System and method for encapsulation and protection of components

• US 20060000916A1
• Filed: 01/12/2005
• Published: 01/05/2006
• Est. Priority Date: 07/02/2004
• Status: Active Grant

• Current Assignee: Aaron K. Amstutz, Christopher J. Stickling, Randall G. Sommer, Thomas J. Grabenstetter
• Original Assignee: Aaron K. Amstutz, Christopher J. Stickling, Randall G. Sommer, Thomas J. Grabenstetter
• Inventors: Amstutz, Aaron K., Sommer, Randall G., Stickling, Christopher J., Grabenstetter, Thomas J.
• Granted Patent: US 7,210,635 B2
• Time in Patent Office: Days
• US Class Current: 235/492
• CPC Class Codes: G06K 19/077 Constructional details, e.g. mounting of circuits in the carrier
• CPC Class Codes: G06K 19/0773 the record carrier comprising means to protect itself against external heat sources
• CPC Class Codes: H01L 23/3135 Double encapsulation or coating and encapsulation
• CPC Class Codes: H01L 2924/00 Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/0002 Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
• CPC Class Codes: H05K 5/065 sealed by encapsulation, e.g. waterproof resin forming an integral casing, injection moulding

Abstract

An apparatus and method for providing a radio frequency identification. A barrier system is adapted to encase at least a portion of a radio frequency identification device. The barrier system includes a first layer defining a first set of physical properties and a second layer defining a second set of physical properties. A continuous transitory material is formed between the first and the second layers where they are interlinked at associated first and second margin portions. The physical properties of each layer of the barrier system provide protection to the component assembly from various types of physical and environmental damage.

Claims

1. An apparatus for providing a radio frequency identification (RFID), comprising:

a RFID device; and

a barrier system adapted to encase at least a portion of the RFID device, the barrier system including;

a first layer defining a first set of physical properties and including a first margin portion; and

a second layer defining a second set of physical properties and including a second margin portion, the first margin portion being interlinked to the second margin portion to form a continuous transitory material therebetween.

2. The apparatus as set forth in claim 1, wherein the RFID device is configured to transmit a radio frequency signal transparently through the barrier system.

3. The apparatus as set forth in claim 1, wherein one of the first and second layers is an elastomer.

4. The apparatus as set forth in claim 3, wherein the other of the first and second layers is an elastomer.

5. The apparatus as set forth in claim 1, wherein the first layer is generally pliable and the second layer is generally rigid such that the first layer and the second layer may be structured and arranged to encase the RFID device.

6. The apparatus as set forth in claim 1, wherein the first layer is generally rigid and the second layer is generally pliable such that the first layer and the second layer may be structured and arranged to encase the RFID device.

7. The apparatus as set forth in claim 1, wherein the first layer and the second layer utilize a similar base elastomer with a compatible cross-linking agent.

8. The apparatus as set forth in claim 7, wherein the cross-linking agent is peroxide based.

9. The apparatus as set forth in claim 7, wherein the first layer is compounded for a low stiffness, lower than the second layer, and the second layer is compounded for a high stiffness, higher than the first layer.

10. The apparatus as set forth in claim 9, where the first layer has a Shore A hardness between 25 and 60, and the second layer has a Shore D hardness between 35 and 80.

11. The apparatus as set forth in claim 9, wherein the second layer comprises:

an elastomer, the elastomer having the same base elastomer as the first layer; and

a thermoplastic, the thermoplastic having a glass transition temperature below a cross-linking temperature of the first layer and the second layer, the thermoplastic having a glass transition temperature below a desired maximum processing temperature.

12. The apparatus as set forth in claim 11, where the thermoplastic comprises a one of, but not limited to thermoplastic epoxy, amorphous polyamide, styrenic, cellulosic, and non-crystalline polyester.

13. The apparatus as set forth in claim 1, wherein the structure of the RFID device adds rigidity and strength to the barrier system.

14. A method for manufacturing an apparatus for providing a radio frequency identification (RFID), comprising:

constructing a RFID device configured to transmit a radio frequency transparently;

arranging a barrier system around the RFID device to encase at least a portion of the RFID device, the barrier system including a first layer defining a first set of physical properties and a second layer defining a second set of physical properties;

interlinking the first layer with the second layer; and

causing the first layer and the second layer to conform to the shape of the RFID device.

15. The method as set forth in claim 14, wherein interlinking the first layer with the second layer includes forming a continuous transitory material at a first margin portion of the first layer and a second margin portion of the second layer.

16. The method as set forth in claim 15, wherein interlinking the first layer with the second layer includes molding and curing the first layer and the second layer around the RFID device.

17. The method as set forth in claim 16, wherein molding and curing the first layer and the second layer around the RFID device includes performing the molding and the curing in a single operation.

18. The method as set forth in claim 17, wherein molding and curing includes applying at least one of, but not limited to, heat and pressure.

19. The method as set forth in claim 17, wherein performing the molding and the curing in a single operation includes selecting base elastomers with a compatible cross-linking agent as the first layer and the second layer.

20. The method as set forth in claim 19, wherein selecting base elastomers with a compatible cross-linking agent includes selecting a peroxide based cross-linking agent.

21. The method as set forth in claim 14, wherein interlinking the first layer with the second layer includes:

compounding the first layer for a low stiffness, lower than the second layer; and

compounding the second layer for a high stiffness, higher than the first layer.

22. The method as set forth in claim 21, wherein compounding the first layer for the low stiffness and compounding the second layer for the high stiffness includes:

causing the first layer to have a Shore A hardness between 25 and 60; and

causing the second layer to have a Shore D hardness between 35 and 80.

23. The method as set forth in claim 14, wherein interlinking the first layer with the second layer includes:

compounding the first layer for a high stiffness, higher than the second layer; and

compounding the second layer for a low stiffness, lower than the first layer.

24. The method as set forth in claim 21, wherein compounding the second layer for the high stiffness includes:

selecting an elastomer having the same base elastomer as the first layer, and

selecting a thermoplastic having a glass transition temperature below a cross-linking temperature of the first layer and the second layer, the thermoplastic having a glass transition temperature below a desired maximum processing temperature.

25. The method as set forth in claim 24, wherein selecting the thermoplastic includes selecting a one of, but not limited to, thermoplastic epoxy, amorphous polyamide, styrenic, cellulosic, and non-crystalline polyester.

26. A method for protecting a radio frequency identification (RFID) device from environmental and physical impact, comprising:

arranging a barrier system around the RFID device to encase at least a portion of the RFID device, the barrier system including a first layer defining a first set of physical properties and a second layer defining a second set of physical properties;

interlinking the first layer with the second layer; and

causing the first layer and the second layer to conform to the shape of the RFID device.

27. The method as set forth in claim 26, wherein interlinking the first layer with the second layer includes forming a continuous transitory material at a first margin portion of the first layer and a second margin portion of the second layer.

28. The method as set forth in claim 27, wherein interlinking the first layer with the second layer includes molding and curing the first layer and the second layer around the RFID device.

29. The method as set forth in claim 28, wherein molding and curing the first layer and the second layer around the RFID device includes performing the molding and the curing in a single operation.

30. An item having a radio frequency identification (RFID) device attached, the RFID device comprising:

a barrier system adapted to encase at least a portion of the RFID device, wherein the barrier system includes;

a first layer defining a first set of physical properties and including a first margin portion; and

a second layer defining a second set of physical properties and including a second margin portion, the first margin portion being interlinked to the second margin portion to form a continuous transitory material therebetween.

31. The method as set forth in claim 30, wherein the item is a machine.

32. The method as set forth in claim 30, wherein the item is a part.

33. The method as set forth in claim 30, wherein the item is an attachment on a machine.

34. A method for protecting a radio frequency identification (RFID) device, the RFID device having a first layer defining a first set of physical properties and including a first margin portion and a second layer defining a second set of physical properties and including a second margin portion, the first margin portion being interlinked to the second margin portion to form a continuous transitory material therebetween, comprising:

receiving an impact by the second layer; and

responsively absorbing the vibration and movement of the second layer impact by the first layer.