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Process for manufacturing a microfluidic device with buried channels

  • US 20050282221A1
  • Filed: 07/28/2005
  • Published: 12/22/2005
  • Est. Priority Date: 02/29/2000
  • Status: Active Grant
First Claim
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1. A process for manufacturing a microfluidic device, comprising the steps of:

  • forming at least one channel in a semiconductor material body;

    forming a dielectric diaphragm above said channel, for closing said channel; and

    forming heating elements for providing thermal energy inside said channel;

    wherein said heating elements are formed directly on said dielectric diaphragm.

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