Liquid crystal display device and fabricating method thereof

• US 20060001789A1
• Filed: 06/28/2005
• Published: 01/05/2006
• Est. Priority Date: 06/30/2004
• Status: Active Grant

• Current Assignee: LG Display Co., Ltd.
• Original Assignee: LG Display Co., Ltd.
• Inventors: Ahn, Byung Chul
• Granted Patent: US 7,643,122 B2
• Time in Patent Office: Days
• US Class Current: 349/42
• CPC Class Codes: G02F 1/133345 Insulating layers G02F1/1335, G02F1/1337, G02F1/135, G02F1/136 take precedence
• CPC Class Codes: G02F 1/1339 Gaskets; Spacers; Sealing of cells
• CPC Class Codes: G02F 1/1345 Conductors connecting electrodes to cell terminals
• CPC Class Codes: G02F 1/136286 Wiring, e.g. gate line, drain line
• CPC Class Codes: Y02A 50/30 Against vector-borne diseases, e.g. mosquito-borne, fly-borne, tick-borne or waterborne diseases whose impact is exacerbated by climate change

Abstract

The present invention provides a liquid crystal display panel that is adaptive for preventing a liquid crystal contamination as well as improving an adhesive strength of a sealant and an organic insulating film, and a fabricating method thereof. A liquid crystal display device according to an embodiment of the present invention includes: a first and a second substrate having a liquid crystal region, a sealant region, and an outer region; a wiring disposed on the first substrate, the wiring crossing the sealant region; a gate insulating film disposed on the wiring; an organic insulating film disposed on a portion of the wiring; and a sealant disposed on the sealant region of the first and second substrates, wherein the sealant is in contact with the gate insulating film.

Claims

1. A liquid crystal display device, comprising:

a first and a second substrate having a liquid crystal region, a sealant region, and an outer region;

a wiring disposed on the first substrate, the wiring crossing the sealant region;

a gate insulating film disposed on the wiring;

an organic insulating film disposed on a portion of the wiring; and

a sealant disposed on the sealant region of the first and second substrates, wherein the sealant is in contact with the gate insulating film.

2. The liquid crystal display device of claim 1, wherein the wiring includes:

a gate line disposed on the first substrate in the liquid crystal region;

a gate pad disposed on the first substrate in the outer region; and

a gate link disposed on the first substrate and crossing the sealant region.

3. The liquid crystal display device of claim 2, wherein the gate insulating film has a portion that is disposed on the gate link and has a line shape.

4. The liquid crystal display device of claim 1, wherein the wiring includes:

a data line disposed on the first substrate in the liquid crystal region;

a data pad disposed on the first substrate in the outer region; and

a data link disposed on the first substrate and crossing the sealant region.

5. The liquid crystal display device of claim 4, wherein the gate insulating film has a portion that is disposed on the data link and has a line shape.

6. The liquid crystal display device of claim 1, wherein the sealant overlaps the organic insulating film.

7. The liquid crystal display device of claim 6, further comprising a dummy protective pattern disposed between the sealant and the organic insulating film.

8. The liquid crystal display device of claim 7, wherein the dummy protective pattern includes a transparent conductive layer.

9. The liquid crystal display device of claim 6, further comprising a dummy pattern disposed between the organic insulating film and the gate insulating film.

10. The liquid crystal display device of claim 9, wherein the dummy pattern includes a metal.

11. The liquid crystal display device of claim 9, further comprising a semiconductor layer disposed underneath the dummy pattern.

12. The liquid crystal display device of claim 1, wherein the gate insulating film includes an inorganic insulating film.

13. The liquid crystal display device of claim 1, further comprising an inorganic insulating film between the gate insulating film and the organic insulating film.

14. The liquid crystal display device of claim 13, wherein a length of the inorganic insulating film is shorter than a length of an exposing portion of the gate insulating film.

15. The liquid crystal display device of claim 1, further comprising:

a tape carrier package attaching a pad area having at least one of a gate pad and a data pad through an anisotropic conductive film; and

a second sealant sealing the tape carrier package and the pad area.

16. The liquid crystal display device of claim 15, wherein the second sealant surrounds a periphery of the tape carrier package.

17. The liquid crystal display device of claim 15, wherein an edge portion of a pad upper electrode is between an edge portion of the tape carrier package and an edge portion of the sealant.

18. A method of fabricating a liquid crystal display device, comprising:

providing first and second substrates having a liquid crystal region, a sealant region, and an outer region;

forming a wiring on the first substrate, wherein the wiring crosses the sealant region;

forming an inorganic insulating film on the wiring;

forming an organic insulating film on the inorganic insulating film, wherein a portion of the inorganic insulating film is exposed in the sealant region; and

forming a liquid crystal layer between the first and second substrates using a sealant, wherein the sealant contacts the inorganic insulating film in the sealant region.

19. The method of claim 18, wherein forming the inorganic insulating film includes patterning the inorganic insulating, film.

20. The method of claim 18, wherein a portion of the first substrate is exposed between the wiring in the sealant region.

21. The method of claim 18, wherein forming the organic insulating film includes forming an organic insulating film that overlaps a portion of the sealant region.

22. The method of claim 21, further comprising forming a dummy pattern between the inorganic insulating film and the organic insulating film.

23. The method of claim 22, wherein the dummy pattern overlaps the sealant region and includes metal.

24. The method of claim 22, wherein forming a dummy pattern includes forming a semiconductor layer underneath the dummy pattern.

25. The method of claim 18, further comprising forming a dummy protective pattern on the organic insulating film in a region where the organic insulating film overlaps the sealant region.

26. The method of claim 25, wherein forming a dummy protective pattern includes forming a transparent conductive layer.

27. The method of claim 18, further comprising forming a second inorganic insulating film between the inorganic insulating film and the organic insulating film.

28. The method of claim 27, wherein the second insulating film has a substantially similar shape to the organic insulating film.

29. The method of claim 18, wherein forming the wiring includes:

forming a gate line in the liquid crystal region, a gate pad lower electrode in the outer region, and a gate link connecting the gate line to the gate pad lower electrode across the sealant region;

exposing the gate pad lower electrode when patterning the inorganic insulating film; and

forming a gate pad upper electrode connected to the exposed gate pad lower electrode.

30. The method of claim 29, wherein forming the wiring further includes:

forming a first common line in the liquid crystal region, a common pad lower electrode in the outer region and a common link connected to a common pad lower electrode and crossing the sealant region;

forming a second common line on the inorganic insulating film, the second common line crossing the gate line;

exposing the a portion of the common pad lower electrode, a portion of the first common line, a portion of the second common line, and a portion of the common link when patterning the insulating film; and

forming a common pad upper electrode connected to the portion of the common pad lower electrode, a first contact electrode connected to the portion of the first common electrode and the portion of the second common lines, and a second contact electrode connected to the portion of the second common line and the portion of the common link.

31. The method of claim 18, further comprising:

attaching a tape carrier package with a pad area having at least one of a gate pad and a data pad through an anisotropic conductive film; and

sealing the tape carrier package and the pad area using a second sealant.

32. The method of claim 31, wherein the second sealant surrounds a periphery of the tape carrier package.