Ground structure for temperature-sensing resistor noise reduction
First Claim
Patent Images
1. An inkjet printhead comprising:
- a temperature sensing resistor configured to have a low voltage end; and
a ground structure at least partially enclosing the temperature sensing resistor and coupled to the temperature sensing resistor at the low voltage end.
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Abstract
An inkjet printhead. The inkjet printhead includes a temperature-sensing resistor with a low voltage end which is connected to a ground structure that at least partially encloses the temperature sensing resistor.
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Citations
27 Claims
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1. An inkjet printhead comprising:
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a temperature sensing resistor configured to have a low voltage end; and
a ground structure at least partially enclosing the temperature sensing resistor and coupled to the temperature sensing resistor at the low voltage end. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8)
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9. An inkjet printing apparatus comprising:
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a printing apparatus ground; and
a printhead having a printhead chip ground and a ground structure at least partially enclosing a temperature sensing resistor, the temperature sensing resistor having a low voltage end being coupled to the ground structure and the printing apparatus ground thereby bypassing the printhead chip ground. - View Dependent Claims (10, 11, 12, 13, 14)
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15. An ejector chip comprising:
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an ejector chip ground configured to have a first ground potential of the ejector chip;
a bond pad electrically spaced apart from the ejector chip ground and configured to be coupled to a second ground having a second ground potential;
a ground structure coupled to the bond pad thereby having the second ground potential; and
a temperature sensing resistor coupled to the bond pad thereby also having the second ground potential. - View Dependent Claims (16, 17, 18, 19, 20, 21)
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22. A method of reducing noise in a temperature sensing resistor implanted on an ejector chip having an ejector chip ground, the method comprising the acts of:
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determining a lower voltage end electrically spaced apart from the ejector chip ground at the temperature sensing resistor;
at least partially enclosing the temperature sensing resistor with a ground structure; and
connecting the ground structure to the lower voltage end of the temperature sensing resistor. - View Dependent Claims (23, 24, 25, 26, 27)
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Specification