Semiconductor devices shared element(s) apparatus and method
First Claim
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1. A method to facilitate fabrication of at least two semiconductor devices on a shared substrate comprising:
- providing the shared substrate;
forming at least a first and second semiconductor device on the shared substrate, wherein the first and second semiconductor devices additionally share at least one integral printed device element comprised of at least one ink.
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Abstract
Two or more semiconductor devices (21 and 22) are formed on a substrate (20) and are each comprised of a plurality of printed components (23 and 24). At least one such printed component (25) is shared by both such semiconductor devices.
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Citations
25 Claims
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1. A method to facilitate fabrication of at least two semiconductor devices on a shared substrate comprising:
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providing the shared substrate;
forming at least a first and second semiconductor device on the shared substrate, wherein the first and second semiconductor devices additionally share at least one integral printed device element comprised of at least one ink. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10)
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11. An apparatus comprising:
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a substrate;
a first semiconductor device formed on the substrate and being comprised of a first plurality of printed elements comprised of at least one ink;
a second semiconductor device formed on the substrate and being comprised of a second plurality of elements, wherein at least one element of the second plurality of elements comprises an element that further comprises an element of the first plurality of printed elements. - View Dependent Claims (12, 13, 14, 15, 16, 17, 18, 19, 20)
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21. A method comprising:
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providing a printing substrate;
printing, on the printing substrate, each of;
a first plurality of elements as comprise a first semiconductor device; and
a second plurality of elements as comprise a second semiconductor device;
such that at least one element of the first plurality of elements also comprises one of the second plurality of elements. - View Dependent Claims (22, 23, 24, 25)
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Specification