Heat pipe connection system and method

• US 20050274120A1
• Filed: 11/26/2004
• Published: 12/15/2005
• Est. Priority Date: 06/08/1999
• Status: Active Grant

• Current Assignee: The Thermotek Incorporated
• Original Assignee: The Thermotek Incorporated
• Inventors: Quisenberry, Tony, Havis, Clark R.
• Granted Patent: US 7,305,843 B2
• Time in Patent Office: Days
• US Class Current: 62/3.700
• CPC Class Codes: F25B 21/02 using Peltier effect; using Nernst-Ettinghausen effect
• CPC Class Codes: F28D 15/0233 the conduits having a particular shape, e.g. non-circular cross-section, annular F28D15/0241, F28D15/0266 take precedence
• CPC Class Codes: F28D 15/0266 with separate evaporating and condensing chambers connected by at least one conduit; Loop-type heat pipes; with multiple or common evaporating or condensing chambers F28D15/043 takes precedence
• CPC Class Codes: F28D 15/046 characterised by the material or the construction of the capillary structure
• CPC Class Codes: F28D 2015/0225 Microheat pipes
• CPC Class Codes: F28F 9/0221 Header boxes or end plates formed by stacked elements
• CPC Class Codes: H01L 23/427 Cooling by change of state, e.g. use of heat pipes by liquefied gas H01L23/445
• CPC Class Codes: H01L 23/473 by flowing liquids H01L23/4332, H01L23/4338 take precedence
• CPC Class Codes: H01L 2924/00 Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/0002 Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Abstract

A stackable heat transfer system incorporating a plurality of flow controlled endcaps facilitating select flow of heat transfer fluid through low profile extrusions. The low profile extrusions are mounted in a sandwiched configuration with thermal electric cooling arrays for providing heat dissipation from the cooler arrays and the heat transfer from a low profile extrusion sandwiched the cooler arrays.

Claims

1. A stackable heat transfer system for cooling a first heat transfer fluid flowing therethrough with a second heat transfer fluid flowing therein, the system including at least two heat transfer assemblies, coupled one to the other, each assembly comprising:

a first low profile extrusion manifold containing the first fluid therein;

a flow coupling means for receiving and discharging the first fluid into and from the first manifold;

a pair of second low profile extrusion manifolds containing the second fluid therein;

flow control endcaps coupled to the ends of each of the second manifolds and adapted for stacked coupling one to the other in the stacked flow communication therewith;

first and second thermal electric cooler arrays having heat absorption and heat dissipation sides assembled in thermal engagement with the first manifold with the heat absorption side of each cooler array in thermal contact therewith; and

means for securing the pair of second manifolds in thermal engagement with the cooler arrays for absorption of heat therefrom with the first manifold sandwiched therebetween.

2. The system as set forth in claim 1 wherein the flow coupling means comprises a conduit adapted for coupling the first manifold of one heat transfer assembly to the first manifold of a second heat transfer assembly stacked therewith.

3. The system of claim 1 wherein the endcap is constructed with generally orthogonal flow channels formed therethrough for selective flow therein.

4. The system as set forth in claim 3 and further including a flow diverting plug adapted for securement within a portion of the orthogonal flow channel of the endcap for selectively restricting flow.

5. The system as set forth in claim 3 wherein the flow channels include a generally cylindrical port in a lower portion thereof.

6. The system as set forth in claim 5 wherein the flow channels include a first slotted portion adapted to receive an end portion of the second manifold therein in flow communication therewith and an upstanding connector adapted for mating engagement with the port of an endcap stacked thereabove.

7. A stackable heat transfer assembly for cooling a first fluid flowing therethrough with a second fluid flowing therein and utilizing thermal electric cooler arrays disposed in a sandwiched configuration therewith, the assembly comprising;

first and second low profile extrusion manifolds, the first manifold adapted for the flow of the first fluid therein and the second manifold adapted for the flow of the second fluid therethrough;

end caps adapted for mounting to the ends of the second manifold in stacked interconnection one with the other for facilitating a select flow of the second fluid through the second manifolds relative to the sandwiched cooler arrays disposed therein; and

means for mounting a pair of second manifolds on opposite sides of the first manifold with a pair of cooler arrays sandwiched therebetween, the cooler arrays oriented so that each cooler array absorbs heat from the first manifold and dissipates heat into the second manifolds, the second manifolds facilitating the flow of the second fluid therethrough and through the end caps interconnected therewith wherein multiple assemblies of sandwiched first and second manifolds and cooler arrays disposed therebetween may be coupled one to the other for affording an increase in heat transfer dissipation from the first fluid flowing therethrough by the second fluid flowing therein.

8. The assembly as set forth in claim 7 and further including at least one conduit adapted for coupling the first manifold of one heat transfer assembly to the first manifold of a second heat transfer assembly stacked therewith.

9. The assembly as set forth in claim 7 and further including a flow diverting plug adapted for securement within a portion of the endcap for selectively diverting flow therethrough.

10. The system as set forth in claim 7 wherein the endcap is constructed with generally orthogonal flow channels formed therethrough.

11. The system as set forth in claim 10 wherein a lower portion of the flow channel includes a port.

12. The system as set forth in claim 11 wherein the orthogonal flow channels of the endcap include a first slotted portion adapted to receive an end portion of the second manifold therein in flow communication therewith and an upstanding connector portion adapted for mating engagement with the port of an endcap stacked therewith.