Contact sensor package structure

• US 20050274597A1
• Filed: 06/14/2004
• Published: 12/15/2005
• Est. Priority Date: 06/14/2004
• Status: Active Grant

• Current Assignee: Advanced Semiconductor Engineering Inc (ASE Technology Holding Co., Ltd.)
• Original Assignee: Advanced Semiconductor Engineering Inc (ASE Technology Holding Co., Ltd.)
• Inventors: Yeh, Ying-Tsai, Lu, Yung-Li, Lin, Pei-Chi, Lee, Shih-Chang, Lee, Cheng-Yin
• Granted Patent: US 7,122,757 B2
• Time in Patent Office: Days
• US Class Current: 200/600
• CPC Class Codes: H03K 17/975 using a capacitive movable element
• CPC Class Codes: H03K 17/98 having a plurality of control members, e.g. keyboard
• CPC Class Codes: Y10T 428/30 Self-sustaining carbon mass or layer with impregnant or other layer

Abstract

A contact sensor package has a substrate, a film, a sealant and a plurality of contact sensors disposed on the substrate. The contact sensors are disposed within the enclosed space defined by the substrate, the film and the sealant. The contact sensor package further has at least a ground conductive trace formed on the substrate and an electrostatic charge dissipation layer formed on a surface of the film and electrically connected to the ground conductive trace. The electrostatic charge dissipation layer has an upper surface that serves as a contact surface for a detecting a contact work-piece.

Claims

1. A contact sensor package structure, comprising:

a substrate;

a film disposed over the substrate;

a sealant for stationing the film on the substrate, wherein the substrate, the film and the sealant together define an enclosed space;

a plurality of contact sensors disposed on the substrate within the enclosed space;

at least a ground conductive trace disposed on the substrate; and

an electrostatic charge dissipation layer formed on a surface of the film and electrically connected to the ground conductive trace, wherein an upper surface of the electrostatic charge dissipation layer serves as a contact surface for detecting contact with a work-piece.

2. The contact sensor package structure of claim 1, wherein a material constituting the electrostatic charge dissipation layer comprises indium-tin-oxide (ITO) compound.

3. The contact sensor package structure of claim 1, wherein a combined thickness of the electrostatic charge dissipation layer and the film does not exceed 12 μ

m.

4. The contact sensor package structure of claim 1, wherein the substrate further comprises a supporting element erected on the substrate surrounding the contact sensors such that the sealant is on top of the supporting element and the film is sealed over the top of the supporting element via the sealant.

5. The contact sensor package structure of claim 4, further comprising a chip on the substrate located outside of the supporting element.

6. The contact sensor package structure of claim 1, wherein the electrostatic charge dissipation layer entirely covers the upper surface of the film.

7. The contact sensor package structure of claim 1, wherein the electrostatic charge dissipation layer and the ground conductive trace are electrically connected by a conductive glue.

8. The contact sensor package structure of claim 1, wherein the package further comprises a conductive material for electrically connecting the electrostatic charge dissipation layer with the ground conductive trace such that the conductive ground trace and the conductive material are both disposed outside the enclosed space.

9. The contact sensor package structure of claim 1, wherein the package structure further comprises a conductive material for electrically connecting the electrostatic charge dissipation layer with the ground conductive trace such that the conductive ground trace and the conductive material are both disposed inside the enclosed space.

10. The contact sensor package structure of claim 1, wherein the substrate is a glass substrate.

11. The contact sensor package structure of claim 1, wherein the supporting element is an adhesive body.

12. The contact sensor package structure of claim 1, wherein the supporting element is in a ring structure.