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Contact sensor package structure

  • US 20050274597A1
  • Filed: 06/14/2004
  • Published: 12/15/2005
  • Est. Priority Date: 06/14/2004
  • Status: Active Grant
First Claim
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1. A contact sensor package structure, comprising:

  • a substrate;

    a film disposed over the substrate;

    a sealant for stationing the film on the substrate, wherein the substrate, the film and the sealant together define an enclosed space;

    a plurality of contact sensors disposed on the substrate within the enclosed space;

    at least a ground conductive trace disposed on the substrate; and

    an electrostatic charge dissipation layer formed on a surface of the film and electrically connected to the ground conductive trace, wherein an upper surface of the electrostatic charge dissipation layer serves as a contact surface for detecting contact with a work-piece.

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