Light-emitting diode

• US 20060001361A1
• Filed: 06/21/2005
• Published: 01/05/2006
• Est. Priority Date: 06/21/2004
• Status: Active Grant

• Current Assignee: Citizen Electronics Company Limited
• Original Assignee: Citizen Electronics Company Limited
• Inventors: Kikuchi, Satoru, Imai, Sadato
• Granted Patent: US 7,642,704 B2
• Time in Patent Office: Days
• US Class Current: 313/498
• CPC Class Codes: H01L 2224/48091 Arched
• CPC Class Codes: H01L 2924/00 Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/00014 the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
• CPC Class Codes: H01L 2924/10253 Silicon [Si]
• CPC Class Codes: H01L 33/486 adapted for surface mounting
• CPC Class Codes: H01L 33/64 Heat extraction or cooling elements
• CPC Class Codes: H05K 1/0204 using means for thermal conduction connection in the thickness direction of the substrate H05K1/0207 takes precedence
• CPC Class Codes: H05K 1/021 Components thermally connected to metal substrates or heat-sinks by insert mounting
• CPC Class Codes: H05K 1/182 associated with components mounted in the printed circuit board, e.g. insert mounted components [IMC]
• CPC Class Codes: H05K 2201/09181 Notches in edge pads
• CPC Class Codes: H05K 2201/10106 Light emitting diode [LED]
• CPC Class Codes: H05K 3/0061 onto a metallic substrate, e.g. a heat sink heat sinks for electric apparatus H05K7/20
• CPC Class Codes: H05K 3/3442 having edge contacts, e.g. leadless chip capacitors, chip carriers

Abstract

The LED comprises: a base having high thermal conductivity and having a mounting surface for die bonding; a printed circuit board mounted on the base and having a hole to expose a part of the mounting surface of the base and having a protruding portion projecting horizontally outward on the outer periphery of the base; an LED element mounted on the mounting surface of the base exposed in the hole of the printed circuit board; and a resin material sealing the LED element from above; wherein through-holes electrically connected to the LED element are formed at the outer periphery of the protruding portion and an external connection electrode is provided to the upper and lower surfaces of the through-holes. This LED enhances the heat dissipating effect to enable generation of high-luminance light and can also be mounted on either the upper or lower surface of a motherboard.

Claims

1. A light-emitting diode comprising:

a base having high thermal conductivity and having a mounting surface for die bonding;

a printed circuit board mounted on the base and having a hole to expose a part of the mounting surface of the base and having a protruding portion projecting horizontally outward on the outer periphery of the base;

at least one light-emitting diode element mounted on the mounting surface of the base exposed in the hole of the printed circuit board;

at least one pair of through-holes provided at two facing ends of the printed circuit substrate and electrically connected to the light-emitting diode; and

a resin material sealing the light-emitting diode element from above.

2. A light-emitting diode according to claim 1, wherein the external connection electrode is provided to both the upper and lower surfaces adjacent to the through-holes.

3. A light-emitting diode according to claim 1, wherein the base is made of metal, metal alloy or ceramics.

4. A light-emitting diode according to claim 1, wherein the base is made of copper, copper alloy, aluminum, aluminum alloy or aluminum-based ceramics.

5. A light-emitting diode according to claim 1, further comprising a sub-mount substrate provided on the mounting surface wherein the light-emitting diode element is mounted on the sub-mount substrate.

6. A light-emitting diode according to claim 5, wherein the sub-mount substrate is formed from an aluminum-based ceramics or silicon substrate.

7. A light-emitting diode according to claim 1, wherein a seal frame or a reflection frame having a light reflecting member on the inner circumferential surface thereof is arranged to surround the light-emitting diode element.

8. A light-emitting diode according to claim 1, wherein a plurality of light-emitting diode elements are mounted on the mounting surface exposed in the hole in the printed circuit board.