Methods for modifying semiconductor devices to stabilize the same and semiconductor device assembly

• US 20050282313A1
• Filed: 08/26/2005
• Published: 12/22/2005
• Est. Priority Date: 06/08/2000
• Status: Abandoned Application

• Current Assignee: Salman Akram, Syed Sajid Ahmad
• Original Assignee: Salman Akram, Syed Sajid Ahmad
• Inventors: Akram, Salman, Ahmad, Syed Sajid
• Application Number:
  US11/213,094
• Publication Number:
  US 20050282313A1
• Time in Patent Office: Days
• US Class Current: 438/108
• CPC Class Codes: B33Y 80/00 Products made by additive manufacturing
• CPC Class Codes: H01L 2224/05568 the whole external layer protruding from the surface
• CPC Class Codes: H01L 2224/05573 Single external layer
• CPC Class Codes: H01L 2224/05599 Material
• CPC Class Codes: H01L 2224/0615 Mirror array, i.e. array having only a reflection symmetry, i.e. bilateral symmetry
• CPC Class Codes: H01L 2224/10135 Alignment aids
• CPC Class Codes: H01L 2224/13 of an individual bump connector
• CPC Class Codes: H01L 2224/13099 Material
• CPC Class Codes: H01L 2224/75 Apparatus for connecting with bump connectors or layer connectors
• CPC Class Codes: H01L 2224/81136 involving guiding structures, e.g. spacers or supporting members
• CPC Class Codes: H01L 2224/81139 Guiding structures on the body
• CPC Class Codes: H01L 2224/81801 Soldering or alloying
• CPC Class Codes: H01L 23/16 Fillings or auxiliary members in containers or encapsulations, e.g. centering rings H01L23/42, H01L23/552 take precedence
• CPC Class Codes: H01L 24/10 Bump connectors bumps on insulating substrates, e.g. chip carriers, H01L23/49816; Manufacturing methods related thereto
• CPC Class Codes: H01L 24/13 of an individual bump connector
• CPC Class Codes: H01L 24/75 Apparatus for connecting with bump connectors or layer connectors
• CPC Class Codes: H01L 24/81 using a bump connector
• CPC Class Codes: H01L 2924/00 Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/00014 the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
• CPC Class Codes: H01L 2924/01005 Boron [B]
• CPC Class Codes: H01L 2924/01006 : Carbon [C]
• CPC Class Codes: H01L 2924/01033 : Arsenic [As]
• CPC Class Codes: H01L 2924/01082 : Lead [Pb]
• CPC Class Codes: H01L 2924/014 : Solder alloys
• CPC Class Codes: H01L 2924/12042 : LASER
• CPC Class Codes: H01L 2924/351 : Thermal stress
• CPC Class Codes: H05K 2201/10568 : Integral adaptations of a component or an auxiliary PCB for mounting, e.g. integral spacer element
• CPC Class Codes: H05K 2201/10674 : Flip chip
• CPC Class Codes: H05K 2201/10734 : Ball grid array [BGA]; Bump grid array
• CPC Class Codes: H05K 2201/2036 : Permanent spacer or stand-off in a printed circuit or printed circuit assembly
• CPC Class Codes: H05K 3/303 : Surface mounted components, e.g. affixing before soldering, aligning means, spacing means H05K3/32 takes precedence
• CPC Class Codes: H05K 3/3436 : having an array of bottom contacts, e.g. pad grid array or ball grid array components
• CPC Class Codes: Y02P 70/50 : Manufacturing or production processes characterised by the final manufactured product

Abstract

One or more stabilizers are disposed on the surface of a semiconductor device component prior to bonding the same to a higher-level substrate. The one or more stabilizers may be formed on or secured to the surface. Upon assembly of the semiconductor device component face down upon a higher-level substrate and joining conductive structures between the contact pads of the semiconductor device component and corresponding contact pads of the higher-level substrate, the stabilizers at least partially stabilize the semiconductor device component on the higher-level substrate to maintain a substantially parallel relation therebetween. The stabilizers can also be positioned and configured to define a minimum, substantially uniform distance between the semiconductor device component and the higher-level substrate.

Claims

1. A method for modifying a semiconductor die, comprising:

providing at least one semiconductor die having an active surface; and

disposing on the active surface at least one stabilizer, the at least one stabilizer comprising a plurality of adjacent, mutually adhered regions comprising a dielectric material and protruding from the active surface.

2. The method of claim 1, wherein disposing the at least one stabilizer comprises disposing a plurality of stabilizers.

3. The method of claim 1, wherein disposing the at least one stabilizer comprises forming the at least one stabilizer to have a height that defines a substantially consistent die-to-substrate distance.

4. The method of claim 1, wherein providing comprises providing at least one semiconductor die having a sealing material on an active surface thereof and wherein disposing comprises forming the at least one stabilizer to be securable to the sealing material.

5. The method of claim 1, wherein providing comprises providing a semiconductor wafer including a plurality of semiconductor dice.

6. The method of claim 1, further comprising:

adhering the at least one stabilizer to the active surface.

7. The method of claim 1, wherein disposing the at least one stabilizer comprises forming the at least one stabilizer.

8. The method of claim 7, wherein forming the at least one stabilizer comprises applying a layer of insulative material on the active surface and patterning the layer.

9. The method of claim 7, wherein forming the at least one stabilizer comprises applying a layer of photoresist material on the active surface and patterning the layer.

10. The method of claim 1, wherein disposing the at least one stabilizer comprises positioning the at least one stabilizer on the active surface so as to avoid contact with conductive traces on a carrier substrate.

11. The method of claim 1, further comprising:

disposing at least one conductive structure on at least one bond pad of the at least one semiconductor die.

12. The method of claim 1, further comprising:

recognizing a location and orientation of the at least one die before or while disposing the at least one stabilizer.

13. The method of claim 12, further comprising:

storing data including at least one physical parameter of the at least one substrate in computer memory, and using the stored data in conjunction with a machine vision system to recognize the location and orientation of the at least one substrate and to form the at least one stabilizer.

14. The method of claim 13, wherein storing data further includes storing in computer memory at least one parameter of another semiconductor device component with which the at least one substrate is to be assembled.

15. The method of claim 13, further comprising:

using stored data, in conjunction with the machine vision system, to selectively form the at least one stabilizer.

16. A method for electrically connecting a semiconductor die that includes a surface and conductive structures protruding from the surface to a substrate with contacts positioned correspondingly to the conductive structures, the method comprising:

disposing at least one stabilizer structure comprising a plurality of adjacent, mutually adhered regions, each comprising a dielectric material, on at least one of the surface and the substrate for positioning between the surface and the substrate;

inverting and positioning the semiconductor die on the substrate to contact the conductive structures to corresponding contacts; and

bonding the conductive structures to the corresponding contacts.

17. The method of claim 16, wherein disposing comprises disposing at least one stabilizer structure having a height less than a minimum distance the conductive structures protrude from the surface.

18. The method of claim 16, wherein disposing comprises disposing the at least one stabilizer structure that spaces the surface from the substrate a distance greater than a minimum distance at least one of the conductive structures protrudes from the surface.

19. The method of claim 18, wherein bonding comprises disposing at least one stabilizer structure having a height that is configured to lengthen at least one of the conductive structures.

20. The method of claim 16, wherein disposing comprises configuring the at least one stabilizer structure to be positioned between a periphery of the surface of the semiconductor die and the conductive structures.