Metal matrix composite structure and method

• US 20060000591A1
• Filed: 06/03/2005
• Published: 01/05/2006
• Est. Priority Date: 04/17/2002
• Status: Active Grant

• Current Assignee: Grant C. Bennett, Kevin Fennessy, Mark Occhionero, Richard W. Adams, Robert A. Hay
• Original Assignee: Grant C. Bennett, Kevin Fennessy, Mark Occhionero, Richard W. Adams, Robert A. Hay
• Inventors: Adams, Richard W., Fennessy, Kevin, Occhionero, Mark, Bennett, Grant C., Hay, Robert A.
• Granted Patent: US 7,141,310 B2
• Time in Patent Office: Days
• US Class Current: 165/185
• CPC Class Codes: H01L 23/3733 having a heterogeneous or anisotropic structure, e.g. powder or fibres in a matrix, wire mesh, porous structures H01L23/3732, H01L23/3737 take precedence
• CPC Class Codes: H01L 23/3735 Laminates or multilayers, e.g. direct bond copper ceramic substrates
• CPC Class Codes: H01L 2924/00 Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/0002 Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
• CPC Class Codes: Y10T 428/12042 Porous component
• CPC Class Codes: Y10T 428/12049 Nonmetal component
• CPC Class Codes: Y10T 428/12486 Laterally noncoextensive components [e.g., embedded, etc.]
• CPC Class Codes: Y10T 428/12528 Semiconductor component
• CPC Class Codes: Y10T 428/12535 with additional, spatially distinct nonmetal component
• CPC Class Codes: Y10T 428/24942 including components having same physical characteristic in differing degree
• CPC Class Codes: Y10T 428/249953 Composite having voids in a component [e.g., porous, cellular, etc.]

Abstract

Compound preforms are provided having a first region, including a porous ceramic and a second region including a porous or solid ceramic in which the two regions differ in composition. The compound preform is infiltrated with a liquid metal which is then solidified to form a metal matrix composite.

Claims