Methods of scanning an object that includes multiple regions of interest using an array of scanning beams

• US 20050279936A1
• Filed: 03/09/2005
• Published: 12/22/2005
• Est. Priority Date: 06/21/2004
• Status: Active Grant

• Current Assignee: Applied Materials Israel Limited (Applied Materials Incorporated)
• Original Assignee: Applied Materials Israel Limited (Applied Materials Incorporated)
• Inventors: Sender, Benzion, Litman, Alon
• Granted Patent: US 7,285,779 B2
• Time in Patent Office: Days
• US Class Current: 250/310
• CPC Class Codes: G01N 23/225 using electron or ion
• CPC Class Codes: H01J 2237/2817 Pattern inspection
• CPC Class Codes: H01J 37/28 with scanning beams H01J37/268, H01J37/292, H01J37/2955 take precedence

Abstract

A multi beam inspection method and system. The inspection system includes: (i) a beam array generator adapted to generate an array of beams characterized by a beam array axis; and (ii) at least one mechanism adapted to position the object under the array of beams such that at least two beams that are positioned along a beam array axis scan substantially simultaneously at least two regions of interest of the object, wherein the first axis is oriented in relation to the beam array axis.

Claims

1. A method for inspecting an object that comprises multiple regions of interest, the method comprising:

determining a first spatial relationship between at least two regions of interest positioned along a region of interest axis; and

positioning, at least in response to the first spatial relationship, the object under multiple beams of an beam array, such that at least two beams of the beam array that are positioned along a beam array axis scan substantially simultaneously the at least two regions of interest, wherein the first axis is oriented in relation to the beam array axis.

2. The method of claim 1 wherein the stage of positioning comprises rotating the object in relation to the array of beams.

3. The method of claim 1 wherein the stage of positioning comprises rotating the array of beams in relation to the object.

4. The method of claim 1 wherein the beams are charged particle beams.

5. The method of claim 1 wherein an orientation angle between the first axis and the beam array axis is responsive to a ratio of beam array spacing and between a region of interest spacing.

6. The method of claim 1 wherein the stage of determining comprises image processing.

7. The method of claim 1 further comprising scanning the at least two regions of interest.

8. The method of claim 1 wherein the aggregate area of the multiple regions of interest is relatively small in relation to the size of a surface of the object.

9. The method of claim 1 wherein the object is a wafer or a reticle.

10. The method of claim 1 wherein the array of beams comprises a grid of beams.

11. The method of claim 1 wherein the stage of positioning comprises orienting the object in relation to the beam array axis prior inserting the object into an inspection system that comprises array of beams generator.

12. An inspection system, comprising:

a beam array generator adapted to generate an array of beams characterized by a beam array axis; and

at least one mechanism adapted to position the object under the array of beams such that at least two beams that are positioned along a beam array axis scan substantially simultaneously at least two regions of interest of the object, wherein the first axis is oriented in relation to the beam array axis.

13. The system of claim 12 further comprising a processor adapted to determine a first spatial relationship between at least two regions of interest positioned along a region of interest axis.

14. The system of claim 12 wherein the at least one mechanism is adapted to rotate the object in relation to the array of beams.

15. The system of claim 12 wherein the at least one mechanism is adapted to rotate the array of beams in relation to object.

16. The system of claim 12 wherein the beams are charged particle beams.

17. The system of claim 12 wherein an orientation angle between the first axis and the beam array axis is responsive to a ratio of beam array spacing and between a region of interest spacing.

18. The system of claim 12 adapted to determine by image processing.

19. The system of claim 12 further adapted to scan the at least two regions of interest.

20. The system of claim 12 wherein the aggregate area of the multiple regions of interest is relatively small in relation to the size of a surface of the object.

21. The system of claim 12 wherein the object is a wafer or a reticle.

22. The system of claim 12 wherein the array of beams comprises a grid of beams.