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Method and apparatus for characterizing microelectromechanical devices on wafers

  • US 20050286105A1
  • Filed: 06/23/2004
  • Published: 12/29/2005
  • Est. Priority Date: 06/23/2004
  • Status: Active Grant
First Claim
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1. A method of evaluating a quality of a plurality of microelectromechanical devices on a wafer, each microelectromechanical device having a reflective and deflectable plate attached to a deformable hinge that is held on the wafer;

  • the method comprising;

    measuring a distribution of a parameter that characterizes a mechanical property of the microelectromechanical device; and

    evaluating a uniformity of the microelectromechanical device on the wafer based on the measured distribution of the parameter.

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