Compression of resin impregnated insulating tapes

• US 20050274450A1
• Filed: 04/15/2005
• Published: 12/15/2005
• Est. Priority Date: 06/15/2004
• Status: Active Grant

• Current Assignee: Siemens Energy Incorporated (Siemens AG)
• Original Assignee: Siemens Energy Incorporated (Siemens AG)
• Inventors: Smith, James B., Lutz, Andreas, Wood, John W., Stevens, Gary
• Granted Patent: US 7,553,438 B2
• Time in Patent Office: Days
• US Class Current: 156/187
• CPC Class Codes: C08J 5/04 Reinforcing macromolecular compounds with loose or coherent fibrous material
• CPC Class Codes: H01B 3/12 ceramics

Abstract

The present invention provides for a method of impregnating a matrix with a high thermal conductivity filled resin 32, which produces a resin impregnated matrix. The high thermal conductivity material 30 comprises 5-60% by volume of the resin 32. This is compressed by approximately 5-30%, and the distances between the high thermal conductivity materials loaded in the resin are reduced, and the resin is then cured.

Claims

1. A method of impregnating a matrix with a high thermal conductivity filled resin comprising:

impregnating said matrix with a high thermal conductivity material loaded resin, wherein said high thermal conductivity material comprises 5-60% by volume of said resin, to produce a resin impregnated matrix;

compressing said resin impregnated matrix by approximately 5-30% wherein distances between said high thermal conductivity materials loaded in said resin are reduced; and

curing said resin impregnated matrix;

wherein said high thermal conductivity materials comprises at least one of silica, alumina, magnesium oxide, silicon carbide, boron nitride, aluminum nitride, zinc oxide and diamonds and dendrimers of approximately 1-1000 nm in size, and wherein said high thermal conductivity materials have aspect ratios of 10-50.

2. The method of claim 1, wherein the distances between said high thermal conductivity materials loaded in said resin are approximately 5-50 nm.

3. The method of claim 1, wherein said resin impregnated matrix is compressed at least twice before curing.

4. A method of impregnating an insulating tape used with an electrically conducting object with a filled resin comprising:

impregnating said tape with a high thermal conductivity material loaded resin;

compressing said tape impregnated with said resin; and

curing said resin;

wherein said high thermal conductivity materials comprises at least one of silica, alumina, magnesium oxide, silicon carbide, boron nitride, aluminum nitride, zinc oxide and diamonds and dendrimers of approximately 1-1000 nm in size;

wherein said high thermal conductivity material comprises 5-60% by volume of said resin;

wherein phonons passing through said resin have a mean phonon path length;

wherein compressing said tape impregnated with said resin comprises reducing the spacing between said high thermal conductivity material within said resin to an average distance below that of said mean phonon path length.

5. The method of claim 4, wherein said tape is impregnated with said resin prior to being lapped about said electrically conducting object.

6. The method of claim 4, wherein said tape is impregnated with said resin after to being lapped about said electrically conducting object.

7. The method of claim 6, wherein said impregnation is performed by at least one of VPI and GVPI.

8. The method of claim 4, wherein said high thermal conductivity material comprises 25-40% by volume of said resin.

9. The method of claim 4, wherein said mean phonon path length is 2-100 nm.

10. The method of claim 4, wherein said high thermal conductivity materials have an aspect ration of 3-100.

11. The method of claim 4, wherein said high thermal conductivity materials are from 10 nm to 100 microns in length.

12. The method of claim 4, wherein high thermal conductivity materials are added to said tape prior to said resin being impregnated.

13. A method of adding high thermal conductivity materials to an insulating medium comprising:

adding high thermal conductivity materials that comprise at least one of silica, alumina, magnesium oxide, silicon carbide, boron nitride, aluminum nitride, zinc oxide and diamonds and dendrimers of approximately 1-1000 nm in size, to said insulating medium;

impregnating said insulating medium with a resin;

compressing said insulating medium approximately 5-30%; and

curing said resin;

wherein phonons passing through said insulating medium have a mean phonon path length;

wherein compressing said insulating medium reduces the spacing between said high thermal conductivity material within said insulating medium to an average distance below that of said mean phonon path length.

14. The method of claim 13, wherein said resin is filled with high thermal conductivity materials.

15. The method of claim 13, wherein said insulating medium is additionally compressed after said thermal conductivity materials are added and before said resin is impregnated.

16. The method of claim 15, wherein the total amount of compression for the two compressions is approximately 10-30%.

17. The method of claim 13, wherein said insulating medium is a tape.

18. The method of claim 13, wherein said high thermal conductivity materials have an aspect ration of 3-100.

19. The method of claim 13, wherein said high thermal conductivity materials are from 10 nm to 100 microns in length.

20. The method of claim 13, wherein said insulating medium is compressed prior to the impregnation of the resin.