Method of joining terminals by soldering
First Claim
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1. A method of joining terminals by soldering, comprising the steps of:
- (a) preparing a terminal having a flat portion and a solder joint, and a substrate on which solder has previously been applied;
(b) pressing said solder joint of said terminal against said solder in order to bend said flat portion;
(c) heating said solder joint of said terminal; and
(d) stopping said heating of said solder joint, after immersing said solder joint of said terminal into said solder that is molten by said heating by utilizing springback of said flat portion.
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Abstract
A method of joining terminals by soldering is provided which allows control of increasing gas supply even in soldering performed in a gas atmosphere within a gas chamber. Utilizing a springback phenomenon occurring at a flat portion of a terminal, a solder joint of the terminal is immersed in molten solder. Then, laser soldering is performed using a gas chamber made of a material which transmits a laser beam at least in part.
21 Citations
9 Claims
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1. A method of joining terminals by soldering, comprising the steps of:
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(a) preparing a terminal having a flat portion and a solder joint, and a substrate on which solder has previously been applied;
(b) pressing said solder joint of said terminal against said solder in order to bend said flat portion;
(c) heating said solder joint of said terminal; and
(d) stopping said heating of said solder joint, after immersing said solder joint of said terminal into said solder that is molten by said heating by utilizing springback of said flat portion. - View Dependent Claims (2, 3)
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4. A method of joining terminals by soldering, comprising the steps of:
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(a) preparing a terminal having a solder joint, a substrate on which solder has previously been applied, a laser beam source that is capable of emitting a laser beam, and a gas chamber that is made of a material which transmits said laser beam at least in part;
(b) bringing said terminal and said substrate into said gas chamber, with said solder and said solder joint of said terminal in contact with each other, and filling said gas chamber with a gas including an inert gas or a gas mixture of an inert gas and a reducing gas;
(c) heating said solder joint of said terminal by emitting said laser beam from said laser beam source and by applying said laser beam which transmits said gas chamber, to said solder joint; and
(d) stopping said heating of said solder joint, after immersing said solder joint of said terminal into said solder that is molten by said heating. - View Dependent Claims (5, 6, 7, 8, 9)
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Specification