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Packaging of electronic chips with air-bridge structures

  • US 20050285220A1
  • Filed: 08/31/2005
  • Published: 12/29/2005
  • Est. Priority Date: 08/25/1999
  • Status: Active Grant
First Claim
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1. A method of constructing an integrated circuit comprising:

  • fabricating a plurality of electronic devices on a substrate;

    embedding a wiring structure in a plurality of materials having a plurality of vaporization temperatures, the plurality of materials is located on the substrate and the wiring structure interconnects the plurality of electronic devices;

    mounting the integrated circuit on a packaging substrate; and

    removing at least one of the plurality of materials after the integrated circuit is mounted on the packaging substrate.

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