor device component of claim 14, wherein the at least one stabilizer protrudes from the surface of the substrate a distance that permits conductive structures on the contact pads to contact the conductors of the another semiconductor device component.

16. The semiconductor device component of claim 12, wherein the dielectric material comprises a photocurable material.

17. The semiconductor device component of claim 12, further comprising:

protruding conductive structures in contact with selected ones of the contact pads.

18. The semiconductor device component of claim 12, wherein the substrate comprises a fabrication substrate carrying a plurality of devices.

19. The semiconductor device component of claim 12, wherein the at least one stabilizer maintains a substantially uniform distance between the surface of the substrate and the surface of the another semiconductor device component.

20. The semiconductor device component of claim 12, wherein the contact pads are arranged substantially in-line relative to one another.

21. The semiconductor device component of claim 20, wherein the contact pads are arranged on or proximate to a center line of the substrate.

22. The semiconductor device component of claim 12, wherein the at least one stabilizer is electrically nonconductive.

23. The semiconductor device component of claim 12, wherein the at least one stabilizer is positioned between the contact pads and a periphery of the substrate.