Led and fabrication method of same
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Accused Products
Abstract
An LED can include a silicon substrate and a pair of electrodes formed inside a horn that is formed on the silicon substrate by anisotropic etching. The LED can include an LED chip mounted inside the horn, the LED chip being electrically connected to the pair of electrodes. A resin mold made of a resin material can be filled in the horn.
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Citations
84 Claims
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38. An LED comprising:
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a silicon substrate including a horn formed by anisotropic etching;
a pair of electrodes located inside the horn;
an LED chip located inside the horn, the LED chip being electrically connected to the pair of electrodes; and
a resin mold made of a resin material that is filled in the horn. - View Dependent Claims (39, 40, 41, 42, 43, 44, 45, 46)
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47. A method of fabricating an LED comprising:
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providing a silicon substrate, the silicon substrate having a surface;
forming a horn in the surface of the silicon substrate by anisotropic etching;
locating a pair of electrodes in the horn;
mounting an LED chip inside the horn such that the LED chip is electrically connected to the pair of electrodes; and
filling the interior of the horn with a resin material to form a resin mold.
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48. An LED comprising:
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a silicon substrate;
a horn formed on the silicon substrate by liquid phase etching;
at least two electrodes located inside the horn; and
at least one LED chip located inside the horn, the LED chip being electrically connected to the electrodes. - View Dependent Claims (1, 49, 50, 51, 52, 53, 54, 55, 56, 57, 58, 59, 60, 61, 62, 63, 64, 65)
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63-1. The LED according to claim 61, wherein
an upper end of the partition has a crest line located lower than an upper surface of the silicon substrate.
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66. An LED comprising:
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a silicon substrate;
a horn formed on the silicon-substrate by liquid phase etching;
at least two contact-holes formed on the silicon substrate by liquid phase etching;
at least two electrodes extending from an inside of the horn to a lower end of the contact-holes; and
at least one LED chip located inside the horn, the LED chip being electrically connected to the electrodes. - View Dependent Claims (69, 70)
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67. An LED comprising:
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a silicon substrate;
a horn formed on the silicon substrate by liquid phase etching;
at least two contact-edges formed on the silicon substrate by liquid phase etching;
at least two electrodes extending from an inside of the horn to a lower end of the contact-edges; and
at least one LED chip located inside the horn, the LED chip being electrically connected to the electrodes. - View Dependent Claims (68, 71, 72, 73, 74, 84)
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75. A method of fabricating an LED comprising:
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forming a horn on a silicon substrate by liquid phase etching;
forming at least two electrodes inside the horn;
mounting at least one LED chip inside the horn such that the LED chip is electrically connected to the electrodes. - View Dependent Claims (76, 77, 78, 79)
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80. A method of fabricating an LED comprising:
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providing a silicon substrate;
forming an oxidized film on a surface of the silicon substrate;
patterning the oxidized film so as to expose each portion of the silicon substrate that is to form a contact-hole;
forming a shallow recess in each portion that is to form a contact-hole by liquid phase etching;
patterning the oxidized film so as to expose each portion of the silicon substrate that is to form a horn;
forming horns and contact-holes on the silicon substrate by liquid phase etching;
providing an insulating film on the surface of the silicon substrate;
forming electrode-patterns on the silicon substrate;
mounting at least one LED chip inside each horn such that the LED chip is electrically connected to the electrodes; and
cutting out at least a portion of the silicon substrate.
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81. A method of fabricating an LED comprising:
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providing a silicon substrate;
forming an oxidized film on a surface of the silicon substrate;
patterning the oxidized film so as to expose each portion of the silicon substrate that is to form a through-bore;
forming a shallow recess in each portion that is to form a through-bore by liquid phase etching;
patterning the oxidized film so as to expose each portion of the silicon substrate that is to form a horn;
forming horns and through-bores on the silicon substrate by liquid phase etching;
providing an insulating film on the surface of the silicon substrate;
providing electrode-patterns on the silicon substrate;
mounting at least one LED chip inside each horn such that the LED chip is electrically connected to the electrodes; and
cutting out at least a portion of the silicon substrate so as to cross each through-bore and form a contact edge.
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82. A method of fabricating an LED comprising:
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forming at least two electrodes on a first silicon substrate;
forming through-bores on a second silicon substrate by liquid phase etching and forming a horn on a side wall of each through-bore;
bonding the first and second silicon substrates to each other so as to expose the electrodes in each through-bore; and
mounting at least one LED chip inside the horn such that the LED chip is electrically connected to the electrodes. - View Dependent Claims (83)
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Specification