Plasma processing apparatus and mounting unit thereof

• US 20050274324A1
• Filed: 03/31/2005
• Published: 12/15/2005
• Est. Priority Date: 06/04/2004
• Status: Abandoned Application

• Current Assignee: Tokyo Electron Limited
• Original Assignee: Tokyo Electron Limited
• Inventors: Kubota, Tomoya, Sasaki, Yasuharu, Higashiura, Tsutomu, Takahashi, Syuichi
• Application Number:
  US11/094,459
• Publication Number:
  US 20050274324A1
• Time in Patent Office: Days
• US Class Current: 118/723.E
• CPC Class Codes: H01J 37/32522 Temperature
• CPC Class Codes: H01J 37/32935 Monitoring and controlling tubes by information coming from the object and/or discharge
• CPC Class Codes: H01L 21/67248 Temperature monitoring
• CPC Class Codes: H01L 21/6831 using electrostatic chucks

Abstract

A parallel plate type plasma processing apparatus including a RF feed rod for applying a high frequency power to a susceptor and a temperature detection unit for detecting the temperature of a substrate on the susceptor is configured to reduce an effect that high frequency current flowing in the RF feed rod has on temperature detection of the temperature detection unit. A surface portion of the susceptor serves as a mounting unit including an electrostatic chuck and a heater. A shaft, which is a protection pipe extracted downward from the processing chamber, is provided under the mounting unit. A chuck electrode of the electrostatic chuck serves as an electrode for applying a high frequency voltage. Provided in the shaft are two RF feed rod for supplying a power to the electrode and an optical fiber, i.e., a temperature detection unit, having a dielectric fluorescent material is disposed in a leading end thereof. Then, the two RF feed rods and bar type conductive leads for the heater are alternately arranged at equal intervals in a circumferential direction on a circle having the optical fiber at the center thereof such that the region having therein the optical fiber is an electromagnetic wave-free region since the electric force lines respectively traveling from the RF feed rods to bar type conductive leads are offset with each other.

Claims

1. A plasma processing apparatus for converting a processing gas into a plasma by applying a high frequency power between a mounting table and an upper electrode installed to face each other in a processing chamber and performing a plasma processing on a substrate mounted on the mounting table, the plasma processing apparatus comprising:

a protection pipe having one end portion disposed at the mounting table;

a temperature detection unit for detecting substrate'"'"'s temperature, which is formed of a dielectric material, wherein the temperature detection unit has one end portion disposed at the mounting table and the other end is extracted to outside through the protection pipe;

power feed path members, provided in the protection pipe, for supplying a high frequency voltage to the mounting table;

a heating unit, disposed at the mounting table, for heating the substrate; and

conductive path members, provided in the protection pipe, for supplying a power to the heating unit,

wherein the power feed path members and the conductive path members are disposed such that the region having therein the temperature detection unit is an electromagnetic wave-free region where electromagnetic waves traveling from the power feed path members to the conductive path members are offset with each other.

2. The plasma processing apparatus of claim 1, wherein when there are even numbers of the power feed path members, the power feed path members and the conductive path members are arranged symmetrically with respect to any straight lines perpendicularly intersecting each other at a center of the temperature detection unit.

3. The plasma processing apparatus of claim 1, wherein when there are odd numbers of the power feed path members, the power feed path members and the same number of conductive path members as the power feed path members are alternately arranged at equal intervals in a circumferential direction on a circle having the temperature detection unit at the center thereof.

4. The plasma processing apparatus of any one of claims 1 to 3, wherein the temperature detection unit includes dielectric and conductive materials.

5. The plasma processing apparatus of any one of claims 1 to 4, wherein the temperature detection unit includes a dielectric layer disposed at a leading end of an optical fiber.

6. The plasma processing apparatus of claim 5, wherein the dielectric layer is covered with a conductive protection member.

7. The plasma processing apparatus of any one of claims 1 to 6, wherein a mounting surface portion of the mounting table is formed of an electrostatic chuck, having an electrode embedded in a dielectric material, for electrostatically attracting a substrate;

and

the power feed path members are configured to apply an electrostatic chuck DC voltage and a high frequency voltage for generating plasma to the electrode.

8. A plasma processing apparatus for converting a processing gas into a plasma by applying a high frequency power between a mounting table and an upper electrode installed to face each other in a processing chamber and performing a plasma processing on a substrate mounted on the mounting table, the plasma processing apparatus comprising:

a protection pipe having one end portion disposed at the mounting table;

a temperature detection unit for detecting substrate'"'"'s temperature, which is formed of a conductive material, wherein the temperature detection unit has one end portion disposed at the mounting table and the other end thereof is extracted to outside through the pipe; and

power feed path members, provided in the protection pipe, for supplying a high frequency voltage to the mounting table,

wherein in the region having therein the temperature detection unit formed of a conductive material, the power feed path members are alternately arranged at equal intervals in a circumferential direction on a circle having the temperature detection unit at the center thereof.

9. A mounting unit used in a parallel plate type plasma processing apparatus for performing a plasma processing on a substrate and having a mounting table main body to which a high frequency voltage is applied, comprising:

a protection pipe having one end portion disposed at the mounting table main body;

a temperature detection unit for detecting substrate'"'"'s temperature, which is formed of a dielectric material, wherein the temperature detection unit has one end portion disposed at the mounting table main body and the other end thereof is extracted to outside through the protection pipe;

power feed path members, provided in the protection pipe, for supplying a high frequency voltage to the mounting table main body;

a heating unit, disposed at the mounting table main body, for heating the substrate; and

conductive path members, provided in the protection pipe, for supplying a power to the heating unit,

wherein the power feed path members and the conductive path members are disposed such that the region having therein temperature detection unit is an electromagnetic wave-free region where electromagnetic waves traveling from the power feed path members to the conductive path members are offset with each other.

10. The mounting unit of the plasma processing apparatus of claim 9, wherein when there are even numbers of the power feed path members, the power feed path members and the conductive path members are arranged symmetrically with respect to any straight lines perpendicularly intersecting each other at a center of the temperature detection unit.

11. The mounting unit of the plasma processing apparatus of claim 9, wherein when there are odd numbers of the power feed path members, the power feed path members and the same number of conductive path members as the power feed path members are alternately arranged at equal intervals in a circumferential direction on a circle having the temperature detection unit at the center thereof.

12. The mounting unit of the plasma processing apparatus of any one of claims 9 to 11, wherein the temperature detection unit includes dielectric and conductive materials.

13. The mounting unit of the plasma processing apparatus of any one of claims 9 to 12, wherein a mounting surface portion of the mounting table main body is formed of an electrostatic chuck, having an electrode embedded in a dielectric material, for electrostatically attracting a substrate;

and

the power feed path members are configured to apply an electrostatic chuck DC voltage and a high frequency voltage for generating plasma to the electrode.