Printable conductive features and processes for making same

US 20060001726A1
Filed: 07/08/2005
Published: 01/05/2006
Est. Priority Date: 10/05/2001
Status: Abandoned Application

First Claim

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1. A process for forming a conductive feature, wherein the process comprises the steps of:

(a) applying a first ink comprising a metal precursor to at least a portion of a first substrate to form an at least partially coated substrate; and

(b) contacting the first ink with a primary reducing agent under conditions effective to reduce the metal in the metal precursor to its elemental form.

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Abstract

Processes for forming conductive features from one or more inks and conductive features formed from the processes. In one aspect, the process includes a step of applying a first ink comprising a metal precursor to at least a portion of a first substrate to form an at least partially coated substrate. In a second step, the first ink is contacted with a reducing agent, optionally derived from a second ink, under conditions effective to reduce the metal in the metal precursor to its elemental form.

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125 Claims

1. A process for forming a conductive feature, wherein the process comprises the steps of:
- (a) applying a first ink comprising a metal precursor to at least a portion of a first substrate to form an at least partially coated substrate; and
  
  (b) contacting the first ink with a primary reducing agent under conditions effective to reduce the metal in the metal precursor to its elemental form.
- View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10, 11, 12, 13, 14, 15, 16, 17, 18, 19, 20, 21, 22, 23, 24, 25, 26, 27, 28, 29, 30, 31, 32, 33, 34, 35, 36, 37, 38, 39, 40, 41, 42, 43, 44, 45, 46, 47, 48, 49, 50, 51, 52, 53, 54, 55, 56, 57, 58, 59, 60, 61, 62, 63, 64, 65, 66, 67, 68, 69, 70, 71, 72, 73, 74, 75, 76, 77, 78, 79, 80, 81, 82, 83, 84, 85, 86, 87, 88, 89, 90, 91, 92, 93, 94, 95, 96, 97, 98, 99, 100, 101, 102)
- - 2. The process of claim 1, wherein the process further comprises the steps of:
    - (c) applying a second ink comprising the primary reducing agent or a solution thereof, before step (a), to at least a portion of a surface of an initial substrate; and
      
      (d) at least partially drying the second ink on the initial substrate to form the first substrate, wherein the first substrate has the primary reducing agent disposed thereon.
  - 3. The process of claim 2, wherein the first ink is selectively applied to the first substrate in a predetermined pattern in step (a).
  - 4. The process of claim 2, wherein the second ink is selectively applied to the initial substrate in a predetermined pattern in step (c).
  - 5. The process of claim 4, wherein the first ink is selectively applied to the first substrate in a predetermined pattern in step (a).
  - 6. The process of claim 1, wherein the first ink is selectively applied to the first substrate in a predetermined pattern in step (a).
  - 7. The process of claim 1, wherein steps (a) and (b) occur simultaneously.
  - 8. The process of claim 1, wherein steps (a) and (b) occur sequentially.
  - 9. The process of claim 1, wherein the metal precursor comprises a metal nitrate or a metal carboxylate.
  - 10. The process of claim 1, wherein the metal precursor comprises silver nitrate or a silver carboxylate
  - 11. The process of claim 1, wherein the metal precursor comprises copper nitrate or a copper carboxylate.
  - 12. The process of claim 1, wherein the metal precursor comprises nickel nitrate or a nickel carboxylate.
  - 13. The process of claim 1, wherein the first ink further comprises metal nanoparticles in an amount from about 1 volume percent to about 60 volume percent, based on the total volume of the first ink.
  - 14. The process of claim 13, wherein the first ink further comprises metal nanoparticles in an amount from about 10 volume percent to about 60 volume percent, based on the total volume of the first ink.
  - 15. The process of claim 14, wherein the first ink further comprises metal nanoparticles in an amount from about 30 volume percent to about 40 volume percent, based on the total volume of the first ink.
  - 16. The process of claim 13, wherein the weight ratio of the metal in the metal precursor to the metal in the metal nanoparticles is from about 0.2 to about 1.0.
  - 17. The process of claim 1, wherein the first ink further comprises silver nanoparticles.
  - 18. The process of claim 1, wherein the first ink further comprises copper nanoparticles.
  - 19. The process of claim 1, wherein the first ink further comprises nickel nanoparticles.
  - 20. The process of claim 1, wherein the first ink further comprises one or more of particulate carbon, carbon black, modified carbon black, carbon nanotubes and/or carbon flakes.
  - 21. The process of claim 1, wherein the first ink further comprises a solvent selected from the group consisting of alcohols, amines, amides, water, ketones, ethers, aldehydes, alkenes, and hydrocarbons, and wherein the solvent is less capable than the primary reducing agent of reducing the metal in the metal precursor to its elemental form.
  - 22. The process of claim 1, wherein the primary reducing agent is selected from the group consisting of alcohols, aldehydes, amines, amides, alanes, boranes, borohydrides, aluminohydrides and organosilanes.
  - 23. The process of claim 1, wherein the first substrate comprises a component selected from the group consisting of an organic substrate, a glass substrate, a ceramic substrate, paper, and a polymeric substrate.
  - 24. The process of claim 1, wherein the first ink has a viscosity of not greater than about 100 centipoise.
  - 25. The process of claim 24, wherein the first ink has a viscosity of not greater than about 60 centipoise.
  - 26. The process of claim 25, wherein the first ink has a viscosity of not greater than about 40 centipoise.
  - 27. The process of claim 1, wherein the first ink has a surface tension of from about 15 dynes/cm to about 72 dynes/cm.
  - 28. The process of claim 27, wherein the first ink has a surface tension of from about 20 dynes/cm to about 60 dynes/cm.
  - 29. The process of claim 1, wherein step (a) comprises ink jetting the first ink onto the first substrate to form the at least partially coated substrate.
  - 30. The process of claim 1, wherein step (a) comprises applying the first ink to the first substrate with a printing process selected from the group consisting of:
    - intaglio printing, gravure printing, lithographic printing, and flexographic printing.
  - 31. The process of claim 1, wherein the conductive feature has a linear form and has a width of less than about 200 μ
    - m.
  - 32. The process of claim 1, wherein steps (a) and (b) occur at less than about 200°
    - C.
  - 33. The process of claim 1, wherein at least 95 weight percent of the metal in the metal precursor is reduced to its elemental form in less than 1 second.
  - 34. The process of claim 1, wherein the first substrate comprises a reducing agent layer and an underlying support layer, wherein the reducing agent layer comprises the primary reducing agent and has an external surface, and wherein the first ink is applied to at least a portion of the external surface in step (a).
  - 35. The process of claim 1, wherein the first ink comprises the metal in the metal precursor in an amount greater than about 10 weight percent, based on the total weight of the first ink.
  - 36. The process of claim 1, wherein the surface tension of the primary reducing agent is less than the surface tension of the first ink.
  - 37. The conductive feature formed by the process of claim 1.
  - 38. The conductive feature of claim 37, wherein the conductive feature has a resistivity of no greater than 500 times the resistivity of the bulk metal.
  - 39. The conductive feature of claim 37, wherein the conductive feature has a resistivity of no greater than 100 times the resistivity of the bulk metal.
  - 40. The conductive feature of claim 37, wherein the conductive feature has a resistivity of no greater than 10 times the resistivity of the bulk metal.
  - 41. The conductive feature of claim 37, wherein the conductive feature comprises an insulating phase and has a resistivity of from about 1,000 μ
    - Ω
      
      -cm to about 1,000,000 μ
      
      Ω
      
      -cm.
  - 42. The conductive feature of claim 37, wherein the conductive feature comprises an insulating phase and has a resistivity of from about 10,000 μ
    - Ω
      
      -cm to about 1,000,000 μ
      
      Ω
      
      -cm.
  - 43. The process of claim 1, wherein the process further comprises the step of:
    - (c) applying a second ink comprising the primary reducing agent to at least a portion of the at least partially coated substrate after step (a).
  - 44. The process of claim 43, wherein the second ink is selectively applied to the at least partially coated substrate in a predetermined pattern in step (c).
  - 45. The process of claim 43, wherein the second ink applied in step (c) at least partially overlaps the first ink.
  - 46. The process of claim 43, wherein the first ink is selectively applied to the first substrate in a first predetermined pattern in step (a).
  - 47. The process of claim 46, wherein a second ink comprising the primary reducing agent is selectively applied to the at least partially coated substrate in a second predetermined pattern in step (c).
  - 48. The process of claim 43, wherein the second ink further comprises metal nanoparticles in an amount from about 1 volume percent to about 60 volume percent, based on the total volume of the second ink.
  - 49. The process of claim 48, wherein the second ink further comprises metal nanoparticles in an amount from about 5 volume percent to about 60 volume percent, based on the total volume of the second ink.
  - 50. The process of claim 48, wherein the second ink further comprises metal nanoparticles in an amount from about 5 volume percent to about 30 volume percent, based on the total volume of the second ink.
  - 51. The process of claim 43, wherein the second ink further comprises a cap stripping agent.
  - 52. The process of claim 43, wherein the second ink further comprises a flocculent.
  - 53. The process of claim 43, wherein the first ink has a pH of less than 7 and the second ink has a pH of greater than 7.
  - 54. The process of claim 43, wherein the first ink has a pH of greater than 7 and the second ink has a pH of less than 7.
  - 55. The process of claim 43, wherein the second ink further comprises silver nanoparticles.
  - 56. The process of claim 43, wherein the second ink further comprises copper nanoparticles.
  - 57. The process of claim 43, wherein the second ink further comprises nickel nanoparticles.
  - 58. The process of claim 43, wherein the second ink further comprises one or more of particulate carbon, carbon black, modified carbon black, carbon nanotubes and/or carbon flakes.
  - 59. The process of claim 43, wherein the second ink further comprises a solvent selected from the group consisting of alcohols, amines, amides, water, ketones, ethers, aldehydes, alkenes, and hydrocarbons, and wherein the solvent is less capable than the primary reducing agent of reducing the metal in the metal precursor to its elemental form.
  - 60. The process of claim 43, wherein the second ink has a viscosity of not greater than about 100 centipoise.
  - 61. The process of claim 43, wherein the second ink has a viscosity of not greater than about 60 centipoise.
  - 62. The process of claim 43, wherein the second ink has a viscosity of not greater than about 40 centipoise.
  - 63. The process of claim 43, wherein the second ink has a surface tension of from about 15 dynes/cm to about 72 dynes/cm.
  - 64. The process of claim 43, wherein the second ink has a surface tension of from about 20 dynes/cm to about 60 dynes/cm.
  - 65. The process of claim 43, wherein step (c) comprises ink jetting the second ink onto the at least partially coated substrate.
  - 66. The process of claim 43, wherein step (c) comprises applying the second ink to the at least partially coated substrate with a printing process selected from the group consisting of:
    - intaglio printing, gravure printing, lithographic printing, and flexographic printing.
  - 67. The conductive feature formed by the process of claim 43.
  - 68. The conductive feature of claim 67, wherein the conductive feature has a resistivity of no greater than 500 times the resistivity of the bulk metal.
  - 69. The conductive feature of claim 67, wherein the conductive feature has a resistivity of no greater than 100 times the resistivity of the bulk metal.
  - 70. The conductive feature of claim 67, wherein the conductive feature has a resistivity of no greater than 10 times the resistivity of the bulk metal.
  - 71. The conductive feature of claim 67, wherein the conductive feature comprises an insulating phase and has a resistivity of from about 1,000 μ
    - Ω
      
      -cm to about 1,000,000 μ
      
      Ω
      
      -cm.
  - 72. The conductive feature of claim 67, wherein the conductive feature comprises an insulating phase and has a resistivity from about 10,000 μ
    - Ω
      
      -cm to about 1,000,000 μ
      
      Ω
      
      -cm.
  - 73. The process of claim 1, wherein the process further comprises the step of:
    - (c) applying a second ink comprising the primary reducing agent to an initial substrate, prior to step (a), to form the first substrate.
  - 74. The process of claim 73, wherein the second ink is selectively applied to the initial substrate in a predetermined pattern in step (c).
  - 75. The process of claim 73, wherein the first ink applied in step (a) at least partially overlaps the second ink.
  - 76. The process of claim 73, wherein the first ink is selectively applied to the first substrate in a first predetermined pattern in step (a).
  - 77. The process of claim 76, wherein a second ink comprising the primary reducing agent is selectively applied to the initial substrate in a second predetermined pattern in step (c).
  - 78. The process of claim 73, wherein the second ink further comprises metal nanoparticles in an amount from about 1 volume percent to about 60 volume percent, based on the total volume of the second ink.
  - 79. The process of claim 78, wherein the second ink further comprises metal nanoparticles in an amount from about 10 volume percent to about 60 volume percent, based on the total volume of the second ink.
  - 80. The process of claim 78, wherein the second ink further comprises metal nanoparticles in an amount from about 30 volume percent to about 40 volume percent, based on the total volume of the second ink.
  - 81. The process of claim 73, wherein the second ink further comprises a cap stripping agent.
  - 82. The process of claim 73, wherein the second ink further comprises a flocculent.
  - 83. The process of claim 73, wherein the first ink has a pH of less than 7 and the second ink has a pH of greater than 7.
  - 84. The process of claim 73, wherein the first ink has a pH of greater than 7 and the second ink has a pH of less than 7.
  - 85. The process of claim 73, wherein the second ink further comprises silver nanoparticles.
  - 86. The process of claim 73, wherein the second ink further comprises copper nanoparticles.
  - 87. The process of claim 73, wherein the second ink further comprises nickel nanoparticles.
  - 88. The process of claim 73, wherein the second ink further comprises one or more of particulate carbon, carbon black, modified carbon black, carbon nanotubes and/or carbon flakes.
  - 89. The process of claim 73, wherein the second ink further comprises a solvent selected from the group consisting of alcohols, amines, amides, water, ketones, ethers, aldehydes, alkenes, and hydrocarbons, and wherein the solvent is less capable than the primary reducing agent of reducing the metal in the metal precursor to its elemental form.
  - 90. The process of claim 73, wherein the second ink has a viscosity of not greater than about 100 centipoise.
  - 91. The process of claim 73, wherein the second ink has a viscosity of not greater than about 60 centipoise.
  - 92. The process of claim 73, wherein the second ink has a viscosity of not greater than about 40 centipoise.
  - 93. The process of claim 73, wherein the second ink has a surface tension of from about 15 dynes/cm to about 72 dynes/cm.
  - 94. The process of claim 73, wherein the second ink has a surface tension of from about 20 dynes/cm to about 60 dynes/cm.
  - 95. The process of claim 73, wherein step (c) comprises ink jetting the second ink onto the initial substrate.
  - 96. The process of claim 73, wherein step (c) comprises applying the second ink to the initial substrate with a printing process selected from the group consisting of:
    - intaglio printing, gravure printing, lithographic printing, and flexographic printing.
  - 97. The conductive feature formed by the process of claim 73.
  - 98. The conductive feature of claim 97, wherein the conductive feature has a resistivity of no greater than 500 times the resistivity of the bulk metal.
  - 99. The conductive feature of claim 97, wherein the conductive feature has a resistivity of no greater than 100 times the resistivity of the bulk metal.
  - 100. The conductive feature of claim 97, wherein the conductive feature has a resistivity of no greater than 10 times the resistivity of the bulk metal.
  - 101. The conductive feature of claim 97, wherein the conductive feature comprises an insulating phase and has a resistivity of from about 1,000 μ
    - Ω
      
      -cm to about 1,000,000 μ
      
      Ω
      
      -cm.
  - 102. The conductive feature of claim 97, wherein the conductive feature comprises an insulating phase and has a resistivity of from about 10,000 μ
    - Ω
      
      -cm to about 1,000,000 μ
      
      Ω
      
      -cm.

103. A reducing agent composition suitable for ink jetting, the reducing agent composition comprising a primary reducing agent dissolved in a solvent, wherein the reducing agent composition is capable of reducing a metal in a metal precursor to its elemental form, and wherein the reducing agent composition has a surface tension of from about 15 to about 72 dynes/cm and a viscosity of not greater than about 1000 centipoise.
- View Dependent Claims (104, 105, 106, 107, 108, 109, 110, 111, 112, 113, 114)
- - 104. The reducing agent composition of claim 103, where the reducing agent composition consists essentially of the primary reducing agent dissolved in the solvent.
  - 105. The reducing agent composition of claim 103, wherein the reducing agent composition has a pH of from about 5 to about 7.
  - 106. The reducing agent composition of claim 103, wherein the reducing agent composition has a pH of from about 7 to about 9.
  - 107. The reducing agent composition of claim 103, further comprising metal nanoparticles in an amount from about 1 volume percent to about 60 volume percent, based on the total volume of the reducing agent composition.
  - 108. The reducing agent composition of claim 103, further comprising silver nanoparticles.
  - 109. The reducing agent composition of claim 103, further comprising copper nanoparticles.
  - 110. The reducing agent composition of claim 103, further comprising one or more of particulate carbon, carbon black, modified carbon black, carbon nanotubes and/or carbon flakes.
  - 111. The reducing agent composition of claim 103, further comprising a cap stripping agent.
  - 112. The reducing agent composition of claim 103, further comprising a flocculent.
  - 113. The reducing agent composition of claim 103, wherein the primary reducing agent is selected from the group consisting of alcohols, aldehydes, amines, amides, alanes, boranes, borohydrides, aluminohydrides and organosilanes.
  - 114. The reducing agent composition of claim 103, wherein the solvent is selected from the group consisting of alcohols, amines, amides, water, ketones, ethers, aldehydes and alkenes.

115. A substrate suitable for receiving an ink jetted ink, the substrate comprising:
- (a) a support material having a surface; and
  
  (b) a primary reducing agent disposed over at least a portion of the surface.
- View Dependent Claims (116, 117, 118, 119, 120, 121, 122, 123, 124, 125)
- - 116. The substrate of claim 115, wherein the primary reducing agent is disposed over a majority of the surface.
  - 117. The substrate of claim 115, wherein the primary reducing agent is selectively disposed in a pattern over the portion of the surface.
  - 118. The substrate of claim 115, wherein the support material has opposing major planar surfaces, and the primary reducing agent is disposed over a majority of one of the opposing major planar surfaces.
  - 119. The substrate of claim 118, wherein the support material comprises paper.
  - 120. The substrate of claim 118, wherein the primary reducing agent is disposed over at least 90 percent of one of the opposing major planar surfaces.
  - 121. The substrate of claim 118, wherein the primary reducing agent is disposed over at least 90 percent of both of the opposing major planar surfaces.
  - 122. The substrate of claim 115, wherein the substrate is dry.
  - 123. The substrate of claim 115, wherein the primary reducing agent is selected from the group consisting of alcohols, aldehydes, amines, amides, alanes, boranes, borohydrides, aluminohydrides and organosilanes.
  - 124. The substrate of claim 115, wherein the support material is selected from the group consisting of paper, cardboard, glass and plastic.
  - 125. The substrate of claim 115, wherein the primary reducing agent has a molecular weight greater than about 500.

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Current Assignee
Cabot Corporation
Original Assignee
Cabot Corporation
Inventors
Kunze, Klaus, Kodas, Toivo T., Kowalski, Mark

Application Number

US11/176,640
Publication Number

US 20060001726A1
Time in Patent Office

Days
Field of Search
US Class Current

347/105
CPC Class Codes

C23C 18/06   Coating on selected surface...

C23C 18/08   characterised by the deposi...

H01B 1/026   Alloys based on copper

H05K 3/105   by conversion of non-conduc...

Printable conductive features and processes for making same

First Claim

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Abstract

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125 Claims

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Printable conductive features and processes for making same

First Claim

1 Assignment

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Abstract

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