Underfill and encapsulation of semicondcutor assemblies with materials having differing properties and methods of fabrication using stereolithography
First Claim
1. A semiconductor device assembly comprising:
- at least one semiconductor die having lateral sides, a back side, and an active surface including a plurality of discrete conductive elements projecting therefrom; and
a carrier substrate bearing a plurality of conductive traces in electrical communication with the plurality of discrete conductive elements;
wherein at least a portion of the semiconductor device assembly is covered with a first cured photopolymer material, wherein the first cured photopolymer material comprising a polymerized matrix having a plurality of discrete particles dispersed therethrough.
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Accused Products
Abstract
Polymerized materials for forming the underfill and encapsulation structures for semiconductor package are disclosed. A filler constituent, such as boron nitride, silicates, elemental metals, or alloys, may be added to a liquid photopolymer resin to tailor the physical properties thereof upon curing. The filler constituents may be employed to alter the coefficient of thermal expansion, thermal conductivity, or electrical conductivity of the polymerized material. A number of different embodiments are disclosed that employ the above materials in selected regions of the underfill and encapsulation structures of the semiconductor package. The polymerized materials may also be used to form support structures and covers for optically interactive semiconductor devices. Methods for forming the above structures using stereolithography are also disclosed.
142 Citations
50 Claims
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1. A semiconductor device assembly comprising:
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at least one semiconductor die having lateral sides, a back side, and an active surface including a plurality of discrete conductive elements projecting therefrom; and
a carrier substrate bearing a plurality of conductive traces in electrical communication with the plurality of discrete conductive elements;
wherein at least a portion of the semiconductor device assembly is covered with a first cured photopolymer material, wherein the first cured photopolymer material comprising a polymerized matrix having a plurality of discrete particles dispersed therethrough. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10, 11, 12, 13, 14, 15, 16, 17)
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18. A method of forming a semiconductor package, comprising:
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providing a carrier substrate bearing a plurality of conductive traces;
securing at least one semiconductor die having lateral sides, a back side, and an active surface including a plurality of discrete conductive elements projecting therefrom by the plurality of discrete conductive elements to the conductive traces of the carrier substrate to form a semiconductor device assembly;
immersing the semiconductor device assembly in a first liquid photopolymerizable resin including a plurality of discrete particles dispersed therethrough; and
selectively at least partially curing portions of the first liquid photopolymerizable resin adjacent the at least one semiconductor die. - View Dependent Claims (19, 20, 21, 22, 23, 24, 25, 26, 27, 28, 29, 30)
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31. A method of forming a semiconductor package comprising:
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providing a carrier substrate having a plurality of conductive traces;
immersing the carrier substrate in a first liquid photopolymerizable resin to cover the carrier substrate with a layer thereof, the first liquid photopolymerizable resin having a first coefficient of thermal expansion in a cured state;
selectively at least partially curing the layer of the first liquid photopolymerizable resin to form a first layer exposing at least a portion of the plurality of the conductive traces through a plurality of apertures;
depositing a conductive material in the plurality of apertures;
securing at least one semiconductor die including a plurality of discrete conductive elements to the carrier substrate to form a semiconductor device assembly, the plurality of discrete conductive elements in electrical communication with the plurality of conductive traces of the carrier substrate;
immersing the semiconductor device assembly in a second liquid photopolymerizable resin, the second liquid photopolymerizable resin having a second coefficient of thermal expansion in a cured state less than the first coefficient of thermal expansion; and
selectively at least partially curing the second liquid photopolymerizable resin to form a second layer that fills at least a portion of a region between the first layer and the at least one semiconductor die and substantially seals the at least one semiconductor die. - View Dependent Claims (32, 33, 34, 35, 36)
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37. A semiconductor package comprising:
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at least one semiconductor die having an active surface including an array of optically interactive semiconductor devices; and
a substantially opaque support structure that surrounds the array of optically interactive semiconductor devices formed from a first cured photopolymer material. - View Dependent Claims (38, 39, 40, 41, 42, 43, 44)
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45. A method of forming a semiconductor package, comprising:
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providing at least one semiconductor die having an active surface including an array of optically interactive semiconductor devices;
immersing the at least one semiconductor die in a first liquid photopolymerizable resin; and
selectively at least partially curing portions of the first liquid photopolymerizable resin surrounding a periphery of the array to form a substantially opaque support structure. - View Dependent Claims (46, 47, 48, 49, 50)
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Specification