Semiconductor wafer having identification unit and method of identifying the semiconductor wafer using the identification unit

• US 20050280503A1
• Filed: 06/08/2005
• Published: 12/22/2005
• Est. Priority Date: 06/16/2004
• Status: Abandoned Application

• Current Assignee: Samsung Electronics Co. Ltd.
• Original Assignee: Samsung Electronics Co. Ltd.
• Inventors: Lee, Sang-Woo, Yoo, Cheol-Joon, Kim, Dong-Bin
• Application Number:
  US11/147,314
• Publication Number:
  US 20050280503A1
• Time in Patent Office: Days
• US Class Current: 340/10.1
• CPC Class Codes: H01L 2223/54413 comprising digital information, e.g. bar codes, data matrix
• CPC Class Codes: H01L 2223/54446 Wireless electrical read out
• CPC Class Codes: H01L 2223/54493 Peripheral marks on wafers, e.g. orientation flats, notches, lot number
• CPC Class Codes: H01L 23/544 Marks applied to semiconductor devices or parts, e.g. registration marks, alignment structures, wafer maps test patterns for characterising or monitoring manufacturing processes H01L22/00
• CPC Class Codes: H01L 2924/00 Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/0002 Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Abstract

A semiconductor wafer, comprising a radio frequency identification (RFID) chip on one side of the semiconductor wafer, on which a pattern has been formed, wherein information on the wafer is input to and/or output from the RFID chip using radio frequency communication.

Claims

1. A semiconductor wafer, comprising:

a radio frequency identification (RFID) chip on one side of the semiconductor wafer, on which a pattern has been formed, wherein information on the wafer is input to and/or output from the RFID chip using radio frequency communication.

2. The semiconductor wafer according to claim 1, wherein the information on the wafer refers includes information on processes performed on the semiconductor wafer.

3. The semiconductor wafer according to claim 1, wherein the RFID chip includes:

a data receiving unit receiving the information on the wafer; and

a data transmitting unit transmitting the information on the wafer.

4. The semiconductor wafer according to claim 3, wherein the RFID chip includes a data storage unit storing the information on the wafer.

5. The semiconductor wafer according to claim 1, wherein the RFID chip is formed during processing of the wafer.

6. The semiconductor wafer according to claim 1, wherein the RFID chip is attached to the wafer using an adhesive.

7. The semiconductor wafer according to claim 1, wherein the RFID chip is inserted into a recess in the wafer.

8. The semiconductor wafer according to claim 7, wherein the recess has a depth of 40 μ

m or less.

9. A method of identifying a semiconductor wafer, comprising:

storing first wafer information on the semiconductor wafer in a database;

inputting the first wafer information to an RFID chip formed on the semiconductor wafer;

reading second wafer information from the RFID chip; and

determining whether the first wafer information is identical to the second wafer information and proceeding to a wafer processing operation if the first wafer information and the second wafer information are the same.

10. The method according to claim 9, wherein the inputting of the first wafer information includes:

receiving an radio frequency (RF) signal containing the first wafer information and occupying a frequency band in an antenna unit;

generating a power source with a voltage from the RF signal;

converting the RF signal into a digital signal;

analyzing data transmitted from the data receiving unit; and

storing the analyzed data.

11. The method according to claim 9, wherein the inputting of the semiconductor wafer information is performed in real-time.

12. The method according to claim 9, wherein a reference point for coordinates required for inputting the first wafer information on the semiconductor wafer is the RFID chip.

13. The method according to claim 9, wherein the first wafer information is input before and after an electrical die sorting (EDS) test.

14. The method according to claim 9, wherein the reading of the second wafer information includes:

extracting the second wafer information from a data storage unit;

transmitting the second wafer information converted into an analog signal;

emitting the analog signal bearing the second wafer information; and

reading the analog signal emitted.

15. The method according to claim 9, wherein the reading of the second wafer information on the semiconductor wafer is performed in real-time.

29. A semiconductor wafer identification system performing the method of claim 9.

16. A semiconductor wafer identification system comprising:

a radio frequency identification (RFID) chip for storing wafer information; and

a reader for reading the wafer information stored on the RFID chip.

17. The semiconductor wafer identification system of claim 16, wherein the RFID chip includes an antenna unit, for transmitting and/or receiving an RF signal, a power generating unit, a data receiving unit, a data storage unit, a data transmitting unit, and a data processing unit.

18. The semiconductor wafer identification system of claim 17, wherein the RF signal may occupy a frequency band.

19. The semiconductor wafer identification system of claim 17, wherein the power generating unit generates a power source with a voltage from the RF signal received through the antenna unit.

20. The semiconductor wafer identification system of claim 17, wherein the data receiving unit converts the RF signal received in the antenna unit into a digital signal and transmits the converted signal to the data processing unit.

21. The semiconductor wafer identification system of claim 17, wherein the data processing unit processes data received from the data receiving unit.

22. The semiconductor wafer identification system of claim 17, wherein the data storage unit stores data received from the data receiving unit.

23. The semiconductor wafer identification system of claim 17, wherein the data transmitting unit converts data in the data storage unit.

24. The semiconductor wafer identification system of claim 16, wherein the information on the wafer refers to information of various processes that the semiconductor wafer was subjected to.

25. A radio frequency identification (RFID) chip comprising:

an antenna unit transmitting and/or receiving an RF signal;

a power generating unit generating a power source with a voltage from the RF signal received through the antenna unit;

a data receiving unit converting the RF signal received in the antenna unit into a digital signal and transmitting the converted signal to the data processing unit;

a data storage unit storing data received from the data receiving unit;

a data processing unit processing data received from the data receiving unit; and

a data transmitting unit transmitting the processed data to a reader.

26. The RFID chip of claim 25, wherein the RF signal may occupy a frequency band.

27. A semiconductor wafer including the RFID chip of claim 25.

28. A semiconductor wafer identification system including the RFID chip of claim 25.