Thermally improved placement of power-dissipating components onto a circuit board

• US 20050270749A1
• Filed: 06/07/2005
• Published: 12/08/2005
• Est. Priority Date: 06/07/2004
• Status: Active Grant

• Current Assignee: Avago Technologies International Sales Pte Limited (Broadcom, Inc.)
• Original Assignee: Broadcom Corporation (Broadcom, Inc.)
• Inventors: Verbist, Rudi
• Granted Patent: US 7,443,025 B2
• Time in Patent Office: Days
• US Class Current: 361/720
• CPC Class Codes: H01L 2924/00 Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/0002 Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
• CPC Class Codes: H05K 1/0203 Cooling of mounted components H05K1/0272 takes precedence
• CPC Class Codes: H05K 1/181 associated with surface mounted components
• CPC Class Codes: H05K 2201/09709 Staggered pads, lands or terminals; Parallel conductors in different planes
• CPC Class Codes: H05K 2201/10477 Inverted
• CPC Class Codes: H05K 2201/10689 Leaded Integrated Circuit [IC] package, e.g. dual-in-line [DIL]
• CPC Class Codes: H05K 2203/1572 Processing both sides of a PCB by the same process; Providing a similar arrangement of components on both sides; Making interlayer connections from two sides
• CPC Class Codes: Y02P 70/50 Manufacturing or production processes characterised by the final manufactured product

Abstract

The invention refers to an electronic system, comprising several power-dissipating components, and a circuit board, wherein said power-dissipating components are mounted both to a top side and a bottom side of said circuit board. Further, the invention refers to method for mounting power-dissipating components onto a circuit board, comprising the steps of (a) determining the thermal behavior of said power-dissipating components; and (b) determining, in accordance thereto, the placement of said power-dissipating components on both a top side and a bottom side of said circuit board.

Claims

1. An electronic system, comprising several power-dissipating components, and a circuit board, wherein said power-dissipating components are mounted both to a top side and a bottom side of said circuit board.

2. The electronic system of claim 1, wherein at least one of said power-dissipating components comprises a package containing an electronic device.

3. The electronic system of claim 2, wherein said electronic device is an integrated circuit.

4. The electronic system of claim 1, wherein all of said components show a similar thermal behavior.

5. The electronic system of claim 4, wherein the power dissipated via the bottom of said component is lower than the power dissipated via the top of said component.

6. The electronic system of claim 4, wherein the power dissipated via the top of said component is lower than the power dissipated via the bottom of said component.

7. The electronic system of claim 1, comprising at least four power-dissipating components.

8. The electronic system of claim 7, wherein said power-dissipating components are mounted in the form of rows or columns to both said top side and said bottom side of said circuit board.

9. The electronic system of claim 8, wherein said rows or columns of said power-dissipating components mounted to said top side of said circuit board are offset with respect to said rows or columns of said power-dissipating components mounted to said bottom side of said circuit board.

10. The electronic system of claim 9, wherein, viewed from above, said power-dissipating components mounted to said top side of said circuit board and said power-dissipating components mounted to said bottom side of said circuit board are spaced.

11. A method for mounting power-dissipating components onto a circuit board, comprising the steps:

determining the thermal behavior of said power-dissipating components; and

determining, in accordance thereto, the placement of said power-dissipating components on both a top side and a bottom side of said circuit board.

12. The method of claim 11, wherein at least one of said power-dissipating components comprises a package containing an electronic device.

13. The method of claim 12, wherein said electronic device is an integrated circuit.

14. The method of claim 11, wherein the determining of the thermal behavior of said power-dissipating components comprises:

determining the power dissipated via the bottom of said power-dissipating components.

15. The method of claim 11, wherein the determining of the thermal behavior of said power-dissipating components comprises:

determining the power dissipated via the top of said power-dissipating components.

16. The method of claim 11, wherein said power-dissipating components are mounted in the form of rows or columns to both said top side and said bottom side of said circuit board.

17. The method of claim 16, wherein said rows or columns mounted to said top side are offset with respect to said rows or columns mounted to said bottom side of said circuit board.

18. The method of claim 17, wherein said offset is determined depending on a thermal behavior of said power-dissipating components.