Devices and methods of making the same

• US 20060003485A1
• Filed: 06/30/2004
• Published: 01/05/2006
• Est. Priority Date: 06/30/2004
• Status: Abandoned Application

• Current Assignee: Hewlett-Packard Development Company, L.P. (HP Inc.)
• Original Assignee: Hewlett-Packard Development Company, L.P. (HP Inc.)
• Inventors: Hoffman, Randy L., Mardilovich, Peter P.
• Application Number:
  US10/881,344
• Publication Number:
  US 20060003485A1
• Time in Patent Office: Days
• US Class Current: 438/73
• CPC Class Codes: H01L 21/28158 Making the insulator
• CPC Class Codes: H01L 29/45 Ohmic electrodes
• CPC Class Codes: H01L 29/4908 for thin film semiconductor, e.g. gate of TFT
• CPC Class Codes: H01L 29/7869 having a semiconductor body comprising an oxide semiconductor material, e.g. zinc oxide, copper aluminium oxide, cadmium stannate

Abstract

Devices including a substantially transparent dielectric and methods of forming such devices are disclosed.

Claims

1. A method for making a substantially transparent transistor, comprising:

establishing a substantially transparent conductive layer on a substantially transparent substrate, thereby forming a gate electrode;

establishing at least one metal layer on the gate electrode;

substantially completely anodizing the at least one metal layer, thereby forming a substantially transparent gate dielectric; and

establishing a substantially transparent source, a substantially transparent drain, and a substantially transparent channel on the substantially transparent gate dielectric.

2. The method as defined in claim 1 wherein the substantially transparent conductive layer comprises a doped substantially transparent semiconductor material.

3. The method as defined in claim 2 wherein the doped substantially transparent semiconductor material comprises at least one of n-type doped indium oxide, zinc oxide, tin oxide, indium tin oxide, and mixtures thereof.

4. The method as defined in claim 1 wherein the establishing is accomplished by at least one of sputtering, chemical vapor deposition, atomic layer deposition, thermal evaporation, electron beam evaporation, inkjet deposition, and spin-coating.

5. The method as defined in claim 1 wherein the at least one metal layer comprises at least one of aluminum, tantalum, alloys thereof, and mixtures thereof.

6. The method as defined in claim 1 wherein the at least one metal layer comprises at least one aluminum layer and at least one tantalum layer.

7. The method as defined in claim 1, further comprising establishing a layer of tantalum on the substantially transparent conductive layer prior to establishing the at least one metal layer.

8. The method as defined in claim 1 wherein the substantially transparent gate dielectric is at least one of aluminum oxide and tantalum pentoxide.

9. The method as defined in claim 1, wherein at least one of the substantially transparent source, the substantially transparent drain and the substantially transparent channel comprise at least one of indium oxide, tin oxide, zinc oxide, cadmium oxide, and mixtures thereof.

10. The method as defined in claim 1 wherein the substantially transparent substrate comprises at least one of quartz, sapphire, glass, polycarbonates, polyarylates, polyethylene terephthalate, polyestersulfones, polyimides, polyolefins, polyethylene naphthalate, polyethersulfone, polynorbornene, polyetheretherketone, polyetherimide, and mixtures thereof.

11. A substantially transparent transistor made by the method as defined in claim 1.

12. A method for making a device, comprising:

establishing a substantially transparent conductive layer on a substantially transparent substrate, to form a substantially transparent electrode;

establishing a tantalum layer on the substantially transparent electrode; and

thermally oxidizing in air the tantalum layer, thereby forming a substantially transparent dielectric.

13. The method as defined in claim 12 wherein the device is a transistor, the substantially transparent electrode is a substantially transparent gate electrode, and the substantially transparent dielectric is a substantially transparent gate dielectric.

14. The method as defined in claim 13 wherein the substantially transparent gate electrode and the substantially transparent gate dielectric form a substantially transparent gate stack, and wherein the method further comprises operatively disposing the substantially transparent gate stack in the transistor.

15. The method as defined in claim 13, further comprising establishing at least one of a substantially transparent source, a substantially transparent drain, and a substantially transparent channel on the tantalum layer prior to thermally oxidizing the tantalum layer.

16. The method as defined in claim 12 wherein the device is a capacitor.

17. The method as defined in claim 16, further comprising establishing a substantially transparent capacitor electrode on the tantalum layer.

18. The method as defined in claim 17 wherein the establishing of the capacitor electrode is accomplished prior to thermally oxidizing the tantalum layer.

19. The method as defined in claim 12 wherein thermally oxidizing the tantalum layer takes place at a temperature ranging between about 300°

C. and about 600°

C.

20. The method as defined in claim 12 wherein the substantially transparent conductive layer comprises at least one of n-type doped indium oxide, zinc oxide, tin oxide, indium tin oxide, and mixtures thereof.

21. The method as defined in claim 12 wherein the substantially transparent substrate comprises at least one of quartz, sapphire, glass, polycarbonates, polyarylates, polyethylene terephthalate, polyestersulfones, polyimides, polyolefins, polyethylene naphthalate, polyethersulfone, polynorbornene, polyetheretherketone, polyetherimide, and mixtures thereof.

22. A device made by the method as defined in claim 12.

23. A method for making a device, comprising:

establishing at least one of a substantially transparent source, a substantially transparent drain, a substantially transparent channel and a substantially transparent capacitor electrode on a substantially transparent substrate;

establishing a tantalum layer in overlying relationship to the substrate and the at least one substantially transparent source, substantially transparent drain, substantially transparent channel and substantially transparent capacitor electrode;

establishing a substantially transparent conductive layer on the tantalum layer, thereby forming one of a substantially transparent electrode and a substantially transparent gate electrode;

thermally oxidizing in air the tantalum layer, thereby forming one of a substantially transparent dielectric and a substantially transparent gate dielectric, wherein the one of the substantially transparent dielectric and the substantially transparent gate dielectric; and

the one of the substantially transparent electrode and the substantially transparent gate electrode form one of a substantially transparent stack and a substantially transparent gate stack; and

operatively disposing the one of the substantially transparent stack and the substantially transparent gate stack in the device.

24. A method of making a substantially transparent transistor, comprising:

establishing a substantially transparent conductive layer on a substantially transparent substrate, thereby forming a substantially transparent gate electrode;

establishing a tantalum layer on the substantially transparent gate electrode;

thermally oxidizing the tantalum layer, thereby forming a substantially transparent gate dielectric; and

establishing a substantially transparent source, a substantially transparent drain and a substantially transparent channel on the substantially transparent gate dielectric, thereby forming the substantially transparent transistor.

25. The method as defined in claim 24 wherein thermally oxidizing the tantalum layer takes place at a temperature ranging between about 300°

C. and about 600°

C.

26. The method as defined in claim 24 wherein the substantially transparent conductive layer comprises at least one of n-type doped indium oxide, zinc oxide, tin oxide, indium tin oxide, and mixtures thereof.

27. The method as defined in claim 24 wherein the substantially transparent substrate comprises at least one of quartz, sapphire, glass, polycarbonates, polyarylates, polyethylene terephthalate, polyestersulfones, polyimides, polyolefins, polyethylene naphthalate, polyethersulfone, polynorbornene, polyetheretherketone, polyetherimide, and mixtures thereof.

28. A device, comprising:

a substantially transparent substrate;

one of a substantially transparent stack and a substantially transparent gate stack disposed on the substantially transparent substrate; and

one of a substantially transparent capacitor electrode; and

a substantially transparent source and a substantially transparent drain disposed on the one of the substantially transparent stack and the substantially transparent gate stack;

wherein the one of the substantially transparent stack and the substantially transparent gate stack includes;

one of a substantially transparent electrode and a substantially transparent gate electrode disposed on the substantially transparent substrate, the one of the substantially transparent electrode and the substantially transparent gate electrode formed from a substantially transparent conductive material; and

one of a substantially transparent dielectric and a substantially transparent gate dielectric disposed on the one of the substantially transparent electrode and the substantially transparent gate electrode, the one of the substantially transparent dielectric and the substantially transparent gate dielectric formed from at least one substantially completely anodized metal layer.

29. The device as defined in claim 28 wherein the substantially transparent conductive material comprises at least one of n-type doped indium oxide, n-type doped zinc oxide, n-type doped tin oxide, n-type doped indium tin oxide, and mixtures thereof.

30. The device as defined in claim 28 wherein the substantially transparent substrate comprises at least one of quartz, sapphire, glass, polycarbonates, polyarylates, polyethylene terephthalate, polyestersulfones, polyimides, polyolefins, polyethylene naphthalate, polyethersulfone, polynorbornene, polyetheretherketone, polyetherimide, and mixtures thereof.

31. The device as defined in claim 28 wherein the metal layer comprises at least one of aluminum, tantalum, bismuth, antimony, niobium, silver, cadmium, iron, magnesium, tin, tungsten, zinc, zirconium, titanium, copper, chromium, alloys thereof, and mixtures thereof.

32. The device as defined in claim 28 wherein the device is a capacitor.

33. The device as defined in claim 28, further comprising a substantially transparent channel disposed on the substantially transparent gate stack.

34. An electronic device, comprising:

a substantially transparent substrate;

a substantially transparent gate stack disposed on the substantially transparent substrate; and

a substantially transparent source and a substantially transparent drain disposed on the substantially transparent gate stack;

wherein the substantially transparent gate stack is formed by a method, comprising;

establishing a substantially transparent conductive layer on the substantially transparent substrate, thereby forming a substantially transparent gate electrode;

establishing a tantalum layer on the substantially transparent conductive layer; and

thermally oxidizing the tantalum layer, thereby forming a substantially transparent gate dielectric.

35. The electronic device as defined in claim 34 wherein the substantially transparent conductive layer comprises at least one of n-type doped indium oxide, zinc oxide, tin oxide, indium tin oxide, and mixtures thereof.

36. The electronic device as defined in claim 34 wherein the substantially transparent substrate comprises at least one of quartz, sapphire, glass, polycarbonates, polyarylates, polyethylene terephthalate, polyestersulfones, polyimides, polyolefins, polyethylene naphthalate, polyethersulfone, polynorbornene, polyetheretherketone, polyetherimide, and mixtures thereof.

37. The electronic device as defined in claim 34 wherein the source and the drain are established on the tantalum layer of the substantially transparent gate stack prior to thermally oxidizing the tantalum layer.

38. The electronic device as defined in claim 34 wherein the source and the drain are established on the tantalum layer subsequent to thermally oxidizing the tantalum layer.

39. The electronic device as defined in claim 34 wherein thermally oxidizing the tantalum layer takes place at a temperature ranging between about 300°

C. and about 600°

C.

40. An electronic device, comprising:

a substantially transparent substrate;

a substantially transparent source and a substantially transparent drain disposed on the substantially transparent substrate; and

a substantially transparent gate stack disposed in overlying relationship to the substantially transparent substrate and the source and drain;

wherein the substantially transparent gate stack is formed by a method, comprising;

establishing a tantalum layer in overlying relationship to the substrate and the source and drain;

establishing a substantially transparent conductive layer on the tantalum layer, thereby forming a substantially transparent gate electrode; and

thermally oxidizing in air the tantalum layer, thereby forming a substantially transparent gate dielectric, wherein the substantially transparent gate dielectric and the substantially transparent gate electrode form the substantially transparent gate stack.

41. A thin film substantially transparent transistor, comprising:

a substantially transparent substrate;

a substantially transparent gate electrode disposed on the substantially transparent substrate, the substantially transparent gate electrode formed from a substantially transparent conductive material;

a substantially transparent gate dielectric disposed on the substantially transparent gate electrode, the substantially transparent gate dielectric formed from at least one completely anodized metal layer; and

a substantially transparent source and a substantially transparent drain disposed on the substantially transparent gate dielectric.

42. The transistor as defined in claim 41 wherein the substantially transparent conductive material comprises at least one of indium oxide, zinc oxide, tin oxide, indium tin oxide, and mixtures thereof.

43. The transistor as defined in claim 41 wherein the at least one completely anodized metal layer comprises one of aluminum oxide and tantalum pentoxide.

44. The transistor as defined in claim 41, further comprising a thin tantalum layer between the substantially transparent gate electrode and the substantially transparent gate dielectric, the thin tantalum layer having a thickness ranging between about 1 nm and about 50 nm.

45. The transistor as defined in claim 41, further comprising a substantially transparent channel disposed on the substantially transparent gate dielectric.

46. The transistor as defined in claim 41 wherein the substantially transparent substrate comprises at least one of quartz, sapphire, glass, polycarbonates, polyarylates, polyethylene terephthalate, polyestersulfones, polyimides, polyolefins, polyethylene naphthalate, polyethersulfone, polynorbornene, polyetheretherketone, polyetherimide, and mixtures thereof.

47. A method for making a substantially transparent electronic device, comprising:

establishing a substantially transparent conductive layer on a substantially transparent substrate, thereby forming one of a substantially transparent electrode and a substantially transparent gate electrode;

establishing at least one metal layer on the one of the substantially transparent electrode and the substantially transparent gate electrode;

forming one of a substantially transparent dielectric and a substantially transparent gate dielectric from the at least one metal layer by one of substantially complete anodization and thermal oxidation; and

establishing at least one of a substantially transparent capacitor electrode, a substantially transparent source, a substantially transparent drain and a substantially transparent channel on the one of the substantially transparent dielectric and the substantially transparent gate dielectric, thereby forming the substantially transparent electronic device.

48. The method as defined in claim 47 wherein the electronic device is one of a transistor and a capacitor.

49. The method as defined in claim 47, further comprising establishing a tantalum layer on the substantially transparent conductive layer prior to forming the one of the substantially transparent dielectric and the substantially transparent gate dielectric.

50. A method for making a substantially transparent electronic device, comprising:

establishing a substantially transparent conductive layer on a substantially transparent substrate, thereby forming one of a substantially transparent electrode and a substantially transparent gate electrode;

step for forming one of a substantially transparent dielectric and a substantially transparent gate dielectric on the one of the substantially transparent electrode and the substantially transparent gate electrode; and

establishing at least one of a substantially transparent capacitor electrode, a substantially transparent source, a substantially transparent drain and a substantially transparent channel on the one of the substantially transparent dielectric and the substantially transparent gate dielectric, thereby forming the substantially transparent electronic device.

51. A method of using a substantially transparent gate stack, comprising:

establishing a substantially transparent source and a substantially transparent drain on the substantially transparent gate stack, the substantially transparent gate stack including a substantially transparent substrate, a substantially transparent gate electrode disposed on the substantially transparent substrate, and a substantially transparent gate dielectric disposed on the substantially transparent gate electrode, the substantially transparent gate dielectric formed from one of substantially complete anodization of a metal layer and thermal oxidation of a metal layer; and

operatively disposing the substantially transparent gate stack having the source and drain disposed thereon in an electronic device.

52. A method for making a device, comprising:

establishing a substantially transparent conductive layer on a substantially transparent substrate, to form a substantially transparent electrode;

establishing a metal layer on the substantially transparent electrode; and

substantially completely anodizing the metal layer, thereby forming a substantially transparent dielectric.

53. The method as defined in claim 52 wherein the metal layer comprises at least one of aluminum, tantalum, alloys thereof, and mixtures thereof.

54. The method as defined in claim 52 wherein the device is a transistor, the substantially transparent electrode is a substantially transparent gate electrode, and the substantially transparent dielectric is a substantially transparent gate dielectric.

55. The method as defined in claim 54 wherein the substantially transparent gate electrode and the substantially transparent gate dielectric form a substantially transparent gate stack, and wherein the method further comprises operatively disposing the substantially transparent gate stack in the transistor.

56. The method as defined in claim 54 wherein the substantially transparent gate dielectric is at least one of aluminum oxide and tantalum pentoxide.

57. A device, comprising:

a substantially transparent substrate;

a substantially transparent electrode on the substantially transparent substrate; and

a substantially transparent dielectric formed of a substantially completely anodized metal layer on the substantially transparent electrode.

58. The device as defined in claim 57 wherein the substantially completely anodized metal layer comprises at least one of aluminum oxide and tantalum pentoxide.

59. The device as defined in claim 57 wherein the substantially transparent dielectric is a substantially transparent gate dielectric and wherein the device further comprises at least one of a substantially transparent source, a substantially transparent drain, and a substantially transparent channel on the substantially transparent gate dielectric.

60. The device as defined in claim 57, further comprising a capacitor electrode on the substantially transparent dielectric.

61. A device, comprising:

a substantially transparent substrate;

a substantially transparent electrode on the substantially transparent substrate; and

a substantially transparent dielectric formed of thermally oxidized tantalum on the substantially transparent electrode.

62. The device as defined in claim 61, wherein the device is a transistor, the substantially transparent dielectric is a substantially transparent gate dielectric, and wherein the device further comprises a transparent source and drain on the substantially transparent gate dielectric.

63. The device as defined in claim 62 wherein the source and the drain are established on the substantially transparent gate dielectric prior to thermally oxidizing the tantalum.

64. The device as defined in claim 62 wherein the source and the drain are established on the substantially transparent gate dielectric subsequent to thermally oxidizing the tantalum.