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Semiconductor devices shared element(s) apparatus and method

  • US 20060003475A1
  • Filed: 06/30/2004
  • Published: 01/05/2006
  • Est. Priority Date: 06/30/2004
  • Status: Active Grant
First Claim
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1. A method to facilitate fabrication of at least two semiconductor devices on a shared substrate comprising:

  • providing the shared substrate;

    forming at least a first and second semiconductor device on the shared substrate, wherein the first and second semiconductor devices additionally share at least one integral printed device element comprised of at least one ink.

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