SUBSTRATE CONTACT ANALYSIS

• US 20050278678A1
• Filed: 06/14/2004
• Published: 12/15/2005
• Est. Priority Date: 06/14/2004
• Status: Active Grant

• Current Assignee: Bell Semiconductor, LLC (Hilco Inc. (d/b/a Hilco Global))
• Original Assignee: LSI Logic Corporation (Broadcom, Inc.)
• Inventors: Whitefield, Bruce J., Abarcrombie, David A.
• Granted Patent: US 7,013,192 B2
• Time in Patent Office: Days
• US Class Current: 716/56
• CPC Class Codes: G05B 19/41875 characterised by quality surveillance of production
• CPC Class Codes: G05B 2219/37224 Inspect wafer
• CPC Class Codes: G05B 2219/45031 Manufacturing semiconductor wafers
• CPC Class Codes: Y02P 90/02 Total factory control, e.g. smart factories, flexible manufacturing systems [FMS] or integrated manufacturing systems [IMS]

Abstract

A method of analyzing substrate yield, where a substrate yield map and a substrate contact map are selected and overlaid to produce a composite map. First elements of the substrate yield map are compared to second elements of the substrate contact map to determine a degree of correlation between the first elements and the second elements. Additional substrate contact maps are repeatedly selected and the first elements of the substrate yield map are compared to the second elements of the additional substrate contact maps, and a degree of correlation between the first elements and each of the second elements for the additional substrate contact maps is determined and reported. The composite map having a highest degree of correlation between the first elements and the second elements is presented, and all composite maps that have at least a desired degree of correlation between the first elements and the second elements are presented.

Claims

1. A system for analyzing substrate yield, the system comprising:

means for selecting a substrate yield map,

means for selecting a substrate contact map, and

means for overlaying the substrate yield map and the substrate contact map and producing a composite map.

2. The system of claim 1, further comprising means for comparing first elements of the substrate yield map to second elements of the substrate contact map and determining a degree of correlation between the first elements and the second elements.

3. The system of claim 1, further comprising:

means for comparing first elements of the substrate yield map to second elements of the substrate contact map and determining a degree of correlation between the first elements and the second elements, and

means for repeatedly selecting additional substrate contact maps, and comparing the first elements of the substrate yield map to the second elements of the additional substrate contact maps, and determining a degree of correlation between the first elements and each of the second elements for the additional substrate contact maps, and reporting the degrees of correlation between the first elements and all sets of the second elements.

4. The system of claim 1, further comprising:

means for comparing first elements of the substrate yield map to second elements of the substrate contact map and determining a degree of correlation between the first elements and the second elements,

means for repeatedly selecting additional substrate contact maps, and comparing the first elements of the substrate yield map to the second elements of the additional substrate contact maps, and determining a degree of correlation between the first elements and each of the second elements for the additional substrate contact maps, and reporting the degrees of correlation between the first elements and the second elements, and

means for presenting the composite map having a highest degree of correlation between the first elements and the second elements.

5. The system of claim 1, further comprising:

means for comparing first elements of the substrate yield map to second elements of the substrate contact map and determining a degree of correlation between the first elements and the second elements,

means for repeatedly selecting additional substrate contact maps, and comparing the first elements of the substrate yield map to the second elements of the additional substrate contact maps, and determining a degree of correlation between the first elements and each of the second elements for the additional substrate contact maps, and reporting the degrees of correlation between the first elements and the second elements, and

means for presenting all composite maps that have at least a desired degree of correlation between the first elements and the second elements.

6. The system of claim 1, wherein the substrate contact map is stored in a database of substrate contact maps.

7. The system of claim 1, wherein the substrate contact map is associated with contact information that describes characteristics of the contact map.

8. The system of claim 1, wherein the substrate contact map is associated with contact information that describes characteristics of the contact map, where the characteristics include at least one of contact location, contact type, contact material, contact vector, and contact pressure.

9. The system of claim 1, wherein the substrate contact map is associated with contact information that describes characteristics of the contact map, and the substrate contact map and the contact information is stored in a common database.

10. A system for analyzing substrate yield, the system comprising:

means for selecting a substrate yield map having first elements in first positions according to a coordinate position system,

means for selecting a substrate contact map having second elements in second positions according to the coordinate position system,

means for overlaying the substrate yield map and the substrate contact map and producing a composite map including both the first elements and the second elements according to the coordinate position system,

means for comparing the first positions of the first elements to the second positions of the second elements and determining a degree of correlation between the first elements and the second elements,

means for repeatedly selecting additional substrate contact maps, and comparing the first positions of the first elements of the substrate yield map to the second positions of the second elements of the additional substrate contact maps, and determining a degree of correlation between the first elements and each of the second elements for the additional substrate contact maps, and reporting the degrees of correlation between the first elements and sets of the second elements, and

means for presenting all composite maps that have at least a desired degree of correlation between the first elements and the second elements.

11. The system of claim 10, wherein the substrate contact map is associated with contact information that describes characteristics of the contact map, where the characteristics include at least one of contact identification, contact type, contact material, contact vector, and contact pressure, and the substrate contact map and the contact information are stored in a common database.

12. A method of analyzing substrate yield, the method comprising the steps of:

selecting a substrate yield map,

selecting a substrate contact map, and

overlaying the substrate yield map and the substrate contact map and producing a composite map.

13. The method of claim 12, further comprising the steps of comparing first elements of the substrate yield map to second elements of the substrate contact map and determining a degree of correlation between the first elements and the second elements.

14. The method of claim 12, further comprising the steps of:

comparing first elements of the substrate yield map to second elements of the substrate contact map and determining a degree of correlation between the first elements and the second elements, and

repeatedly selecting additional substrate contact maps, and comparing the first elements of the substrate yield map to the second elements of the additional substrate contact maps, and determining a degree of correlation between the first elements and each of the second elements for the additional substrate contact maps, and reporting the degrees of correlation between the first elements and sets of the second elements.

15. The method of claim 12, further comprising the steps of:

comparing first elements of the substrate yield map to second elements of the substrate contact map and determining a degree of correlation between the first elements and the second elements,

repeatedly selecting additional substrate contact maps, and comparing the first elements of the substrate yield map to the second elements of the additional substrate contact maps, and determining a degree of correlation between the first elements and each of the second elements for the additional substrate contact maps, and reporting the degrees of correlation between the first elements and the second elements, and

presenting the composite map having a highest degree of correlation between the first elements and the second elements.

16. The method of claim 12, further comprising the steps of:

comparing first elements of the substrate yield map to second elements of the substrate contact map and determining a degree of correlation between the first elements and the second elements,

repeatedly selecting additional substrate contact maps, and comparing the first elements of the substrate yield map to the second elements of the additional substrate contact maps, and determining a degree of correlation between the first elements and each of the second elements for the additional substrate contact maps, and reporting the degrees of correlation between the first elements and the second elements, and

presenting all composite maps that have at least a desired degree of correlation between the first elements and the second elements.

17. The method of claim 12, wherein the substrate contact map is stored in a database of substrate contact maps.

18. The method of claim 12, wherein the substrate contact map is associated with contact information that describes characteristics of the contact map.

19. The method of claim 12, wherein the substrate contact map is associated with contact information that describes characteristics of the contact map, where the characteristics include at least one of contact location identification, contact type, contact material, contact vector, and contact pressure.

20. The method of claim 12, wherein the substrate contact map is associated with contact information that describes characteristics of the contact map, and the substrate contact map and the contact information are stored in a common database.