Light emitting devices having current blocking structures and methods of fabricating light emitting devices having current blocking structures
First Claim
Patent Images
1. A light emitting device, comprising:
- an active region of semiconductor material;
a first contact on the active region, the first contact having a bond pad region thereon;
a reduced conduction region disposed in the active region beneath the bond pad region of the first contact and configured to reduce current flow through the active region in the region beneath the bond pad region of the first contact; and
a second contact electrically coupled to the active region.
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Abstract
Light emitting devices and methods of fabricating light emitting devices having a current blocking mechanism below the wire bond pad are provided. The current blocking mechanism may be a reduced conduction region in an active region of the device. The current blocking mechanism could be a damage region of a layer on which a contact is formed. The current blocking mechanism could be a Schottky contact between an ohmic contact and the active region of the device. A semiconductor junction, such as a PN junction could also be provided between the ohmic contact and the active region.
90 Citations
56 Claims
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1. A light emitting device, comprising:
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an active region of semiconductor material;
a first contact on the active region, the first contact having a bond pad region thereon;
a reduced conduction region disposed in the active region beneath the bond pad region of the first contact and configured to reduce current flow through the active region in the region beneath the bond pad region of the first contact; and
a second contact electrically coupled to the active region. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10, 11, 12)
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13. A light emitting device, comprising:
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a Group III-nitride based active region;
a first contact directly on a Group III-nitride based layer on the active region, the first contact having a first portion that makes ohmic contact to the Group III-nitride based layer and a second portion that does not make ohmic contact to the Group III-nitride based layer, the second portion corresponding to a bond pad region of the first contact; and
a second contact electrically coupled to the active region. - View Dependent Claims (14, 15, 16, 17, 18, 19, 20, 21, 22)
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23. A light emitting device, comprising:
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an active region of semiconductor material;
a Schottky contact on the active region;
a first ohmic contact on the active region and the Schottky contact, a portion of the first ohmic contact on the Schottky contact corresponding to a bond pad region of the first ohmic contact; and
a second ohmic contact electrically coupled to the active region. - View Dependent Claims (24, 25)
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26. A light emitting device, comprising:
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an active region of semiconductor material;
a first ohmic contact on the active region, a portion of the first ohmic contact directly on a region of semiconductor material of a first conductivity type and a second portion of the first ohmic contact directly on a region of semiconductor material of a second conductivity type opposite the first conductivity type, the second portion corresponding to a bond pad region of the first ohmic contact; and
a second ohmic contact electrically coupled to the active region. - View Dependent Claims (27, 28, 29, 30)
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31. A method of fabricating a light emitting device, comprising:
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forming an active region of semiconductor material;
forming a first contact on the active region, the first contact having a bond pad region thereon;
forming a reduced conduction region disposed in the active region beneath the bond pad region of the first contact and configured to block current flow through the active region in the region beneath the bond pad region of the first contact; and
forming a second contact electrically coupled to the active region. - View Dependent Claims (32, 33, 34, 35, 36, 37, 38, 39, 40, 41)
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42. A method of fabricating a light emitting device, comprising:
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forming a Group III-nitride based active region;
forming a first contact directly on a Group III-nitride based layer on the active region, the first contact having a first portion that makes ohmic contact to the Group III-nitride based layer and a second portion that does not make ohmic contact to the Group III-nitride based layer, the second portion corresponding to a bond pad region of the first contact; and
forming a second contact electrically coupled to the active region. - View Dependent Claims (43, 44, 45, 46, 47, 48)
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49. A method of fabricating a light emitting device, comprising:
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forming an active region of semiconductor material;
forming a Schottky contact on the active region;
forming a first ohmic contact on the active region and the Schottky contact, a portion of the first ohmic contact on the Schottky contact corresponding to a bond pad region of the first ohmic contact; and
forming a second ohmic contact electrically coupled to the active region. - View Dependent Claims (50, 51)
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52. A method of fabricating a light emitting device, comprising:
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forming an active region of semiconductor material;
forming a first ohmic contact on the active region, a portion of the first ohmic contact is directly on a region of semiconductor material of a first conductivity type and a second portion of the first ohmic contact is directly on a region of semiconductor material of a second conductivity type opposite the first conductivity type, the second portion corresponding to a bond pad region of the first ohmic contact; and
forming a second ohmic contact electrically coupled to the active region. - View Dependent Claims (53, 54, 55, 56)
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Specification