Substrate processing method and fabrication process of a semiconductor device
First Claim
1. A method of fabricating a semiconductor device, comprising the steps of:
- forming a via-hole in an interlayer insulation film such that a metal interconnection pattern formed underneath said interlayer insulation film is exposed at a bottom of said via-hole;
forming a conductive barrier film on said interlayer insulation film so as to cover a sidewall surface of said via-hole and said exposed metal interconnection pattern in conformity with a shape of said via-hole; and
forming a metal film on said conductive barrier film, wherein there is provided a preprocessing step, after said step of forming said via-hole but before said step of forming said conductive barrier film, of processing said interlayer insulation film including said sidewall surface of said via-hole and a bottom surface of said via-hole, with plasma containing hydrogen having energy not causing sputtering of said metal interconnection pattern, such that a surface of said interlayer insulation film, said sidewall surface of said via-hole and said bottom surface of said via-hole are terminated by hydrogen.
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Abstract
A method of fabricating a semiconductor device includes the steps of forming a via-hole in an interlayer insulation film such that a metal interconnection pattern formed underneath the interlayer insulation film is exposed at a bottom of the via-hole, forming a conductive barrier film on the interlayer insulation film so as to cover a sidewall surface of the via-hole and the exposed metal interconnection pattern in conformity with a shape of the via-hole. and forming a metal film on the conductive barrier film, wherein there is provided a preprocessing step, after the step of forming the via-hole but before the step of forming the conductive barrier film, of processing the interlayer insulation film including the sidewall surface of the via-hole and a bottom surface of the via-hole, with plasma containing hydrogen having energy not causing sputtering of the metal interconnection pattern.
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Citations
25 Claims
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1. A method of fabricating a semiconductor device, comprising the steps of:
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forming a via-hole in an interlayer insulation film such that a metal interconnection pattern formed underneath said interlayer insulation film is exposed at a bottom of said via-hole;
forming a conductive barrier film on said interlayer insulation film so as to cover a sidewall surface of said via-hole and said exposed metal interconnection pattern in conformity with a shape of said via-hole; and
forming a metal film on said conductive barrier film, wherein there is provided a preprocessing step, after said step of forming said via-hole but before said step of forming said conductive barrier film, of processing said interlayer insulation film including said sidewall surface of said via-hole and a bottom surface of said via-hole, with plasma containing hydrogen having energy not causing sputtering of said metal interconnection pattern, such that a surface of said interlayer insulation film, said sidewall surface of said via-hole and said bottom surface of said via-hole are terminated by hydrogen. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10, 11, 12, 13, 14, 15, 16)
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17. A substrate processing method, comprising the steps of:
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forming a via-hole in an insulation film so as to expose a metal pattern formed underneath said insulation film at a bottom of said via-hole; and
forming a conductive barrier film on said insulation film in conformity with a shape of said via-hole such that said conductive barrier film covers a sidewall surface of said via-hole and said metal pattern exposed at said bottom of said via-hole, wherein there is provided a preprocessing step, after said step of forming said via-hole but before said step of forming said conductive barrier film, of processing said interlayer insulation film including said sidewall surface of the via-hole and a bottom surface of said via-hole, with plasma containing hydrogen having energy not causing sputtering of said metal pattern, such that a surface of said interlayer insulation film is terminated with hydrogen including said sidewall surface of said via-hole and said bottom surface of said via-hole.
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18. A processor-readable medium storing program code means for configuring a general purpose computer to control a substrate processing system such that said substrate processing apparatus carries out a method of fabricating a semiconductor device, comprising the steps of:
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forming a via-hole in an interlayer insulation film such that a metal interconnection pattern formed underneath said interlayer insulation film is exposed at a bottom of said via-hole;
forming a conductive barrier film on said interlayer insulation film so as to cover a sidewall surface of said via-hole and said exposed metal interconnection pattern in conformity with a shape of said via-hole; and
forming a metal film on said conductive barrier film, wherein there is provided a preprocessing step, after said step of forming said via-hole but before said step of forming said conductive barrier film, of processing said interlayer insulation film including said sidewall surface of said via-hole and a bottom surface of said via-hole, with plasma containing hydrogen having energy not causing sputtering of said metal interconnection pattern, such that a surface of said interlayer insulation film, said sidewall surface of said via-hole and said bottom surface of said via-hole are terminated by hydrogen. - View Dependent Claims (19, 20, 21, 22, 23, 24, 25)
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Specification