Wafer-level hermetic micro-device packages
First Claim
1. A hermetically sealed micro-device package encapsulating a micro-device and including a transparent window allowing light to pass into and out of a cavity containing the micro device, comprising:
- a semiconductor substrate having a micro-device operably disposed thereupon, the substrate having a first frame-attachment area formed thereupon having a plan that circumscribes the micro-device;
a sheet of transparent material having a window aperture portion defined thereupon, the sheet having a second frame-attachment area formed thereupon having a plan that circumscribes the window aperture portion; and
a frame/spacer positioned between, and hermetically bonded to, the semiconductor substrate and the transparent sheet, the frame including a continuous sidewall having a plan on one side substantially corresponding to, and substantially in register with, the plan of tie fit frame-attachment area, having a plan on the opposite side substantially corresponding to, and substantially in register with, the plan of the second frame-attachment area, and having a height that exceeds the height of the micro-device.
2 Assignments
0 Petitions
Accused Products
Abstract
A hermetically sealed micro-device package encapsulating a micro-device and including a transparent window allowing light to pass into and out of a cavity containing the micro-device comprises a semiconductor substrate having a micro-device operably disposed thereupon. The substrate has a first frame-attachment area formed thereupon having a plan that circumscribes the micro-device. A sheet of transparent material has a window aperture portion defined thereupon, the sheet having a second frame-attachment area formed thereupon having a plan that circumscribes the window aperture portion. A frame/spacer is positioned between, and hermetically bonded to, the semiconductor substrate and the transparent sheet, the frame/spacer including a continuous sidewall having a plan on one side substantially corresponding to, and substantially in register with, the plan of the first frame-attachment area, having a plan on the opposite side substantially corresponding to, and substantially in register with, the plan of the second frame-attachment area, and having a height that exceeds the height of the micro-device.
-
Citations
17 Claims
-
1. A hermetically sealed micro-device package encapsulating a micro-device and including a transparent window allowing light to pass into and out of a cavity containing the micro device, comprising:
-
a semiconductor substrate having a micro-device operably disposed thereupon, the substrate having a first frame-attachment area formed thereupon having a plan that circumscribes the micro-device;
a sheet of transparent material having a window aperture portion defined thereupon, the sheet having a second frame-attachment area formed thereupon having a plan that circumscribes the window aperture portion; and
a frame/spacer positioned between, and hermetically bonded to, the semiconductor substrate and the transparent sheet, the frame including a continuous sidewall having a plan on one side substantially corresponding to, and substantially in register with, the plan of tie fit frame-attachment area, having a plan on the opposite side substantially corresponding to, and substantially in register with, the plan of the second frame-attachment area, and having a height that exceeds the height of the micro-device. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8)
-
-
9. A multi-package assembly including a plurality of hermetically sealed cavities hermetically separated from one another by frame sidewalls, each of the cavities containing a micro-device positioned below a transparent window aperture allowing light to pass into and out of the cavity, the assembly comprising:
-
a unitary semiconductor substrate having a plurality of micro-devices operably disposed thereupon, the substrate having a first frame-attachment area formed thereupon having a plan that circumscribes each of the micro-devices;
a unitary sheet of transparent material, the sheet having a second frame-attachment area from thereupon having a plan that circumscribes a plurality of transparent window aperture positions of the sheet;
a frame including a plurality of sidewalls, the sidewalls collectively having a plan on one side of the frame that substantially corresponds to, and is substantially in register with, the plan of the first frame-attachment area, having a plan on the opposite side of the frame that substantially corresponds to, and is substantially in register with, the plan of the second frame-attachment area, and having a height that exceeds the height of the micro-devices as disposed on the substrate;
wherein the semiconductor substrate, frame and transparent sheet are hermetically bonded together along the first and second frame attachment areas to form a plurality of hermetically sealed cavities separated from one another by the frame sidewalls, each of the cavities containing a micro-device positioned below one of the window aperture portions of the sheet. - View Dependent Claims (10, 11, 12, 13, 14, 15, 16, 17)
-
Specification