Reworkable thermosetting resin composition
First Claim
Patent Images
1. A thermosetting resin composition, said composition comprising:
- (a) a curable resin component, at least a portion of which is a compound having at least one linkage selected from the group consisting of oxiranes and thiiranes, substituted on at least three of the substitutable positions on the oxirane or thiirane carbons, respectively, with an alkyl, alkenyl or aryl substituent having a carbon content of 1 to about twelve carbon atoms, with or without substitution or interruption by one or more heteroatoms or halogens (I); and
(b) a curing agent component selected from the group consisting of anhydride compounds, amine compounds, amide compounds, imidazole compounds, and combinations thereof, provided that the compound I does not include as its sole component an epoxy compound within any of the following formulae [II;
II wherein each R is independently selected from the group consisting of hydrogen, methyl, ethyl, propyl, isopropyl, butyl, isobutyl, tert-butyl, C1-4 alkoxy, halogen, cyano and nitro, R1 and R2 are each independently selected from the group consisting of hydrogen, methyl, ethyl, and propyl, provided that both R1 and R2 cannot be hydrogen, and R3 is independently selected from propyl, and isopropyl, provided at least one of R3a and R3b, and at least one of R3c and R3d is independently selected from the group consisting of methyl, ethyl, propyl, and isopropyl, and m is 0 or 1]wherein each R is independently selected from the group consisting of hydrogen, methyl, ethyl, propyl, isopropyl, butyl, isobutyl, tert butyl, C1-4 alkoxy, halogens, cyano, nitro, and phenyl, and R3 and R4 together form an epoxy group, and R1 and R2 are each independently selected from the group consisting of hydrogen, methyl, ethyl, propyl, and phenyl, except that at least one of R1 and R2 is not hydrogen, and n is 0 and p is 0 and m is 0 or 1, and the compounds are symmetrical;
wherein R, R1, R2, R3, and R4 are as defined above and m is 1 and p is 1 and n is 1 or p is 0 and m is 0 and n is 1, and the compounds are symmetrical;
wherein R is defined as above, and the compounds are symmetrical; and
wherein R, R1 and R2 are defined as above and c and d are both 1 or c and d are both 0, and the compounds are symmetrical, and wherein reaction products of the composition soften and lose their adhesiveness under exposure to temperature conditions in excess of those used to cure the composition.
0 Assignments
0 Petitions
Accused Products
Abstract
This invention relates to thermosetting resin compositions useful for mounting onto a circuit board semiconductor devices, such as CSPs, BGAs, LGAs and the like, each of which having a semiconductor chip, such as LSI, on a carrier substrate. The compositions of this invention are reworkable when subjected to appropriate conditions.
-
Citations
32 Claims
-
1. A thermosetting resin composition, said composition comprising:
-
(a) a curable resin component, at least a portion of which is a compound having at least one linkage selected from the group consisting of oxiranes and thiiranes, substituted on at least three of the substitutable positions on the oxirane or thiirane carbons, respectively, with an alkyl, alkenyl or aryl substituent having a carbon content of 1 to about twelve carbon atoms, with or without substitution or interruption by one or more heteroatoms or halogens (I); and
(b) a curing agent component selected from the group consisting of anhydride compounds, amine compounds, amide compounds, imidazole compounds, and combinations thereof, provided that the compound I does not include as its sole component an epoxy compound within any of the following formulae [II;
II wherein each R is independently selected from the group consisting of hydrogen, methyl, ethyl, propyl, isopropyl, butyl, isobutyl, tert-butyl, C1-4 alkoxy, halogen, cyano and nitro, R1 and R2 are each independently selected from the group consisting of hydrogen, methyl, ethyl, and propyl, provided that both R1 and R2 cannot be hydrogen, and R3 is independently selected from propyl, and isopropyl, provided at least one of R3a and R3b, and at least one of R3c and R3d is independently selected from the group consisting of methyl, ethyl, propyl, and isopropyl, and m is 0 or 1] wherein each R is independently selected from the group consisting of hydrogen, methyl, ethyl, propyl, isopropyl, butyl, isobutyl, tert butyl, C1-4 alkoxy, halogens, cyano, nitro, and phenyl, and R3 and R4 together form an epoxy group, and R1 and R2 are each independently selected from the group consisting of hydrogen, methyl, ethyl, propyl, and phenyl, except that at least one of R1 and R2 is not hydrogen, and n is 0 and p is 0 and m is 0 or 1, and the compounds are symmetrical;
wherein R, R1, R2, R3, and R4 are as defined above and m is 1 and p is 1 and n is 1 or p is 0 and m is 0 and n is 1, and the compounds are symmetrical;
wherein R is defined as above, and the compounds are symmetrical; and
wherein R, R1 and R2 are defined as above and c and d are both 1 or c and d are both 0, and the compounds are symmetrical, and wherein reaction products of the composition soften and lose their adhesiveness under exposure to temperature conditions in excess of those used to cure the composition. - View Dependent Claims (3, 4, 5, 6, 7, 9, 10, 11, 12, 13, 19, 20, 21, 22, 23, 24, 25, 31)
-
-
2. (canceled)
-
8. (canceled)
-
14-18. -18. (canceled)
-
26-30. -30. (canceled)
-
32-39. -39. (canceled)
Specification