Methods for modifying semiconductor devices to stabilize the same and semiconductor device assembly
First Claim
1. A method for modifying a semiconductor die, comprising:
- providing at least one semiconductor die having an active surface; and
disposing on the active surface at least one stabilizer, the at least one stabilizer comprising a plurality of adjacent, mutually adhered regions comprising a dielectric material and protruding from the active surface.
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Abstract
One or more stabilizers are disposed on the surface of a semiconductor device component prior to bonding the same to a higher-level substrate. The one or more stabilizers may be formed on or secured to the surface. Upon assembly of the semiconductor device component face down upon a higher-level substrate and joining conductive structures between the contact pads of the semiconductor device component and corresponding contact pads of the higher-level substrate, the stabilizers at least partially stabilize the semiconductor device component on the higher-level substrate to maintain a substantially parallel relation therebetween. The stabilizers can also be positioned and configured to define a minimum, substantially uniform distance between the semiconductor device component and the higher-level substrate.
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Citations
20 Claims
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1. A method for modifying a semiconductor die, comprising:
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providing at least one semiconductor die having an active surface; and
disposing on the active surface at least one stabilizer, the at least one stabilizer comprising a plurality of adjacent, mutually adhered regions comprising a dielectric material and protruding from the active surface. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10, 11, 12, 13, 14, 15)
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16. A method for electrically connecting a semiconductor die that includes a surface and conductive structures protruding from the surface to a substrate with contacts positioned correspondingly to the conductive structures, the method comprising:
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disposing at least one stabilizer structure comprising a plurality of adjacent, mutually adhered regions, each comprising a dielectric material, on at least one of the surface and the substrate for positioning between the surface and the substrate;
inverting and positioning the semiconductor die on the substrate to contact the conductive structures to corresponding contacts; and
bonding the conductive structures to the corresponding contacts. - View Dependent Claims (17, 18, 19, 20)
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Specification