Dual stage modular optical devices
First Claim
1. An modular optical device, comprising:
- a first fabricated package including at least one of a light source for generating optical signals and a light detector for detecting optical signals;
a second fabricated package with an opening for accepting circuitry that is to electrically interoperate with the at least one of the light source and light detector; and
a lead frame that mechanically connects the first fabricated package to the second fabricated package and that electrically connects the at least one of the light source and light detector to contacts exposed in the opening.
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Accused Products
Abstract
Embodiments of the present invention are directed to a dual stage modular optical device for sending and/or receiving optical signals. A first fabricated package includes a light source for generating optical signals and/or a light detector for detecting received optical signals. A second fabricated package includes an opening for accepting circuitry that is to electrically interoperate with the light source and/or light detector to transfer optical signals. A lead frame mechanically connects the first fabricated package to the second fabricated package and electrically connects the light source and/or light detector to contacts exposed in the opening. The dual stage modular optical device can be coupled to a substrate configured to be received within a standard slot of a host system, such as a PCI or PCMCIA slot. Thus, one or more optical connections are integrated within the host device or system.
63 Citations
20 Claims
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1. An modular optical device, comprising:
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a first fabricated package including at least one of a light source for generating optical signals and a light detector for detecting optical signals;
a second fabricated package with an opening for accepting circuitry that is to electrically interoperate with the at least one of the light source and light detector; and
a lead frame that mechanically connects the first fabricated package to the second fabricated package and that electrically connects the at least one of the light source and light detector to contacts exposed in the opening. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10, 11)
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12. An optoelectronic interface device comprising:
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a host bus adapter having a printed circuit board with at least one connector for electrically interfacing with a host device; and
a modular optical device configured to mechanically and electrically interface with the host bus adapter, the modular optical device comprising;
a first fabricated package including at least one of a light source and a light detector;
a second fabricated package with an opening for accepting circuitry that is to electrically interoperate with the at least one of a light source and light detector, the second fabricated package including a connection portion for electrically coupling the modular optical device to the host bus adapter;
a lead frame that mechanically connects the first fabricated package to the second fabricated package and that electrically connects the at least one of a light source and light detector to contacts exposed in the opening;
a lens block mechanically coupled to the first fabricated package the lens block configured to receive one or more lens pins;
at least one lens pin mechanically coupled to the lens block, the at least one lens pin for transferring an optical signal between the at least one of a light source and a light detector and an external component. - View Dependent Claims (13, 14, 15, 16, 17, 18)
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19. A modular optical device comprising:
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a first fabricated package including a laser and a photodiode;
a second fabricated package with an opening for accepting circuitry that is to electrically interoperate with the laser and the photodiode, the second fabricated package including a connector for electrically and mechanically coupling the fabricated package to a substrate;
a lead frame that mechanically connects the first fabricated package to the second fabricated package and that electrically connects the laser and the photo diode to contacts exposed in the opening;
a lens block configured to receive a plurality of lens pins and configured to mechanically couple to a first fabricated package;
a first lens pin mechanically coupled to the lens block for directing an optical signal from the laser to an external component; and
a second lens pin mechanically coupled to the lens block for directing an optical signal from an external component to the photodiode. - View Dependent Claims (20)
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Specification