Imaging and electronic apparatus

• US 20050274883A1
• Filed: 05/27/2005
• Published: 12/15/2005
• Est. Priority Date: 06/11/2004
• Status: Abandoned Application

• Current Assignee: Canon Kabushiki Kaisha (Canon Inc.)
• Original Assignee: Canon Kabushiki Kaisha (Canon Inc.)
• Inventors: Nagano, Masatoshi
• Application Number:
  US11/139,259
• Publication Number:
  US 20050274883A1
• Time in Patent Office: Days
• US Class Current: 250/239
• CPC Class Codes: G02B 7/025 using glue
• CPC Class Codes: H01L 27/14618 Containers
• CPC Class Codes: H01L 27/14625 Optical elements or arrangements associated with the device
• CPC Class Codes: H01L 2924/00 Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/0002 Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
• CPC Class Codes: H01L 31/0203 Containers; Encapsulations , e.g. encapsulation of photodiodesfor photovoltaic devices H01L31/048; for organic photosensitive devices H10K30/80
• CPC Class Codes: H01L 31/02325 the optical elements not being integrated nor being directly associated with the device

Abstract

An imaging apparatus is provided having a transparent module with a lens unit, a holding module, and an image sensor.

Claims

1. An imaging apparatus comprising:

a transparent module, wherein the transparent module has a first surface and a second surface opposed to the first surface, the transparent module comprising a lens unit in a first region on the first surface;

a holding module, wherein the holding module is configured to support the transparent module, the holding module being bonded to a second region on the first surface of the transparent module with an adhesive agent, the second region being different from the first region;

a photoelectric transducer, wherein the photoelectric transducer is configured to photoelectrically convert light passing through the transparent module;

an aperture module, wherein the aperture module has an aperture opening, the aperture module being disposed in a third region on the second surface of the transparent module, the third region being opposed to the first region; and

a light-shielding module, wherein the light-shielding module is disposed in a fourth region on the second surface of the transparent module, the fourth region being opposed to the second region.

2. The imaging apparatus according to claim 1, wherein the adhesive agent is a light curing adhesive agent.

3. The imaging apparatus according to claim 1, wherein the aperture module is disposed on the second surface by using one of an evaporation method and a printing method.

4. The imaging apparatus according to claim 1, wherein the light-shielding module is disposed on the second surface by using one of a printing method and a bonding method.

5. The imaging apparatus according to claim 1, wherein the first surface is a surface of the transparent module on the photoelectric transducer side.

6. The imaging apparatus according to claim 1, wherein the transparent module comprises a plurality of lens units and the aperture module has a plurality of aperture openings.

7. The imaging apparatus according to claim 1, further comprising an electric wiring board between the holding module and the photoelectric transducer.

8. An electronic apparatus comprising:

the imaging apparatus according to claim 1;

and

an apparatus body containing the imaging apparatus.

9. The imaging apparatus according to claim 1, further comprising:

a second aperture module, wherein the second aperture module is disposed in the first region.

10. An imaging apparatus comprising:

a lens unit, wherein the lens unit includes at least one lens element;

an image sensor chip, wherein the image sensor chip is operatively connected to the lens unit and includes;

a light-receiving area, wherein the light receiving area includes at least one light receiving region; and

a light shielding module, wherein the light shielding module is operatively connected to the lens unit and the image sensor chip, where a region between the lens unit and the image sensor chip has been isolated from an outside gaseous region.

11. The image apparatus according to claim 10, wherein the lens unit has at least two lens elements, a first lens element and a second lens element, wherein the light receiving area has at least two light receiving regions, a first light receiving region and a second light receiving region.

12. The image apparatus according to claim 11, wherein a first portion of a first light passing through the first lens element becomes incident upon the first light receiving region, and a second portion of a second light passing through the second lens element becomes incident upon the second light receiving region.

13. The image apparatus according to claim 12, further comprising a color filter layer, wherein the color filter layer includes at least two color filters, a first color filter and a second color filter.

14. The image apparatus according to claim 13, wherein the first color filter is disposed between the first lens element and the first light receiving region, and the second color filter lies between the second lens element and the second light receiving region.

15. The image apparatus according to claim 14, wherein the first color filter lets light of a first wavelength through the first color filter, and the second color filter lets light of a second wavelength through the second color filter, wherein the first and second wavelengths are not equal.

16. A method comprising:

forming conductive foil patterns on a first side of an insulating sheet;

bonding a holding module to second side of the insulating sheet, wherein the first side is opposite the second side;

aligning the conductive foil patterns with conductive bumps on an image sensor chip;

rotating the holding module, the insulating sheet, the conductive foil patterns, and the image sensor chip in unison;

bonding a transparent module to the holding module, wherein the transparent module includes a lens unit; and

sealing the holding module, the insulating sheet, the image sensor chip and the transparent module from an outside gaseous environment via a first sealing material.

17. The method according to claim 16, wherein the rotation is substantially 180 degrees.

18. The method according to claim 16, further comprising:

forming an aperture layer on the side of the transparent module opposite the side bonded to the holding module.

19. The method according to claim 18 further comprising:

adjusting the focus and tilt of the lens unit prior to bonding the transparent module to the holding module.

20. The method according to claim 19 further comprising:

sealing the entire periphery of the image apparatus, wherein the image apparatus includes, the holding module, the insulating sheet, the image sensor chip, the transparent module, the conductive foil patterns, the lens unit, and the first sealing material.