Hybrid impact sensor

• US 20050274168A1
• Filed: 11/08/2004
• Published: 12/15/2005
• Est. Priority Date: 06/11/2004
• Status: Active Grant

• Current Assignee: Robert Bosch Corporation (Robert Bosch GmbH), Robert Bosch GmbH
• Original Assignee: Robert Bosch GmbH
• Inventors: Stuetzler, Frank-Juergen
• Granted Patent: US 7,231,803 B2
• Time in Patent Office: Days
• US Class Current: 73/12.10
• CPC Class Codes: B60R 21/0136 responsive to actual contact with an obstacle , e.g. to vehicle deformation, bumper displacement or bumper velocity relative to the vehicle monitoring crash strength in combination with passenger seat detection B60R21/01558

Abstract

A hybrid impact sensor and method of operating the same. One sensor includes a support containing one or more mounts; a first sensor with first sensing properties and configured to generate a first output signal; a second sensor with second sensing properties and configured to generate a second output signal, wherein the second sensing properties are different from the first sensing properties; and a housing encasing the first sensor and the second sensor.

Claims

1. A hybrid impact sensor comprising:

a first sensor with first sensing properties and configured to generate a first output signal, wherein the first sensor includes at least one of a sensor including a semiconductor element containing a plurality of piezoresistors, wherein each piezoresistor has an impedance and input and output terminals, and a circuit configured to be coupled to the input and output terminals of the plurality of piezoresistors and capable of sensing the impedance of the plurality of piezoresistors;

a magnetostrictive sensor; and

an acoustic wave sensor.

a second sensor with second sensing properties and configured to generate a second output signal, wherein the second sensing properties are different from the first sensing properties and wherein the second sensor includes at least one of an acceleration sensor and a pressure sensor;

a housing encasing the first sensor and the second sensor; and

one or more mounts.

2. A hybrid impact sensor as claimed in claim 1, further comprising a connector configured to be coupled to at least one of the first sensor, the second sensor, and a control unit.

3. A hybrid impact sensor as claimed in claim 2, wherein the connector is further configured to output at least one of the first sensor signal and the second signal to the control unit.

4. A hybrid impact sensor as claimed in claim 1, wherein the one or more mounts are configured to be attached to a component of a vehicle.

5. A hybrid impact sensor as claimed in claim 1, further comprising potting material.

6. A hybrid impact sensor as claimed in claim 1, further comprising a support.

7. A hybrid impact sensor as claimed in claim 6, wherein the first sensor is attached to the support.

8. A hybrid impact sensor as claimed in claim 6, wherein the second sensor is attached to the support.

9. A hybrid impact sensor as claimed in claim 1, wherein the second sensor is attached to the first sensor.

10. A hybrid impact sensor as claimed in claim 6, wherein the one or more mounts are located at ends of the support.

11. A hybrid impact sensor as claimed in claim 1, wherein the second sensor includes a pressure sensor and the housing includes an opening for the second sensor.

12. A hybrid impact sensor as claimed in claim 1, wherein the second sensor includes a pressure sensor and is configured to detect pressure within a vehicle door cavity.

13. A hybrid impact sensor comprising:

a first sensor of a first sensing type configured to generate a first output signal, wherein the first sensor includes at least one of a sensor including a semiconductor element containing a plurality of piezoresistors, wherein each piezoresistor has an impedance and input and output terminals, and a circuit configured to be coupled to the input and output terminals of the plurality of piezoresistors and capable of sensing the impedance of the plurality of piezoresistors;

a magnetostrictive sensor; and

an acoustic wave sensor;

a second sensor of a second sensing type configured to generate a second output signal, wherein the second sensing type is different from the first sensing type and wherein the second sensor includes at least one of an acceleration sensor and a pressure sensor;

a housing encasing the first sensor and the second sensor; and

one or more mounts.

14. A hybrid impact sensor as claimed in claim 13, further comprising a connector configured to be coupled to at least one of the first sensor, the second sensor, and a control unit.

15. A hybrid impact sensor as claimed in claim 14, wherein the connector is further configured to output at least one of the first sensor signal and the second signal to the control unit.

16. A hybrid impact sensor as claimed in claim 13, wherein the one or more mounts are configured to be attached to a component of a vehicle.

17. A hybrid impact sensor as claimed in claim 13, further comprising potting material.

18. A hybrid impact sensor as claimed in claim 13, further comprising a support.

19. A hybrid impact sensor as claimed in claim 18, wherein the first sensor is attached to the support.

20. A hybrid impact sensor as claimed in claim 18, wherein the second sensor is attached to the support.

21. A hybrid impact sensor as claimed in claim 13, wherein the second sensor is attached to the first sensor.

22. A hybrid impact sensor as claimed in claim 18, wherein the one or more mounts are located at ends of the support.

23. A hybrid impact sensor as claimed in claim 13, wherein the second sensor includes a pressure sensor and the housing includes an opening for the second sensor.

24. A hybrid impact sensor as claimed in claim 13, wherein the second sensor includes a pressure sensor and is configured to detect pressure within a vehicle door cavity.

25. A method of sensing impact to a structure, the method comprising:

providing a first sensor of a first sensing type, wherein the first sensor includes at least one of a sensor including a semiconductor element containing a plurality of piezoresistors, wherein each piezoresistor has an impedance and input and output terminals, and a circuit configured to be coupled to the input and output terminals of the plurality of piezoresistors and capable of sensing the impedance of the plurality of piezoresistors;

a magnetostrictive sensor; and

an acoustic wave sensor;

providing a second sensor of a second sensing type, wherein the second sensing type is different from the first sensing type and wherein the second sensor includes at least one of an acceleration sensor and a pressure sensor;

encasing the first sensor and the second sensor in a housing;

providing one or more mounts;

generating a first output signal; and

generating a second output signal.

26. A method as claimed in claim 25, further comprising transmitting at least one of the first output signal and the second output signal to a control unit.

27. A method as claimed in claim 25, further comprising attaching the one or more mounts to a component of a vehicle.

28. A method as claimed in claim 25, further comprising filling the housing with potting material.

29. A method as claimed in claim 25, further comprising providing a support.

30. A method as claimed in claim 29, further comprising attaching the first sensor to the support.

31. A method as claimed in claim 25, further comprising attaching the second sensor to the support.

32. A method as claimed in claim 25, further comprising attaching the second sensor to the first sensor.

33. A method as claimed in claim 29, further comprising placing the one or more mounts at ends of the support.

34. A method as claimed in claim 25, further comprising providing an opening in the housing, wherein the second sensor includes a pressure sensor.

35. A method as claimed in claim 25, further comprising detecting pressure within a vehicle door cavity, wherein the second sensor includes a pressure sensor.

36. A hybrid impact sensor comprising:

a support containing one or more mounts;

a semiconductor element mounted to the support between the one or more mounts and containing a plurality of piezoresistors each piezoresistor having an impedance and input and output terminals;

a circuit configured to be coupled to the input and output terminals of the plurality of piezoresistors and capable of sensing the impedance of the plurality of piezoresistors; and

a pressure sensor configured to generate a pressure signal.

37. A hybrid impact sensor as claimed in claim 36, wherein the plurality of piezoresistors includes sensing piezoresistors and reference piezoresistors.

38. A hybrid impact sensor as claimed in claim 37, wherein the impedance of the sensing piezoresistors is different than the impedance of the reference piezoresistors.

39. A hybrid impact sensor as claimed in claim 36, wherein the support is configured to receive stress waves.

40. A hybrid impact sensor as claimed in claim 36, wherein the semiconductor element is configured to be mounted along an entire surface of the support such that stress waves that travel through the support distort the semiconductor element.

41. A hybrid impact sensor as claimed in claim 36, wherein the one or more mounts of the support are located at ends of the support.

42. A hybrid impact sensor as claimed in claim 36, wherein the one or more mounts of the support are configured to be attached to a component requiring stress wave sensing.

43. A hybrid impact sensor as claimed in claim 42, wherein the one or more mounts of the support are configured to allow stress waves traveling through the component to also travel through the support.

44. A hybrid impact sensor as claimed in claim 36, wherein the circuit is configured to be mounted on a printed circuit board.

45. A hybrid impact sensor as claimed in claim 44, wherein the pressure sensor is attached to the printed circuit board.

46. A hybrid impact sensor as claimed in claim 36, further comprising a connector configured to be coupled to at least one of the circuit, the pressure sensors, and a control unit.

47. A hybrid impact sensor as claimed in claim 46, wherein the connector is further configured to output at least one of the pressure signal and the impedance to a control unit.

48. A hybrid impact sensor as claimed in claim 36, wherein the pressure sensor is configured to detect pressures changes within a door cavity of a vehicle.

49. A hybrid impact sensor as claimed in claim 36, further comprising a housing.

50. A hybrid impact sensor as claimed in claim 49, wherein the housing includes an opening for the pressure sensor.

51. A hybrid impact sensor as claimed in claim 36, wherein the pressure sensor is attached to the support.

52. A method for sensing impact to a structure, the method comprising:

providing a support with one or more mounts;

attaching a semiconductor element containing a plurality of piezoresistors, each having an impedance, to the support;

connecting the support to the structure with the one or more mounts of the support;

providing a pressure sensor configured to generate a pressure signal;

encasing the support and the pressure sensor in a housing;

sensing the impedance of the plurality of piezoresistors;

and sensing the pressure signal.

53. A method as claimed in claim 52, further comprising providing the plurality of piezoresistors including sensing piezoresistors and reference piezoresistors.

54. A method as claimed in claim 53, further comprising including sensing piezoresistors with different impedance than the reference piezoresistors.

55. A method as claimed in claim 52, further comprising attaching the semiconductor element along an entire surface of the support such that stress waves that travel through the support distort the semiconductor element.

56. A method as claimed in claim 52, further comprising mounting the circuit on a printed circuit board.

57. A method as claimed in claim 56, further comprising mounting the pressure sensor on the printed circuit board.

58. A method as claimed in claim 52, further comprising transmitting at least one of the impedance and pressure signal to a control unit.

59. A method as claimed in claim 52, further comprising attaching the pressure sensor to the support.

60. A method as claimed in claim 52, further comprising detecting the pressure within a door cavity of a vehicle.

61. A method as claimed in claim 52, further comprising providing an opening in the housing for the pressure sensor.

62. A hybrid impact sensor comprising:

a support containing one or more mounts;

a semiconductor element mounted to the support between the one or more mounts and containing a plurality of piezoresistors each piezoresistor having an impedance and input and output terminals;

a circuit configured to be coupled to the input and output terminals of the plurality of piezoresistors and capable of sensing the impedance of the plurality of piezoresistors; and

an acceleration sensor configured to generate an acceleration signal.

63. A hybrid impact sensor as claimed in claim 62, wherein the plurality of piezoresistors includes sensing piezoresistors and reference piezoresistors.

64. A hybrid impact sensor as claimed in claim 63, wherein the impedance of the sensing piezoresistors is different than the impedance of the reference piezoresistors.

65. A hybrid impact sensor as claimed in claim 62, wherein the support is configured to receive stress waves.

66. A hybrid impact sensor as claimed in claim 62, wherein the semiconductor element is configured to be mounted along an entire surface of the support such that stress waves that travel through the support distort the semiconductor element.

67. A hybrid impact sensor as claimed in claim 62, wherein the one or more mounts of the support are located at ends of the support.

68. A hybrid impact sensor as claimed in claim 62, wherein the one or more mounts of the support are configured to be attached to a component requiring stress wave sensing.

69. A hybrid impact sensor as claimed in claim 68, wherein the one or more mounts of the support are configured to allow stress waves traveling through the component to also travel through the support.

70. A hybrid impact sensor as claimed in claim 62, wherein the circuit is configured to be mounted on a printed circuit board.

71. A hybrid impact sensor as claimed in claim 70, wherein the acceleration sensor is attached to the printed circuit board.

72. A hybrid impact sensor as claimed in claim 62, further comprising a connector configured to be coupled to at least one of the circuit, the acceleration sensor, and a control unit.

73. A hybrid impact sensor as claimed in claim 72, wherein the connector is further configured to output at least one of the impedance and the acceleration signal to the control unit.

74. A hybrid impact sensor as claimed in claim 62, further comprising a housing.

75. A hybrid impact sensor as claimed in claim 62, wherein the acceleration sensor is attached to the support.

76. A method for sensing impact to a structure, the method comprising:

providing a support with one or more mounts;

attaching a semiconductor element containing a plurality of piezoresistors, each having impedance, to the support;

connecting the support to the structure with the one or more mounts of the support;

providing an acceleration sensor configured to generate an acceleration signal;

encasing the support and the pressure sensor in a housing;

sensing the impedance of the plurality of piezoresistors;

and sensing the acceleration signal.

77. A method as claimed in claim 76, further comprising providing the plurality of piezoresistors including sensing piezoresistors and reference piezoresistors.

78. A method as claimed in claim 76, further comprising including sensing piezoresistors with different impedance than the reference piezoresistors.

79. A method as claimed in claim 76, further comprising attaching the semiconductor element along an entire surface of the support such that stress waves that travel through the support distort the semiconductor element.

80. A method as claimed in claim 76, further comprising mounting the circuit on a printed circuit board.

81. A method as claimed in claim 80, further comprising mounting the acceleration sensor to the printed circuit board.

82. A method as claimed in claim 76, further comprising transmitting at least one of the impedance and the acceleration signal to a control unit.

83. A method as claimed in claim 76, further comprising attaching the acceleration sensor to the support.

84. A hybrid impact sensor comprising:

a magnetostrictive sensor configured to provide a stress wave signal;

a pressure sensor configured to provide a pressure signal;

a housing encasing the magnetostrictive sensor and the pressure sensor; and

one or more mounts.

85. A hybrid impact sensor as claimed in claim 84, further comprising a connector configured to be coupled to at least one of the magnetostrictive sensor, the pressure sensor, and a control unit.

86. A hybrid impact sensor as claimed in claim 85, wherein the connector is further configured to output at least one of the stress wave signal and the pressure signal to the control unit.

87. A hybrid impact sensor as claimed in claim 84, wherein the one or more mounts are configured to be attached to a component of a vehicle.

88. A hybrid impact sensor as claimed in claim 84, further comprising potting material.

89. A hybrid impact sensor as claimed in claim 84, further comprising a support.

90. A hybrid impact sensor as claimed in claim 89, wherein the magnetostrictive sensor is attached to the support.

91. A hybrid impact sensor as claimed in claim 85, wherein the pressure sensor is attached to the magnetostrictive sensor.

92. A hybrid impact sensor as claimed in claim 89, wherein the pressure sensor is attached to the support.

93. A hybrid impact sensor as claimed in claim 89, wherein the one or more mounts are located at ends of the support.

94. A hybrid impact sensor as claimed in claim 84, wherein the housing includes an opening for the pressure sensor.

95. A hybrid impact sensor as claimed in claim 84, wherein the pressure sensor is configured to detect pressure within a vehicle door cavity.

96. A method for sensing impact to a structure, the method comprising:

providing one or more mounts;

providing a magnetostrictive sensor configured to generate a stress wave signal;

providing a pressure sensor configured to generate a pressure signal;

encasing the magnetostrictive sensor and the pressure sensor in a housing;

sensing the stress wave signal;

and sensing the pressure signal.

97. A method as claimed in claim 96, further comprising transmitting at least one of the stress wave sensor and the pressure signal to a control unit.

98. A method as claimed in claim 96, further comprising attaching the one or more mounts to a component of a vehicle.

99. A method as claimed in claim 96, further comprising filling the housing with potting material.

100. A method as claimed in claim 96, further comprising providing a support.

101. A method as claimed in claim 100, further comprising attaching the pressure sensor to the support.

102. A method as claimed in claim 100, further comprising attaching the magnetostrictive sensor to the support.

103. A method as claimed in claim 96, further comprising attaching the pressure sensor to the magnetostrictive sensor.

104. A method as claimed in claim 96, further comprising sensing the pressure signal within a door cavity of a vehicle.

105. A method as claimed in claim 96, further comprising providing an opening in the housing for the pressure sensor.

106. A hybrid impact sensor comprising:

a magnetostrictive sensor configured to provide a stress wave signal;

an acceleration sensor configured to provide an acceleration signal;

a housing encasing the magnetostrictive sensor and the acceleration sensor; and

one or more mounts.

107. A hybrid impact sensor as claimed in claim 106, further comprising a connector configured to be coupled to at least one of the magnetostrictive sensor, the acceleration sensor, and a control unit.

108. A hybrid impact sensor as claimed in claim 107, wherein the connector is further configured to output at least one of the stress wave signal and the acceleration signal to the control unit.

109. A hybrid impact sensor as claimed in claim 106, wherein the one or more mounts are configured to be attached to a component of a vehicle.

110. A hybrid impact sensor as claimed in claim 106, further comprising potting material.

111. A hybrid impact sensor as claimed in claim 106, further comprising a support.

112. A hybrid impact sensor as claimed in claim 111, wherein the magnetostrictive sensor is attached to the support.

113. A hybrid impact sensor as claimed in claim 106, wherein the acceleration sensor is attached to the magnetostrictive sensor.

114. A hybrid impact sensor as claimed in claim 111, wherein the acceleration sensor is attached to the support.

115. A hybrid impact sensor as claimed in claim 111, wherein the one or more mounts are located at ends of the support.

116. A method for sensing impact to a structure, the method comprising:

providing one or more mounts;

providing a magnetostrictive sensor configured to generate a stress wave signal;

providing an acceleration sensor configured to generate an acceleration signal;

encasing the magnetostrictive sensor and the acceleration sensor in a housing;

sensing the stress wave signal;

and sensing the acceleration signal.

117. A method as claimed in claim 116, further comprising transmitting at least one of the stress wave sensor and acceleration signal to a control unit.

118. A method as claimed in claim 116, further comprising attaching the one or more mounts to a component of a vehicle.

119. A method as claimed in claim 116, further comprising filling the housing with potting material.

120. A method as claimed in claim 116, further comprising providing a support.

121. A method as claimed in claim 120, further comprising attaching the acceleration sensor to the support.

122. A method as claimed in claim 120, further comprising attaching the magnetostrictive sensor to the support.

123. A method as claimed in claim 116, further comprising attaching the acceleration sensor to the magnetostrictive sensor.