Method of pitch dimension shrinkage

• US 20050272259A1
• Filed: 06/08/2004
• Published: 12/08/2005
• Est. Priority Date: 06/08/2004
• Status: Active Grant

• Current Assignee: Macronix International Co., Ltd.
• Original Assignee: Macronix International Co., Ltd.
• Inventors: Hong, Shih Ping
• Granted Patent: US 7,183,205 B2
• Time in Patent Office: Days
• US Class Current: 438/669
• CPC Class Codes: H01L 21/0337 characterised by the process involved to create the mask, e.g. lift-off masks, sidewalls, or to modify the mask, e.g. pre-treatment, post-treatment
• CPC Class Codes: H01L 21/0338 Process specially adapted to improve the resolution of the mask
• CPC Class Codes: H01L 21/28123 Lithography-related aspects, e.g. sub-lithography lengths; Isolation-related aspects, e.g. to solve problems arising at the crossing with the side of the device isolation; Planarisation aspects
• CPC Class Codes: H01L 21/31144 using masks
• CPC Class Codes: H01L 21/76828 thermal treatment
• CPC Class Codes: H01L 21/76834 formation of thin insulating films on the sidewalls or on top of conductors H01L21/76831 takes precedence
• CPC Class Codes: H01L 21/76838 characterised by the formation and the after-treatment of the conductors etching for patterning the conductors H01L21/3213
• CPC Class Codes: Y10S 438/947 Subphotolithographic processing

Abstract

Roughly described, a patterned first layer is provided over a second layer which is formed over a substrate. In a conversion process, first layer material is consumed at feature sidewalls to form third layer material at the feature sidewalls. The width of third layer material at each of the sidewalls is greater than the width of first layer material consumed at the respective sidewall in the conversion process. The second layer is patterned using the third layer material as mask. A fourth layer of material is formed over the substrate, and planarized or otherwise partially removed so as to expose the top surfaces of the features in the first layer through the fourth layer. The exposed first layer material is removed to expose portions of the second layer through the fourth layer, and the second layer is further patterned using the fourth layer material as a mask.

Claims

1. A method of manufacturing an integrated circuit, comprising the steps of:

providing a patterned first material layer with features having top surfaces and sidewalls, the patterned first material layer being formed over a second material layer which is formed over a substrate;

in a conversion process, consuming first material at the feature sidewalls to form third material at the feature sidewalls, the width of third material at each of the sidewalls being greater than the width of first material consumed at the respective sidewall in the conversion process;

patterning the second material layer using the third material as mask;

forming a fourth material layer over the substrate;

exposing the top surfaces of the features in the first material layer through the fourth material layer;

removing the exposed first material layer to expose portions of the second material layer through the fourth material layer; and

further patterning the second material layer using the fourth material layer as a mask.

2. The method according to claim 1, wherein the step of providing a patterned first material layer comprises the steps of:

forming a patterned photoresist layer on an unpatterned first material layer; and

etching the first material layer using the patterned photoresist layer as mask.

3. The method according to claim 1, wherein the first material is a member of the group consisting of polysilicon and amorphous silicon.

4. The method according to claim 1, wherein the fourth material layer comprises an oxide.

5. The method according to claim 1, wherein the conversion process comprises a thermal oxidation process.

6. The method according to claim 5, wherein the second material layer comprises a silicon nitride.

7. The method according to claim 5, wherein the third material comprises a silicon oxide.

8. The method according to claim 1, wherein the conversion process comprises a silicide process, the silicide process comprising the steps of:

depositing a metal layer over the first material layer;

sintering the metal layer; and

removing the metal layer.

9. The method according to claim 8, wherein the metal layer is a member of the group consisting of Platinum, Nickel, Cobalt, Titanium, Tantalum and Molybdenum.

10. The method according to claim 8, further comprising the step of removing the third material before the step of forming of a fourth material layer.

11. The method according to claim 1, wherein the step of exposing the top surfaces of the features in the first material layer comprises the step of planarizing the fourth material layer at least until the top surface of the features in the first material layer are exposed.

12. The method according to claim 11, wherein the step of planarizing the fourth material layer uses a dry etching process.

13. The method according to claim 11, wherein the step of planarizing the fourth material layer uses a chemical-mechanical polishing process.

14. The method according to claim 1, wherein the first layer features have a first minimum feature width,

and wherein the second material layer after the step of further patterning the second material layer has features having a second minimum feature width,

and wherein the first minimum feature width is larger than the second minimum feature width.

15. The method according to claim 1, wherein the first layer features include a first regular pattern of lines having a first pitch,

and wherein the second material layer, after the step of further patterning the second material layer, has features including a second regular pattern of lines having a second pitch that is substantially one-half the first pitch.

16. The method according to claim 1, further comprising the step of removing the fourth material layer after the step of further patterning the second material layer.

17. The method according to claim 1, wherein the step of providing a patterned first material layer comprises the steps of:

providing a patterned fifth material layer with features having top surfaces and sidewalls, the patterned fifth material layer being formed over an unpatterned first material layer;

in a preliminary conversion process, consuming fifth material at the feature sidewalls to form sixth material at the feature sidewalls, the width of sixth material at each of the sidewalls being greater than the width of fifth material layer consumed at the respective sidewall in the preliminary conversion process;

patterning the first material layer using the sixth material as mask;

forming a seventh material layer over the substrate;

exposing the top surfaces of the features in the fifth material layer through the seventh material layer;

removing the exposed fifth material layer to expose portions of the first material layer through the seventh material layer;

further patterning the first material layer using the seventh material layer as a mask; and

removing the seventh material layer after the step of further patterning the first material layer.

18. A method according to claim 1, wherein the step of providing a patterned first material layer includes the step of providing an additional mask layer superposing the patterned first material layer, the additional mask layer matching the pattern of the first material layer, further comprising the step of removing the additional mask layer prior to the step of removing the exposed first material layer.

19. A method according to claim 18, wherein the step of removing the additional mask layer occurs concurrently with the step of patterning the second material layer.

20. A method according to claim 19, wherein the additional mask layer and the second material layer consist essentially of the same material.

21. A method according to claim 19, wherein the additional mask layer and the second material layer each consist essentially of silicon nitride.

22. A method of manufacturing an integrated circuit, comprising the steps of:

providing a first material layer patterned to include features having a first regular pattern of lines having a first pitch, the lines having top surfaces and sidewalls, the first material layer being formed over a second material layer which is formed over a substrate;

in a thermal conversion process, thermally consuming first material at the feature sidewalls to form third material at the feature sidewalls, the width of third material at each of the sidewalls being greater than the width of first material consumed at the respective sidewall in the conversion process;

etching the second material layer using the third material as mask;

forming a fourth material layer over the substrate;

exposing the top surfaces of the features in the first material layer through the fourth material layer;

removing the exposed first material layer to expose portions of the second material layer through the fourth material layer; and

further patterning the second material layer using the fourth material layer as a mask,

wherein the second material layer, after the step of further patterning the second material layer, has features including a second regular pattern of lines having a second pitch that is substantially one-half the first pitch.

23. A method according to claim 22, wherein the step of providing a first material layer includes the step of providing an additional mask layer superposing the feature top surfaces, the additional mask layer matching the pattern of the first material layer, the additional mask layer consisting essentially of the same material as the second material layer,

and wherein the step of etching the second material layer includes the step of removing the additional mask layer.

24. A method according to claim 22, wherein the thermal conversion process comprises a thermal oxidation process.

25. A method according to claim 24, wherein the second material layer comprises a silicon nitride and the third material comprises a silicon oxide.

26. A method according to claim 22, wherein the thermal conversion process comprises the steps of:

depositing a metal layer over the first material layer;

sintering the metal layer; and

removing the metal layer.

27. A method according to claim 26, wherein the metal layer is a member of the group consisting of Platinum, Nickel, Cobalt, Titanium, Tantalum and Molybdenum.