Methods for wet cleaning quartz surfaces of components for plasma processing chambers
First Claim
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1. A method for wet cleaning at least one quartz surface of a component for a plasma processing chamber in which semiconductor substrates are processed, the method comprising:
- a) contacting the at least one quartz surface of the component with at least one organic solvent effective to degrease and remove organic contaminants from the quartz surface;
b) after a), contacting the quartz surface with a weak basic solution which is effective to remove organic and metallic contaminants from the quartz surface;
c) after b), contacting the quartz surface with a first acid solution which is effective to remove metallic contaminants from the quartz surface;
d) after c), contacting the quartz surface with a second acid solution comprising hydrofluoric acid and nitric acid to remove metal contaminants from the quartz surface; and
e) optionally repeating d) at least once.
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Abstract
Methods for wet cleaning quartz surfaces of components for plasma processing chambers in which semiconductor substrates are processed, such as etch chambers and resist stripping chambers, include contacting the quartz surface with at least one organic solvent, a basic solution and different acid solutions, so as to remove organic and metallic contaminants from the quartz surface. The quartz surface is preferably contacted with one of the acid solutions at least two times.
82 Citations
25 Claims
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1. A method for wet cleaning at least one quartz surface of a component for a plasma processing chamber in which semiconductor substrates are processed, the method comprising:
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a) contacting the at least one quartz surface of the component with at least one organic solvent effective to degrease and remove organic contaminants from the quartz surface;
b) after a), contacting the quartz surface with a weak basic solution which is effective to remove organic and metallic contaminants from the quartz surface;
c) after b), contacting the quartz surface with a first acid solution which is effective to remove metallic contaminants from the quartz surface;
d) after c), contacting the quartz surface with a second acid solution comprising hydrofluoric acid and nitric acid to remove metal contaminants from the quartz surface; and
e) optionally repeating d) at least once. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10, 23, 24, 25)
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11. A method for wet cleaning at least one quartz surface of a component for a plasma processing chamber in which semiconductor substrates are processed, the method comprising:
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a) contacting the at least one quartz surface of the component with isopropyl alcohol and then with acetone to degrease and remove organic contaminants from the quartz surface;
b) after a), contacting the quartz surface with a solution comprising ammonium hydroxide and hydrogen peroxide to remove organic and metallic contaminants from the quartz surface;
c) after b), contacting the quartz surface with a first acid solution comprising hydrochloric acid to remove metallic contaminants from the quartz surface;
d) after c), contacting the quartz surface with a mixed second acid solution comprising hydrofluoric acid and nitric acid to remove metallic contaminants from the quartz surface; and
e) optionally repeating d) at least once. - View Dependent Claims (12, 13, 14, 15, 16, 17)
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18. A component for a plasma processing chamber in which semiconductor substrates are processed, the component comprising at least one quartz surface on which the amounts of Al, Ca, Cr, Cu, Fe, Li, Mg, Ni, K, Na, Ti, Zn, Co and Mo are as follows (x1010 atoms/cm2):
- Al≦
300;
Ca≦
95;
Cr≦
50;
Cu≦
50;
Fe≦
65;
Li≦
50;
Mg≦
50;
Ni≦
50;
K≦
100;
Na≦
100;
Ti≦
60, Zn≦
50, Co≦
30 and Mo≦
30. - View Dependent Claims (19, 20, 21, 22)
- Al≦
Specification