Sensor design and process
First Claim
1. A method of fabricating a sensor element, comprising:
- using a first process to fabricate a measurement mass wafer for detecting acceleration, the measurement mass wafer including a mass housing having a cavity, and a spring mass assembly positioned within the cavity;
fabricating a top cap wafer using the first process;
fabricating a bottom cap wafer using the first process;
bonding the top cap wafer to a side of the measurement mass wafer using a bonding process;
bonding the bottom cap wafer to another side of the measurement mass wafer using the bonding process; and
making one or more dicing cuts at predetermined locations on the sensor element.
4 Assignments
0 Petitions
Accused Products
Abstract
An accelerometer (305) for measuring seismic data. The accelerometer (305) includes an integrated vent hole for use during a vacuum sealing process and a balanced metal pattern for reducing cap wafer bowing. The accelerometer (305) also includes a top cap press frame recess (405) and a bottom cap press frame recess (420) for isolating bonding pressures to specified regions of the accelerometer (305). The accelerometer (305) is vacuum-sealed and includes a balanced metal pattern (730) to prevent degradation of the performance of the accelerometer (305). A dicing process is performed on the accelerometer (305) to isolate the electrical leads of the accelerometer (305). The accelerometer (305) further includes overshock protection bumpers (720) and patterned metal electrodes to reduce stiction during the operation of the accelerometer (305).
-
Citations
20 Claims
-
1. A method of fabricating a sensor element, comprising:
-
using a first process to fabricate a measurement mass wafer for detecting acceleration, the measurement mass wafer including a mass housing having a cavity, and a spring mass assembly positioned within the cavity;
fabricating a top cap wafer using the first process;
fabricating a bottom cap wafer using the first process;
bonding the top cap wafer to a side of the measurement mass wafer using a bonding process;
bonding the bottom cap wafer to another side of the measurement mass wafer using the bonding process; and
making one or more dicing cuts at predetermined locations on the sensor element. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10, 11, 12, 13, 14, 15, 16, 17, 18)
-
-
19. A method of fabricating a micro-machined accelerometer, comprising:
-
forming a measurement mass wafer for detecting acceleration using a first process, the measurement mass wafer including a mass housing having a cavity, and a spring mass assembly positioned within the cavity;
forming at least one cap wafer using a balanced metal pattern for reducing bowing of the cap wafer; and
bonding the cap wafer to a side of the measurement mass wafer using a bonding process.
-
-
20. A micro-machined accelerometer, comprising:
-
a measurement mass wafer for detecting acceleration, the measurement mass wafer including a mass housing having a cavity, and a spring mass assembly positioned within the cavity; and
at least one cap wafer having a balanced metal pattern for reducing bowing of the cap wafer, the at least one cap wafer being bonded to a side of the measurement mass wafer.
-
Specification