Active matrix substrate and manufacturing method thereof, and electronic device

• US 20050285987A1
• Filed: 06/22/2005
• Published: 12/29/2005
• Est. Priority Date: 06/23/2004
• Status: Active Grant

• Current Assignee: Sharp Kabushiki Kaisha (Hon Hai Precision Industry Co., Ltd.)
• Original Assignee: Sharp Kabushiki Kaisha (Hon Hai Precision Industry Co., Ltd.)
• Inventors: Ban, Atsushi, Nakamura, Kenji, Azumada, Kyoko, Fujita, Tatsuya
• Granted Patent: US 7,547,918 B2
• Time in Patent Office: Days
• US Class Current: 349/43
• CPC Class Codes: G02F 1/136286 Wiring, e.g. gate line, drain line
• CPC Class Codes: G02F 1/13629 Multilayer wirings
• CPC Class Codes: G02F 1/136295 Materials; Compositions; Manufacture processes
• CPC Class Codes: H01L 27/1292 using liquid deposition, e.g. printing
• CPC Class Codes: H10K 59/1315 comprising structures specially adapted for lowering the resistance
• CPC Class Codes: H10K 71/611 using printing deposition, e.g. ink jet printing

Abstract

An auxiliary line including a guide layer and an auxiliary metallic member is formed with respect to a signal transmitting line or a main auxiliary capacitance line formed on a glass substrate. The guide layer is formed in the same layer where pixel electrodes are formed. The auxiliary metallic member is formed by using a method such as an inkjet method, in which fine particles of metal is ejected or dropped.

Claims

1. An active matrix substrate, comprising:

a substrate;

a plurality of signal lines;

a plurality of scanning lines intersecting with the signal lines;

switching elements, each being arranged nearby a portion where one of the signal lines intersects with one of the scanning lines;

a peripheral line having at least a part of function of supplying signals to the signal lines and the scanning lines,

the signal lines, the scanning lines, the switching elements, and the peripheral line being provided on the substrate,

the active matrix substrate including a conductive auxiliary member, which is formed at least in a portion of wiring constituting the active matrix substrate.

3. The active matrix substrate as set forth in claim 1, wherein the conductive auxiliary member is formed by application of liquid.

5. The active matrix substrate as set forth in claim 1, wherein the conductive auxiliary member is provided on the wiring.

7. The active matrix substrate as set forth in claim 1, wherein the conductive auxiliary member is provided beneath the wiring.

9. The active matrix substrate as set forth in claim 1, wherein the conductive auxiliary member is provided in wiring for electrically connecting terminals, except for a portion on terminals section.

11. The active matrix substrate as set forth in claim 1, wherein:

the conductive auxiliary member is provided in the peripheral line; and

the peripheral line provides electrical connection between a plurality of drivers, which are respectively connected with terminals so as to supply signals at least to the signal lines or the scanning lines.

13. The active matrix substrate as set forth in claim 1, wherein:

the conductive auxiliary member is provided in the peripheral line; and

the peripheral line apply signal voltages to a driver element provided nearby the substrate, the driver element supplying signals at least to the signal lines or the scanning lines.

15. The active matrix substrate as set forth in claim 1, wherein the conductive auxiliary member is provided in wiring, which is a part of a wiring electrically connected to pixel-capacitor wiring for forming a pixel electrode and a capacitor.

17. The active matrix substrate as set forth in claim 1, wherein a surface resistance of wiring provided with the conductive auxiliary member is smaller than a surface resistance of metal which is used for constituting the signal lines, the scanning lines, and a pixel electrode.

19. The active matrix substrate as set forth in claim 1, wherein a surface resistance of wiring provided with the conductive auxiliary member is 0.2 Ω

/□

or less.

21. The active matrix substrate as set forth in claim 1, wherein the conductive auxiliary member includes at least one of Ag, Au, Cu, and Al.

23. The active matrix substrate as set forth in claim 1, wherein the conductive auxiliary member is an oxidized conductive material.

25. The active matrix substrate as set forth in claim 1, wherein a thickness of the conductive auxiliary member is equal to or greater than a thickness of the wiring on which the conductive auxiliary member is to be formed.

27. The active matrix substrate as set forth in claim 1, wherein at least a portion of the conductive auxiliary member made of a metal includes an oxidized conductive material serving as a foundation material.

29. The active matrix substrate as set forth in claim 1, wherein at least a part of a periphery of a region in which the conductive auxiliary member is formed is surrounded by a resin material.

31. The active matrix substrate as set forth in claim 1, wherein at least a part of a surface of the conductive auxiliary member is coated with an insulative material.

33. The active matrix substrate as set forth in claim 1, wherein at least a part of a surface of the conductive auxiliary member is coated with an oxidized conductive material.

2. An active matrix substrate, comprising:

a substrate;

a plurality of signal lines;

a plurality of scanning lines intersecting with the signal lines;

switching elements, each being arranged nearby a portion where one of the signal lines intersects with one of the scanning lines;

pixel electrodes respectively connected with the switching elements;

a peripheral line having at least a part of function of supplying signals to the signal lines and the scanning lines,

the signal lines, the scanning lines, the switching elements, and the peripheral line being provided on the substrate,

the active matrix substrate including a conductive auxiliary member, which is formed at least in a portion of wiring constituting the active matrix substrate or in a portion of a pixel electrode.

4. The active matrix substrate as set forth in claim 2, wherein the conductive auxiliary member is formed by application of liquid.

6. The active matrix substrate as set forth in claim 2, wherein the conductive auxiliary member is provided on the wiring.

8. The active matrix substrate as set forth in claim 2, wherein the conductive auxiliary member is provided beneath the wiring.

10. The active matrix substrate as set forth in claim 2, wherein the conductive auxiliary member is provided in wiring for electrically connecting terminals, except for a portion on terminals section.

12. The active matrix substrate as set forth in claim 2, wherein:

the conductive auxiliary member is provided in the peripheral line; and

the peripheral line provides electrical connection between a plurality of drivers, which are respectively connected with terminals so as to supply signals at least to the signal lines or the scanning lines.

14. The active matrix substrate as set forth in claim 2, wherein:

the conductive auxiliary member is provided in the peripheral line; and

the peripheral line apply signal voltages to a driver element provided nearby the substrate, the driver element supplying signals at least to the signal lines or the scanning lines.

16. The active matrix substrate as set forth in claim 2, wherein wiring provided with the conductive auxiliary member is a portion of wiring electrically connected to pixel-capacitance wiring for forming a pixel electrode and providing a capacitance.

18. The active matrix substrate as set forth in claim 2, wherein a surface resistance of wiring provided with the conductive auxiliary member is smaller than a surface resistance of metal for use in the signal lines, the scanning lines, and a pixel electrode.

20. The active matrix substrate as set forth in claim 2, wherein a surface resistance of wiring provided with the conductive auxiliary member is 0.2 Ω

/□

or less.

22. The active matrix substrate as set forth in claim 2, wherein the conductive auxiliary member includes at least one of Ag, Au, Cu, and Al.

24. The active matrix substrate as set forth in claim 2, wherein the conductive auxiliary member is an oxidized conductive material.

26. The active matrix substrate as set forth in claim 2, wherein a thickness of the conductive auxiliary member is equal to or greater than a thickness of the wiring on which the conductive auxiliary member is to be formed.

28. The active matrix substrate as set forth in claim 2, wherein at least a portion of the conductive auxiliary member made of a metal includes an oxidized conductive material serving as a foundation material.

30. The active matrix substrate as set forth in claim 2, wherein at least a part of a region in which the conductive auxiliary member is formed is surrounded by a resin material.

32. The active matrix substrate as set forth in claim 2, wherein at least a part of a surface of the conductive auxiliary member is coated with an insulative material.

34. The active matrix substrate as set forth in claim 2, wherein at least a part of a surface of the conductive auxiliary member is coated with an oxidized conductive material.

35. A method for manufacturing an active matrix substrate, the active matrix substrate comprising:

a substrate;

a plurality of signal lines;

a plurality of scanning lines intersecting the signal lines;

switching elements, each being arranged nearby a portion where one of the signal lines intersects with one of the scanning lines;

a peripheral line having at least a part of function of supplying a signal to the respective signal lines and the respective scanning lines, the signal lines, the scanning lines, the switching elements, and the peripheral line being provided on the substrate

the method comprising the step of;

forming a conductive auxiliary member with respect to at least a portion of wiring constituting the active matrix substrate, the conductive auxiliary member being formed by ejecting or dropping a fluid material containing metal fine particles with respect to a desirable position.

37. The method as set forth in claim 35, wherein the conductive auxiliary member is formed by heating the fluid material after the fluid material is applied.

39. The method as set forth in claim 35, wherein:

the fluid material is a solution containing a metal complex; and

the conductive auxiliary member is formed by reducing the metal complex after the fluid material is applied so as to extract a metal solid.

41. The method as set forth in claim 35, wherein the fluid material is applied by being ejected by an inkjet method.

36. A method for manufacturing an active matrix substrate, comprising the step of:

forming a conductive auxiliary member with respect to at least a portion of wiring constituting the active matrix substrate, the conductive auxiliary member being formed by ejecting or dropping a fluid material containing fine particles of a metal with respect to a desirable position,

the active matrix substrate including;

a substrate;

a plurality of signal lines;

a plurality of scanning lines intersecting the signal lines;

switching elements, each being arranged nearby a portion where one of the signal lines intersects with one of the scanning lines;

pixel electrodes respectively connected with the switching elements; and

a peripheral line having at least a part of function of supplying a signal to the respective pixel electrodes, the signal lines, the scanning lines, the switching element, the pixel electrode, and the peripheral line being provided on the substrate.

38. The method as set forth in claim 36, wherein the conductive auxiliary member is formed by heating the fluid material after the fluid material is applied.

40. The method as set forth in claim 36, wherein:

the fluid material is a solution containing a metal complex; and

a metal substance is deposited by restoring the metal complex, so as to form the conductive auxiliary member.

42. The method as set forth in claim 36, wherein the fluid material is applied by using an inkjet method for ejecting the fluid material.

43. An electronic device comprising an active matrix substrate including:

a substrate;

a plurality of signal lines;

a plurality of scanning lines intersecting with the signal lines;

switching elements, each being arranged nearby a portion where one of the signal lines intersects with one of the scanning lines;

a peripheral line having at least a part of function of supplying signals to the signal lines and the scanning lines,

the signal lines, the scanning lines, the switching elements, and the peripheral line being provided on the substrate,

the active matrix substrate including a conductive auxiliary member, which is formed at least in a portion of wiring constituting the active matrix substrate.

44. An electronic device comprising an active matrix substrate including:

a substrate;

a plurality of signal lines;

a plurality of scanning lines intersecting with the signal lines;

switching elements, each being arranged nearby a portion where one of the signal lines intersects with one of the scanning lines;

pixel electrodes respectively connected with the switching elements;

a peripheral line having at least a part of function of supplying signals to the signal lines and the scanning lines,

the signal lines, the scanning lines, the switching element, the pixel electrode, and the peripheral line being provided on the substrate,

a conductive auxiliary member formed in at least a portion of wiring constituting the active matrix substrate or in a portion of a pixel electrode.