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Sensor design and process

  • US 20050277219A1
  • Filed: 08/22/2005
  • Published: 12/15/2005
  • Est. Priority Date: 03/17/1999
  • Status: Active Grant
First Claim
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1. A method of fabricating a sensor element, comprising:

  • using a first process to fabricate a measurement mass wafer for detecting acceleration, the measurement mass wafer including a mass housing having a cavity, and a spring mass assembly positioned within the cavity;

    fabricating a top cap wafer using the first process;

    fabricating a bottom cap wafer using the first process;

    bonding the top cap wafer to a side of the measurement mass wafer using a bonding process;

    bonding the bottom cap wafer to another side of the measurement mass wafer using the bonding process; and

    making one or more dicing cuts at predetermined locations on the sensor element.

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