Semiconductor light emitting device and semiconductor light emitting unit
First Claim
1. A semiconductor light emitting device comprising:
- embedding resin;
a first lead having a first inner lead section embedded in the embedding resin and a first outer lead section protruding from one side face of the embedding resin;
a second lead having a second inner lead section embedded in the embedding resin and a second outer lead section protruding from a side face opposed to the one side face of the embedding resin;
a semiconductor light emitting chip mounted on a portion of the first inner lead section exposed in a recess provided on an upper face of the embedding resin; and
a wire connecting the semiconductor light emitting chip with the second lead, the first and second inner lead sections and the first and second outer lead sections each having a substantially coplanar rear face, and at least a part of the rear face of the first inner lead section and at least a part of the rear face of the second inner lead section being not covered with the embedding resin but being exposed.
1 Assignment
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Accused Products
Abstract
A semiconductor light emitting device comprises: embedding resin; a first lead having a first inner lead section embedded in the embedding resin and a first outer lead section protruding from one side face of the embedding resin; a second lead having a second inner lead section embedded in the embedding resin and a second outer lead section protruding from a side face opposed to the one side face of the embedding resin; a semiconductor light emitting chip mounted on a portion of the first inner lead section exposed in a recess provided on an upper face of the embedding resin; and a wire connecting the semiconductor light emitting chip with the second lead. The first and second inner lead sections and the first and second outer lead sections each have a substantially coplanar rear face. At least a part of the rear face of the first inner lead section and at least a part of the rear face of the second inner lead section are not covered with the embedding resin but are exposed.
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Citations
20 Claims
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1. A semiconductor light emitting device comprising:
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embedding resin;
a first lead having a first inner lead section embedded in the embedding resin and a first outer lead section protruding from one side face of the embedding resin;
a second lead having a second inner lead section embedded in the embedding resin and a second outer lead section protruding from a side face opposed to the one side face of the embedding resin;
a semiconductor light emitting chip mounted on a portion of the first inner lead section exposed in a recess provided on an upper face of the embedding resin; and
a wire connecting the semiconductor light emitting chip with the second lead, the first and second inner lead sections and the first and second outer lead sections each having a substantially coplanar rear face, and at least a part of the rear face of the first inner lead section and at least a part of the rear face of the second inner lead section being not covered with the embedding resin but being exposed. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10, 11, 12, 13)
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14. A semiconductor light emitting unit comprising:
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a mounting substrate having a first electrode pad and a second electrode pad; and
a semiconductor light emitting device including;
embedding resin;
a first lead having a first inner lead section embedded in the embedding resin and a first outer lead section protruding from one side face of the embedding resin;
a second lead having a second inner lead section embedded in the embedding resin and a second outer lead section protruding from a side face opposed to the one side face of the embedding resin;
a semiconductor light emitting chip mounted on a portion of the first inner lead section exposed in a recess provided on an upper face of the embedding resin; and
a wire connecting the semiconductor light emitting chip with the second lead, the first and second inner lead sections and the first and second outer lead sections;
each having a substantially coplanar rear face, andat least a part of the rear face of the first inner lead section and at least a part of the rear face of the second inner lead section being not covered with the embedding resin but being exposed, one of the first and second outer lead sections being connected with one of the first and second electrode pads, and other of the first and second outer lead sections being connected with other of the first and second electrode pads. - View Dependent Claims (15, 16, 17, 18, 19, 20)
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Specification