RADIO FREQUENCY IDENTIFICATION SYSTEM

• US 20050276028A1
• Filed: 06/02/2005
• Published: 12/15/2005
• Est. Priority Date: 06/15/2004
• Status: Active Grant

• Current Assignee: Chartered Semiconductor Manufacturing Incorporated (Mamoura Diversified Global Holding PJSC)
• Original Assignee: Chartered Semiconductor Manufacturing Incorporated (Mamoura Diversified Global Holding PJSC)
• Inventors: Tan, Victor, Cheong, Kai Keong, Bay, Stanley, Yeo, David, Yong, Anthony, Lo, Marvin
• Granted Patent: US 7,444,735 B2
• Time in Patent Office: Days
• US Class Current: 361/760
• CPC Class Codes: G06K 19/07749 the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card
• CPC Class Codes: G06K 19/0775 arrangements for connecting the integrated circuit to the antenna
• CPC Class Codes: G08B 13/2417 having a radio frequency identification chip
• CPC Class Codes: G08B 13/2437 Tag layered structure, processes for making layered tags
• CPC Class Codes: Y10T 29/49016 Antenna or wave energy "plumbing" making
• CPC Class Codes: Y10T 29/49018 with other electrical component
• CPC Class Codes: Y10T 29/49128 Assembling formed circuit to base
• CPC Class Codes: Y10T 29/49144 by metal fusion
• CPC Class Codes: Y10T 29/49155 Manufacturing circuit on or in base

Abstract

A system for manufacturing an integrated circuit system having a substrate with a integrated circuit device. A first pad is formed on the substrate and connected to the integrated circuit device. A first dielectric layer is formed over the substrate and the first pad, with the first dielectric layer having an opening provided therein exposing the first pad. An upper redistribution layer is formed over the first dielectric layer. A portion of the upper redistribution layer is formed into an antenna with the antenna connected to the first pad. A second dielectric layer is formed over the first dielectric layer and over the antenna.

Claims

1. A system for manufacturing an integrated circuit system comprising:

forming a substrate having an integrated circuit device;

forming a first pad on the substrate connected to the integrated circuit device;

forming a first dielectric layer over the substrate and the first pad, the first dielectric layer having an opening provided therein exposing the first pad;

forming an upper redistribution layer over the first dielectric layer;

forming at least a portion of the upper redistribution layer into an antenna, the antenna connected to the first pad; and

forming a second dielectric layer over the first dielectric layer and over the antenna.

2. The system as claimed in claim 1 further comprising forming a lower redistribution layer on the first pad and connected to the antenna.

3. The system as claimed in claim 1 further comprising forming a pillar on the first pad and over the first dielectric layer, the pillar connected to the antenna.

4. The system as claimed in claim 1 further comprising:

forming a first pillar on the first pad;

forming a third dielectric layer over the first pillar, the third dielectric layer having an opening provided therein exposing the first pillar; and

forming a second pillar on the pad in the opening in the third dielectric layer, the second pillar in contact with the antenna.

5. The system as claimed in claim 1 further comprising:

forming a plurality of pillars on the pad, the plurality of pillars connected to one end of the antenna;

forming a second pillar connected to the other end of the antenna; and

forming a second pad connected to the second pillar.

6. A system for manufacturing an integrated circuit system comprising:

forming a substrate having a radio frequency identfification (RFID) integrated circuit device;

forming a first pad on the substrate connected to the RFID integrated circuit device;

forming a first dielectric layer over the substrate and the first pad, the first dielectric layer having an opening provided therein exposing the first pad;

forming an upper redistribution layer over the first dielectric layer;

forming at least a portion of the upper redistribution layer into an antenna, the antenna connected to the first pad; and

forming a second dielectric layer over the first dielectric layer and over the antenna.

7. The system as claimed in claim 6 further comprising forming a lower redistribution layer on the first pad and connected to the antenna.

8. The system as claimed in claim 6 further comprising forming a pillar on the first pad and over the first dielectric layer, the pillar connected to the antenna.

9. The system as claimed in claim 6 further comprising:

forming a first pillar on the first pad;

forming a third dielectric layer over the first pillar, the third dielectric layer having an opening provided therein exposing the first pillar; and

forming a second pillar on the pad in the opening in the third dielectric layer, the second pillar in contact with the antenna.

10. The system as claimed in claim 6 further comprising:

forming a plurality of pillars on the pad, the plurality of pillars connected to one end of the antenna;

forming a second pillar connected to the other end of the antenna; and

forming a second pad connected to the second pillar.

11. An integrated circuit system comprising:

a substrate having an integrated circuit device;

a first pad on the substrate connected to the integrated circuit device;

a first dielectric layer over the substrate and the first pad, the first dielectric layer having an opening provided therein exposing the first pad;

an upper redistribution layer over the first dielectric layer;

an antenna comprising at least a portion of the upper redistribution layer, the antenna connected to the first pad; and

a second dielectric layer over the first dielectric layer and over the antenna.

13. The system as claimed in claim 11 further comprising forming a pillar on the first pad and over the first dielectric layer, the pillar connected to the antenna.

15. The system as claimed in claim 11 further comprising:

forming a plurality of pillars on the pad, the plurality of pillars connected to one end of the antenna;

forming a second pillar connected to the other end of the antenna; and

forming a second pad connected to the second pillar.

12. The system as claimed in claim 111 further comprising a lower redistribution layer on the first pad and connected to the antenna.

14. The system as claimed in claim 111 further comprising:

a first pillar on the first pad;

a third dielectric layer over the first pillar, the third dielectric layer having an opening provided therein exposing the first pillar; and

a second pillar on the pad in the opening in the third dielectric layer, the second pillar in contact with the antenna.

16. An integrated circuit system comprising:

a substrate having a radio frequency identfification (RFID) integrated circuit device;

a first pad on the substrate connected to the RFID integrated circuit device;

a first dielectric layer over the substrate and the first pad, the first dielectric layer having an opening provided therein exposing the first pad;

an upper redistribution layer over the first dielectric layer;

an antenna comprising at least a portion of the upper redistribution layer into, the antenna connected to the first pad; and

a second dielectric layer over the first dielectric layer and over the antenna.

17. The system as claimed in claim 16 further comprising a lower redistribution layer on the first pad and connected to the antenna.

18. The system as claimed in claim 16 further comprising a pillar on the first pad and over the first dielectric layer, the pillar connected to the antenna.

19. The system as claimed in claim 16 further comprising:

a first pillar on the first pad;

a third dielectric layer over the first pillar, the third dielectric layer having an opening provided therein exposing the first pillar; and

a second pillar on the pad in the opening in the third dielectric layer, the second pillar in contact with the antenna.

20. The system as claimed in claim 16 further comprising:

a plurality of pillars on the pad, the plurality of pillars connected to one end of the antenna;

a second pillar connected to the other end of the antenna; and

a second pad connected to the second pillar.