Microelectronic packages and methods therefor

• US 20050285246A1
• Filed: 05/27/2005
• Published: 12/29/2005
• Est. Priority Date: 06/25/2004
• Status: Active Grant

• Current Assignee: Tessera, Inc. (Adeia Inc.)
• Original Assignee: Tessera, Inc. (Adeia Inc.)
• Inventors: Beroz, Masud, Mohammed, Ilyas, Haba, Belgacem, Kang, Teck-Gyu, Krishnan, Sridhar, Riley, John B. III, Kubota, Yoichi
• Granted Patent: US 7,453,157 B2
• Time in Patent Office: Days
• US Class Current: 257/678
• CPC Class Codes: H01L 2224/16 of an individual bump connector
• CPC Class Codes: H01L 2224/16225 the item being non-metallic, e.g. insulating substrate with or without metallisation
• CPC Class Codes: H01L 2224/32225 the item being non-metallic, e.g. insulating substrate with or without metallisation
• CPC Class Codes: H01L 2224/32245 the item being metallic
• CPC Class Codes: H01L 2224/45015 being circular
• CPC Class Codes: H01L 2224/45099 Material
• CPC Class Codes: H01L 2224/48091 Arched
• CPC Class Codes: H01L 2224/4824 Connecting between the body and an opposite side of the item with respect to the body
• CPC Class Codes: H01L 2224/48247 connecting the wire to a bond pad of the item
• CPC Class Codes: H01L 2224/73204 the bump connector being embedded into the layer connector
• CPC Class Codes: H01L 2224/73265 Layer and wire connectors
• CPC Class Codes: H01L 2225/1023 the support being an insulating substrate
• CPC Class Codes: H01L 2225/1058 Bump or bump-like electrical connections, e.g. balls, pillars, posts
• CPC Class Codes: H01L 23/3128 the substrate having spherical bumps for external connection
• CPC Class Codes: H01L 23/3677 Wire-like or pin-like cooling fins or heat sinks
• CPC Class Codes: H01L 23/49811 Additional leads joined to the metallisation on the insulating substrate, e.g. pins, bumps, wires, flat leads H01L23/49827 takes precedence
• CPC Class Codes: H01L 23/4985 Flexible insulating substrates H01L23/49572 and H01L23/49855 take precedence
• CPC Class Codes: H01L 24/48 of an individual wire connector
• CPC Class Codes: H01L 25/105 the devices being of a type provided for in group H01L27/00
• CPC Class Codes: H01L 2924/00 Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/00012 : Relevant to the scope of the group, the symbol of which is combined with the symbol of this group
• CPC Class Codes: H01L 2924/00014 : the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
• CPC Class Codes: H01L 2924/01004 : Beryllium [Be]
• CPC Class Codes: H01L 2924/01078 : Platinum [Pt]
• CPC Class Codes: H01L 2924/01079 : Gold [Au]
• CPC Class Codes: H01L 2924/12042 : LASER
• CPC Class Codes: H01L 2924/15311 : being a ball array, e.g. BGA
• CPC Class Codes: H01L 2924/15312 : being a pin array, e.g. PGA
• CPC Class Codes: H01L 2924/181 : Encapsulation
• CPC Class Codes: H01L 2924/19041 : being a capacitor
• CPC Class Codes: H01L 2924/207 : Diameter ranges
• CPC Class Codes: H01L 2924/3511 : Warping

Abstract

A microelectronic package includes a microelectronic element having faces, contacts and an outer perimeter, and a flexible substrate overlying and spaced from a first face of the microelectronic element, an outer region of the flexible substrate extending beyond the outer perimeter of the microelectronic element. The package includes a plurality of conductive posts exposed at a surface of the flexible substrate and being electrically interconnected with the microelectronic element, wherein at least one of the conductive posts is disposed in the outer region of the flexible substrate, and a compliant layer disposed between the first face of the microelectronic element and the flexible substrate, wherein the compliant layer overlies the at least one of the conductive posts that is disposed in the outer region of the flexible substrate. The package includes a support element in contact with the microelectronic element and the compliant layer, whereby the support element overlies the outer region of the flexible substrate.

Claims

1. A microelectronic package comprising:

a microelectronic element having faces and contacts, said microelectronic element having an outer perimeter;

a flexible substrate overlying and spaced from a first face of said microelectronic element, wherein an outer region of said flexible substrate extends beyond the outer perimeter of said microelectronic element;

a plurality of conductive posts exposed at a surface of said flexible substrate and being electrically interconnected with said microelectronic element, wherein at least one of said conductive posts is disposed in the outer region of said flexible substrate;

a compliant layer disposed between the first face of said microelectronic element and said flexible substrate, wherein said compliant layer overlies the at least one of said conductive posts that is disposed in the outer region of said flexible substrate; and

a support element in contact with said microelectronic element and said compliant layer, wherein said support element overlies the outer region of said flexible substrate.

2. The package as claimed in claim 1, wherein said conductive posts are movable independently of one another.

3. The package as claimed in claim 1, wherein said conductive posts are movable relative to said microelectronic element.

4. The package as claimed in claim 1, wherein said flexible substrate includes a dielectric material.

5. The package as claimed in claim 4, wherein said dielectric material includes a polymer.

6. The package as claimed in claim 1, wherein said first face is a front face of said microelectronic element and said contacts are accessible at said front face.

7. The package as claimed in claim 1, wherein said microelectronic element has a second face facing away from said flexible substrate, and wherein said contacts are accessible at said second face.

8. The package as claimed in claim 1, wherein said microelectronic element is operable to interchange signals at a frequency above about 300 MHz through at least some of said conductive posts.

9. The package as claimed in claim 1, further comprising conductive traces provided on said flexible substrate, wherein said conductive traces electrically interconnect at least some of said conductive posts with said microelectronic element.

10. The package as claimed in claim 9, wherein said flexible substrate has a first surface facing said microelectronic element and said conductive traces extend along the first surface of said flexible substrate.

11. The package as claimed in claim 9, wherein said flexible substrate has a second surface facing away from said microelectronic element and said conductive traces extend along the second surface of said flexible substrate.

12. The package as claimed in claim 1, wherein said contacts are spaced in a grid array over one of said faces of said microelectronic element.

13. The package as claimed in claim 1, wherein said contacts are disposed in one or more rows extending over one of said faces of said microelectronic element.

14. The package as claimed in claim 1, wherein said support includes a rigid protective layer covering said microelectronic element and a first surface of said compliant layer facing away from said conductive posts.

15. The package as claimed in claim 14, wherein said rigid protective layer is made of a material selected from the group consisting of epoxies, glass and polymers.

16. The package as claimed in claim 14, wherein said flexible substrate extends beyond the outer edge of said compliant layer to define a gap and wherein said rigid protective layer fills the gap.

17. The package as claimed in claim 1, wherein said microelectronic element comprises a semiconductor chip.

18. A microelectronic assembly comprising a package as claimed in claim 1 and a circuit panel having contact pads, said conductive posts having tips remote from said flexible substrate confronting said contact pads and electrically connected thereto.

19. The assembly as claimed in claim 18, further comprising an electrically conductive bonding material securing said conductive posts to said contact pads.

20. A microelectronic package comprising:

a microelectronic element having faces and contacts;

a flexible substrate overlying and spaced from a first face of said microelectronic element;

a plurality of conductive posts exposed at a surface of said flexible substrate and being electrically interconnected with said microelectronic element, at least one of said conductive posts being located in an outer region of said flexible substrate that extends beyond the outer perimeter of said microelectronic element;

a compliant layer disposed between the first face of said microelectronic element and said flexible substrate, wherein said compliant layer includes a section that overlies the at least one of said conductive posts located in the outer region of said flexible substrate; and

a protective layer in contact with said microelectronic element and the section of said compliant layer that overlies the at least one of said conductive posts located in the outer region of said flexible substrate.

21. The package as claimed in claim 20, wherein said flexible substrate includes a dielectric sheet.

22. The package as claimed in claim 21, wherein said dielectric sheet includes a polymer.

23. The package as claimed in claim 20, wherein said flexible substrate includes conductive traces for electrically interconnecting said microelectronic element and said conductive posts.

24. The package as claimed in claim 23, wherein said flexible substrate has a first surface facing said microelectronic element and a second surface facing away from said microelectronic element.

25. The package as claimed in claim 24, wherein said conductive traces overly the first surface of said flexible substrate.

26. The package as claimed in claim 24, wherein said conductive traces overly the second surface of said flexible substrate.

27. The package as claimed in claim 20, wherein said microelectronic element has a first face facing toward said flexible substrate and a second face facing away from said flexible substrate.

28. The package as claimed in claim 27, wherein said contacts are accessible at said first face of said microelectronic element.

29. The package as claimed in claim 27, wherein said contacts are accessible at said second face of said microelectronic element.

30. The package as claimed in claim 29, further comprising wire bonds for electrically interconnecting said microelectronic element and said conductive posts.

31. The package as claimed in claim 20, wherein said microelectronic element comprises a semiconductor chip.

32. A microelectronic package comprising:

a microelectronic element having faces and contacts;

a substrate overlying and spaced from a first face of said microelectronic element;

a plurality of conductive posts exposed at a surface of said substrate and being electrically interconnected with said microelectronic element; and

at least one thermally conductive element extending through said substrate and being in thermal communication with said microelectronic element for removing heat from said package, said at least one thermally conductive element being electrically isolated from said microelectronic element.

33. A microelectronic package comprising:

a microelectronic element having faces and contacts;

a dielectric substrate overlying and spaced from a first face of said microelectronic element;

a plurality of conductive posts extending from a bottom surface of said substrate and being electrically interconnected with said microelectronic element;

a rigid protective layer covering a top surface of said substrate and encapsulating said microelectronic element, wherein said rigid protective layer limits movement of said conductive posts relative to said microelectronic element.

34. A microelectronic assembly comprising:

at least two stacked microelectronic packages;

each said microelectronic package comprising;

a microelectronic element,

a flexible substrate having a top surface and a bottom surface, said substrate overlying and being spaced from a face of said microelectronic element,

a plurality of conductive posts exposed at a bottom surface of said flexible substrate, said conductive posts being electrically interconnected with said microelectronic element;

said at least two stacked microelectronic packages including a first microelectronic package and a second microelectronic package stacked atop said first microelectronic package so that said conductive terminals of said second microelectronic package confront the top surface of the flexible substrate of said first microelectronic package;

a rigid conductive material connecting ends of said conductive terminals of said second microelectronic package with the flexible substrate of said first microelectronic package, wherein said rigid material prevents movement of the ends of said conductive terminals of said second microelectronic package.

35. The microelectronic assembly as claimed in claim 34, wherein at least one of the conductive posts of a first of said microelectronic packages is inserted into a socket on a second one of said microelectronic packages for electrically interconnecting said first and second microelectronic packages.